JP2011238928A5 - - Google Patents

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Publication number
JP2011238928A5
JP2011238928A5 JP2011104442A JP2011104442A JP2011238928A5 JP 2011238928 A5 JP2011238928 A5 JP 2011238928A5 JP 2011104442 A JP2011104442 A JP 2011104442A JP 2011104442 A JP2011104442 A JP 2011104442A JP 2011238928 A5 JP2011238928 A5 JP 2011238928A5
Authority
JP
Japan
Prior art keywords
terminal
chip
chip package
light emitting
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011104442A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011238928A (ja
Filing date
Publication date
Priority claimed from KR1020100043171A external-priority patent/KR101662038B1/ko
Application filed filed Critical
Publication of JP2011238928A publication Critical patent/JP2011238928A/ja
Publication of JP2011238928A5 publication Critical patent/JP2011238928A5/ja
Pending legal-status Critical Current

Links

JP2011104442A 2010-05-07 2011-05-09 チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置 Pending JP2011238928A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100043171A KR101662038B1 (ko) 2010-05-07 2010-05-07 칩 패키지
KR10-2010-0043171 2010-05-07

Publications (2)

Publication Number Publication Date
JP2011238928A JP2011238928A (ja) 2011-11-24
JP2011238928A5 true JP2011238928A5 (enExample) 2014-06-26

Family

ID=44318140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011104442A Pending JP2011238928A (ja) 2010-05-07 2011-05-09 チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置

Country Status (6)

Country Link
US (1) US8455889B2 (enExample)
EP (1) EP2385549B1 (enExample)
JP (1) JP2011238928A (enExample)
KR (1) KR101662038B1 (enExample)
CN (1) CN102237485B (enExample)
TW (1) TWI596727B (enExample)

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CN102446909B (zh) * 2010-09-30 2015-03-11 赛恩倍吉科技顾问（深圳）有限公司 发光二极管组合
US8878215B2 (en) * 2011-06-22 2014-11-04 Lg Innotek Co., Ltd. Light emitting device module
US8853726B2 (en) * 2011-08-25 2014-10-07 Lg Innotek Co., Ltd. Light emitting device package and lighting system having the same
US20150001570A1 (en) * 2011-09-02 2015-01-01 King Dragon International Inc. LED Package and Method of the Same
US9117941B2 (en) * 2011-09-02 2015-08-25 King Dragon International Inc. LED package and method of the same
DE102011056708A1 (de) * 2011-12-20 2013-06-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Leiterrahmenverbund und optoelektronisches Halbleiterbauteil
KR20140020446A (ko) * 2012-08-08 2014-02-19 삼성디스플레이 주식회사 백라이트 어셈블리 및 이를 갖는 표시 장치
WO2014115064A1 (en) * 2013-01-25 2014-07-31 Koninklijke Philips N.V. Lighting assembly and method for manufacturing a lighting assembly
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
TWI511339B (zh) * 2013-02-06 2015-12-01 Lite On Electronics Guangzhou 發光二極體封裝件及其導線架
CN103208717B (zh) * 2013-04-10 2015-08-05 大族激光科技产业集团股份有限公司 半导体单芯管的转接装置
CN104103748B (zh) * 2013-04-10 2016-12-07 重庆市路迪机械厂 发光二极管封装结构及其制造方法
JP6303738B2 (ja) 2013-04-12 2018-04-04 日亜化学工業株式会社 発光装置
CN103354266B (zh) * 2013-07-11 2015-12-23 江阴长电先进封装有限公司 一种薄型圆片级led的封装结构及其封装方法
US9166131B2 (en) * 2013-07-17 2015-10-20 Tai-Yin Huang Composite LED package and its application to light tubes
DE102014110614A1 (de) * 2014-07-28 2016-01-28 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
TWI649900B (zh) * 2015-02-04 2019-02-01 億光電子工業股份有限公司 Ｌｅｄ封裝結構及其製造方法
CN104752587B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
CN104779335B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
JP6592974B2 (ja) * 2015-06-08 2019-10-23 ウシオ電機株式会社 光源装置
TWI587548B (zh) * 2015-09-07 2017-06-11 隆達電子股份有限公司 發光二極體封裝件
KR102261288B1 (ko) 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
JP6823262B2 (ja) 2017-03-15 2021-02-03 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール
DE102018124471B3 (de) * 2018-10-04 2019-12-05 Ledvance Gmbh Verfahren zum Herstellen eines Leadframes für eine Röhrenlampe, Leadframe und Röhrenlampe
CN111744026B (zh) * 2019-03-29 2023-08-18 东芝照明技术株式会社 紫外线放射装置以及照明装置
DE102020107409B4 (de) 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement

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JP2010007750A (ja) * 2008-06-26 2010-01-14 Univance Corp 油圧式動力伝達装置
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KR101010375B1 (ko) 2008-08-06 2011-01-21 주식회사 동부하이텍 이미지센서 및 그 제조방법
CN101364585B (zh) * 2008-09-25 2010-10-13 旭丽电子(广州)有限公司 一种芯片封装结构及其制造方法
JP2011146611A (ja) * 2010-01-18 2011-07-28 Stanley Electric Co Ltd 発光素子パッケージ、及びこれを用いた線状発光装置、面状発光装置

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