JP2011167768A - レーザクラッディング装置及び方法 - Google Patents
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Abstract
【解決手段】レーザクラッディングシステム(102)は、基板上の局所的な点を加熱して溶融プールを形成し、そこに材料を供給して、物理的寸法をもつ付着物を形成することにより、基板上に材料の蓄積体を形成するのに使用される。穴付きマスクを通して光を受け取るオプトエレクトリックセンサに接続された光学検出手段を使用して、付着物の物理的寸法を監視し、そしてフィードバックコントローラ(104)は、電気信号に基づいてレーザを調整し、材料付着率を制御する。
【選択図】図1
Description
特定の装置については、光学検出手段は、好ましくは、穴付きマスクを備え、付着物からの光がそれを通してオプトエレクトリックセンサへ到達し、そしてフィードバックコントローラは、付着物からの光の有無に基づいてレーザを調整する回路を備えている。
この調査に対し、クロミウム−モリブデンの高温加工ダイスチールH13を、加工されたH13基板上に直接付着した。ダイキャスティングに通常使用されるこの合金は、ダイキャストツールを迅速に製造する上で潜在的に著しく有用であることから分析した。DMD及び加工品H13の両方に対する熱処理の比較を次の領域で行った。1)「クラッドとしての」硬度、延性及びマイクロ構造、2)初期の焼戻し応答、及び3)オーステナイト処理された(1010℃で)オイル焼入れ材料に対する焼戻し応答。
三次元コンポーネントを製造する能力を実証するためのこのプロセスの成功にとって、残留ストレス及びそれにより生じる歪を管理することが重要なファクタである。残留ストレスの蓄積は、工具鋼コンポーネントの製造中にクラックを生じる最大の原因である。ストレスの発生を理解するために、層当たりのストレス蓄積を推定するためのサンプルを設計した。これは、残留ストレスの蓄積によりクラックを生じ得る前に多数の層を蓄積するための戦略となった。所定数の層を付着した後、それ以上の層を付着する前にストレスの緩和を実行した。この戦略は、図11に示すような全サイズのIMS−T1コンポーネントの製造を成功に至らせた。これは、直接金属付着によりH13工具鋼でこのIMS−T1テスト設計を初めて製造したものであると考えられる。
NSF T1サンプル
材料: H13粉末
レーザ電力: 〜100W
付着率: 〜5グラム/分
スライス厚み: 0.01インチ
実際のレーザ作動処理時間: 50時間
全処理時間: 〜100時間
ストレス緩和時間: 〜24時間(6x4時間)
合計時間: 〜124時間
Claims (23)
- 基板上の材料の蓄積を自動的に制御するシステムにおいて、
基板の局所的領域にビームを指向して溶融プールを形成する制御可能なレーザと、
溶融プールに材料を供給して、物理的な属性を有する付着物を形成するための手段と、
オプトエレクトリックセンサに接続されて、物理的属性の関数として電気信号を出力するように動作する光学的検出手段と、
電気信号の関数として材料付着率を調整するように動作するフィードバックコントローラとを備えたことを特徴とするシステム。 - 上記物理的属性は、付着物のサイズである請求項1に記載のシステム。
- 上記物理的属性は、付着物の材料組成である請求項1に記載のシステム。
- 製造されるべき物品の記述を含むコンピュータ援用設計(CAD)システムへのインターフェイスを更に備え、上記フィードバックコントローラは、更に、上記物理的属性を上記記述と比較して、それに応じて材料付着率を調整するように動作する請求項1に記載のシステム。
- 上記光学的検出手段は、穴付きマスクを備え、付着物からの光がそれを通過してオプトエレクトリックセンサへ到達し、上記フィードバックコントローラは、更に、付着物からの光の有無を検出するための回路を含む請求項1に記載のシステム。
- 上記光学検出手段は、付着物の材料組成を決定するための検出器に光学的に接続された分散素子を含む請求項1に記載のシステム。
- 基板上の材料の量を変更するのに使用するための自動レーザクラッディングシステムにおいて、
ビームを出力するレーザであって、基板の局所的領域にビームを収束する手段を含み、少なくとも上記局所的領域内で基板を溶融するに充分な電力のエネルギーを有するレーザと、
ビーム及び基板を互いに相対的に移動する手段と、
上記局所的領域に蓄積されるべき材料を供給する手段と、
上記材料の物理的特性を感知し、そしてその物理的特性に基づいて材料付着率を調整するように動作するフィードバック制御手段とを備えたことを特徴とするシステム。 - 上記フィードバック制御手段は、ビームの電力を調整して、材料付着率を調整する請求項7に記載のシステム。
- 上記フィードバック制御手段は、ビームのスポットサイズを調整して、材料付着率を調整する請求項7に記載のシステム。
- 上記フィードバック制御手段は、材料供給率を調整して、材料付着率を調整する請求項7に記載のシステム。
- 上記フィードバック制御手段は、ビームと基板との間の移動速度を調整して、材料付着率を調整する請求項7に記載のシステム。
- 材料の物理的特性は、基板上の材料の高さである請求項7に記載のシステム。
- 材料の物理的特性は、溶融プールの化学的組成である請求項7に記載のシステム。
- 製造されるべき部品の記述を含むコンピュータ援用設計(CAD)システムへのインターフェイスを更に備え、上記フィードバック制御手段は、更に、上記物理的特性を上記記述と比較して、それに応じて材料付着率を調整するように動作する請求項7に記載のシステム。
- 物品を自動的に製造するシステムにおいて、
製造されるべき物品の記述を含むコンピュータ援用設計データベースと、
基板を支持するためのワークテーブルと、
基板の局所的領域にビームを指向して溶融プールを形成する制御可能なレーザと、
上記レーザに接続され、溶融プールに材料を供給して、物理的寸法を有する付着物を形成するための手段と、
上記レーザ及び供給手段に対して基板を移動するための並進移動手段と、
付着物が形成されるときにその物理的寸法を表す電気信号を出力するよう動作する光学的検出手段と、
上記並進移動手段及びレーザに作動的にインターフェイスされ、上記コンピュータ援用設計データベースにある製造されるべき物品の記述に基づいて付着物の物理的寸法を調整するフィードバックコントローラとを備えたことを特徴とするシステム。 - 上記並進移動手段は、レーザ及び供給手段が固定されたままである間にワークテーブルを移動する請求項15に記載のシステム。
- 上記並進移動手段は、ワークテーブルが固定されたままである間にレーザ及び供給手段を移動する請求項15に記載のシステム。
- 上記基板及び粉末が金属性である請求項15に記載のシステム。
- 上記光学検出手段は、穴付きマスクを備え、付着物からの光がそこを通過してオプトエレクトリックセンサへ到達する請求項15に記載のシステム。
- 物品を製造する方法において、
a)製造されるべき物品の記述を用意し、
b)物品を製造すべき基板を用意し、
c)基板の局所的領域を加熱して、溶融プールを形成し、
d)溶融プールに材料を供給して、ある物理的寸法を有する付着物を形成し、
e)付着物の物理的寸法を光学的に監視し、
f)製造されるべき物品の記述に基づいて物理的寸法を制御し、
g)基板の異なる局所的領域へ進み、そして
h)物品の製造が完了するまで上記段階c)ないしd)を繰り返すことを特徴とする方法。 - 上記段階g)は、レーザ及び供給手段が固定のままである間にワークテーブルを移動することを含む請求項20に記載の方法。
- 上記段階g)は、ワークテーブルが固定のままである間にレーザ及び供給手段を移動することを含む請求項20に記載の方法。
- 基板及び粉末は金属性である請求項20に記載の方法。
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WO2000000921A9 (en) | 2000-05-25 |
RU2228243C2 (ru) | 2004-05-10 |
JP2002519200A (ja) | 2002-07-02 |
AU4704999A (en) | 2000-01-17 |
BRPI9912231B1 (pt) | 2015-12-08 |
KR20010078755A (ko) | 2001-08-21 |
EP1099184B1 (en) | 2014-01-22 |
BR9912231A (pt) | 2002-01-29 |
CN1205582C (zh) | 2005-06-08 |
ES2459601T3 (es) | 2014-05-09 |
EP1099184A1 (en) | 2001-05-16 |
EP1099184A4 (en) | 2009-04-08 |
AU754346B2 (en) | 2002-11-14 |
CA2336583C (en) | 2008-05-06 |
NO20006700D0 (no) | 2000-12-29 |
CN1315022A (zh) | 2001-09-26 |
US6122564A (en) | 2000-09-19 |
WO2000000921A1 (en) | 2000-01-06 |
KR100606476B1 (ko) | 2006-08-01 |
NO20006700L (no) | 2001-02-27 |
CA2336583A1 (en) | 2000-01-06 |
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