CN102446909B - 发光二极管组合 - Google Patents
发光二极管组合 Download PDFInfo
- Publication number
- CN102446909B CN102446909B CN201010297709.4A CN201010297709A CN102446909B CN 102446909 B CN102446909 B CN 102446909B CN 201010297709 A CN201010297709 A CN 201010297709A CN 102446909 B CN102446909 B CN 102446909B
- Authority
- CN
- China
- Prior art keywords
- pin
- emitting diode
- luminous element
- draw
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000004020 luminiscence type Methods 0.000 claims description 26
- 238000009434 installation Methods 0.000 description 5
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
发光体 | 10 |
发光体 | 10a |
发光体 | 10b |
发光二极管 | 10c |
连接座 | 10d |
基座 | 20 |
基座 | 20c |
底座 | 20d |
侧壁 | 22 |
第一引脚 | 30 |
第一引脚 | 30a |
第一引脚 | 30b |
第一引脚 | 30c |
第一引脚 | 30d |
接线部 | 32 |
接线部 | 32d |
连接部 | 34 |
连接部 | 34c |
卡榫 | 330 |
卡榫 | 330a |
卡槽 | 340 |
卡槽 | 340b |
卡槽 | 340d |
扣持部 | 36 |
扣持部 | 36c |
扣持部 | 36d |
第二引脚 | 40 |
第二引脚 | 40a |
第二引脚 | 40b |
第二引脚 | 40c |
第二引脚 | 40d |
接线部 | 42 |
接线部 | 42d |
连接部 | 44 |
连接部 | 44c |
连接部 | 44d |
卡槽 | 430 |
卡槽 | 430b |
卡榫 | 440 |
卡榫 | 440a |
卡榫 | 440c |
卡榫 | 440d |
扣持部 | 46 |
扣持部 | 46c |
扣持部 | 46d |
发光芯片 | 50 |
发光芯片 | 50c |
封装体 | 60 |
金线 | 70 |
第三引脚 | 80 |
卡榫 | 830 |
卡榫 | 830a |
卡槽 | 840 |
卡槽 | 840b |
第四引脚 | 90 |
卡槽 | 930 |
卡槽 | 930b |
卡榫 | 940 |
卡榫 | 940a |
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010297709.4A CN102446909B (zh) | 2010-09-30 | 2010-09-30 | 发光二极管组合 |
US13/162,581 US8624389B2 (en) | 2010-09-30 | 2011-06-17 | Light emitting diode module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010297709.4A CN102446909B (zh) | 2010-09-30 | 2010-09-30 | 发光二极管组合 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102446909A CN102446909A (zh) | 2012-05-09 |
CN102446909B true CN102446909B (zh) | 2015-03-11 |
Family
ID=45889044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010297709.4A Expired - Fee Related CN102446909B (zh) | 2010-09-30 | 2010-09-30 | 发光二极管组合 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8624389B2 (zh) |
CN (1) | CN102446909B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013026510A (ja) * | 2011-07-22 | 2013-02-04 | Rohm Co Ltd | Ledモジュールおよびledモジュールの実装構造 |
GB2538059A (en) * | 2015-04-28 | 2016-11-09 | Litecool Ltd | An LED package and array |
CN105514050A (zh) * | 2016-02-03 | 2016-04-20 | 泰州优宾晶圆科技有限公司 | 一种tvs二极管 |
US9947635B1 (en) | 2016-10-14 | 2018-04-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor package, interposer and semiconductor process for manufacturing the same |
CN109148669B (zh) * | 2018-08-17 | 2020-07-31 | 厦门多彩光电子科技有限公司 | 一种模块化灯丝的生产方法及led灯丝 |
JP7307874B2 (ja) * | 2019-04-26 | 2023-07-13 | 日亜化学工業株式会社 | 発光装置及び発光モジュール |
CN110429080B (zh) * | 2019-08-12 | 2021-01-12 | 厦门多彩光电子科技有限公司 | 一种Mini LED的封装方法和Mini LED |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3134330U (ja) * | 2006-10-25 | 2007-08-09 | 凱鼎科技股▲ふん▼有限公司 | 輝度が改良されるsmdダイオードホルダ構造およびそのパッケージ |
CN201122597Y (zh) * | 2007-09-30 | 2008-09-24 | 宏齐科技股份有限公司 | 具有厚导脚的发光二极管芯片封装结构 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4255749A (en) * | 1979-12-26 | 1981-03-10 | Henry Gary G | Apparatus for converting code signal to visual display |
US5035063A (en) * | 1990-10-09 | 1991-07-30 | Wang Shu F | Ruler for measuring shape |
US5785418A (en) * | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
DE10129388B4 (de) * | 2001-06-20 | 2008-01-10 | Infineon Technologies Ag | Verfahren zur Herstellung eines elektronischen Bauteils |
US7572027B2 (en) * | 2005-09-15 | 2009-08-11 | Integrated Illumination Systems, Inc. | Interconnection arrangement having mortise and tenon connection features |
JP4920330B2 (ja) * | 2006-07-18 | 2012-04-18 | ソニー株式会社 | 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法 |
TWI337409B (en) * | 2007-01-31 | 2011-02-11 | Harvatek Corp | Led chip package structure with thickness guiding pin |
US8454195B2 (en) * | 2009-09-18 | 2013-06-04 | Luxingtek, Ltd. | Lighting device, lighting panel and circuit board thereof |
KR101662038B1 (ko) * | 2010-05-07 | 2016-10-05 | 삼성전자 주식회사 | 칩 패키지 |
-
2010
- 2010-09-30 CN CN201010297709.4A patent/CN102446909B/zh not_active Expired - Fee Related
-
2011
- 2011-06-17 US US13/162,581 patent/US8624389B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3134330U (ja) * | 2006-10-25 | 2007-08-09 | 凱鼎科技股▲ふん▼有限公司 | 輝度が改良されるsmdダイオードホルダ構造およびそのパッケージ |
CN201122597Y (zh) * | 2007-09-30 | 2008-09-24 | 宏齐科技股份有限公司 | 具有厚导脚的发光二极管芯片封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN102446909A (zh) | 2012-05-09 |
US20120080696A1 (en) | 2012-04-05 |
US8624389B2 (en) | 2014-01-07 |
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ASS | Succession or assignment of patent right |
Owner name: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: ZHANJING TECHNOLOGY (SHENZHEN) CO., LTD. Effective date: 20150209 Free format text: FORMER OWNER: ADVANCED OPTOELECTRONIC TECHNOLOGY INC. Effective date: 20150209 |
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C14 | Grant of patent or utility model | ||
C41 | Transfer of patent application or patent right or utility model | ||
GR01 | Patent grant | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150209 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Street tabulaeformis Industrial Zone tenth east two Ring Road No. two Applicant before: Zhanjing Technology (Shenzhen) Co., Ltd. Applicant before: Advanced Optoelectronic Technology Inc. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 Termination date: 20160930 |
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CF01 | Termination of patent right due to non-payment of annual fee |