JP2011161521A5 - - Google Patents
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- JP2011161521A5 JP2011161521A5 JP2010023502A JP2010023502A JP2011161521A5 JP 2011161521 A5 JP2011161521 A5 JP 2011161521A5 JP 2010023502 A JP2010023502 A JP 2010023502A JP 2010023502 A JP2010023502 A JP 2010023502A JP 2011161521 A5 JP2011161521 A5 JP 2011161521A5
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010023502A JP5083339B2 (ja) | 2010-02-04 | 2010-02-04 | 基板搬送装置及び基板搬送方法並びに記憶媒体 |
| TW099142821A TW201133687A (en) | 2010-02-04 | 2010-12-08 | Substrate transfer apparatus, substrate transfer method and storage medium |
| KR1020100125400A KR20110090753A (ko) | 2010-02-04 | 2010-12-09 | 기판 반송 장치 및 기판 반송 방법과 기억 매체 |
| US13/014,143 US20110190927A1 (en) | 2010-02-04 | 2011-01-26 | Substrate carrying device, substrate carrying method and storage medium |
| CN201110035364XA CN102163571A (zh) | 2010-02-04 | 2011-01-31 | 基板输送装置和基板输送方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010023502A JP5083339B2 (ja) | 2010-02-04 | 2010-02-04 | 基板搬送装置及び基板搬送方法並びに記憶媒体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011161521A JP2011161521A (ja) | 2011-08-25 |
| JP2011161521A5 true JP2011161521A5 (enExample) | 2012-03-08 |
| JP5083339B2 JP5083339B2 (ja) | 2012-11-28 |
Family
ID=44342330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010023502A Expired - Fee Related JP5083339B2 (ja) | 2010-02-04 | 2010-02-04 | 基板搬送装置及び基板搬送方法並びに記憶媒体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110190927A1 (enExample) |
| JP (1) | JP5083339B2 (enExample) |
| KR (1) | KR20110090753A (enExample) |
| CN (1) | CN102163571A (enExample) |
| TW (1) | TW201133687A (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5566669B2 (ja) * | 2009-11-19 | 2014-08-06 | 昭和電工株式会社 | インライン式成膜装置及び磁気記録媒体の製造方法 |
| JP5609856B2 (ja) * | 2011-12-20 | 2014-10-22 | 株式会社安川電機 | 搬送ロボット |
| CN102569142B (zh) * | 2012-02-03 | 2017-04-26 | 上海华虹宏力半导体制造有限公司 | 硅片转移装置、转移托环、半导体工艺反应设备 |
| JP5884624B2 (ja) * | 2012-05-02 | 2016-03-15 | 東京エレクトロン株式会社 | 基板処理装置、調整方法及び記憶媒体 |
| KR102098596B1 (ko) * | 2013-01-11 | 2020-04-09 | 삼성디스플레이 주식회사 | 기판 이송 장치 및 그 구동 방법 |
| US9349643B2 (en) * | 2013-04-01 | 2016-05-24 | Brewer Science Inc. | Apparatus and method for thin wafer transfer |
| JP6190692B2 (ja) * | 2013-10-22 | 2017-08-30 | 日本電産サンキョー株式会社 | 産業用ロボット |
| WO2016129102A1 (ja) * | 2015-02-13 | 2016-08-18 | 川崎重工業株式会社 | 基板搬送ロボットおよびその運転方法 |
| CA2981800C (en) * | 2015-04-13 | 2023-09-26 | Henrik Falk | A lifting jig for lifting elements along the facade of a building |
| WO2017116709A1 (en) * | 2015-12-30 | 2017-07-06 | Mattson Technology, Inc. | Substrate support in a millisecond anneal system |
| JP6671993B2 (ja) | 2016-02-01 | 2020-03-25 | 東京エレクトロン株式会社 | 基板受け渡し位置の教示方法及び基板処理システム |
| KR102105580B1 (ko) * | 2016-03-04 | 2020-04-29 | 카와사키 주코교 카부시키 카이샤 | 기판 반송 장치 및 기판 반송 로봇의 교시 방법 |
| JP2017183665A (ja) * | 2016-03-31 | 2017-10-05 | 芝浦メカトロニクス株式会社 | 基板搬送装置、基板処理装置及び基板処理方法 |
| US10115687B2 (en) * | 2017-02-03 | 2018-10-30 | Applied Materials, Inc. | Method of pattern placement correction |
| JP6440757B2 (ja) * | 2017-03-16 | 2018-12-19 | キヤノン株式会社 | 基板搬送システム、リソグラフィ装置、および物品の製造方法 |
| CN106826927B (zh) * | 2017-03-28 | 2019-09-13 | 芯导精密(北京)设备有限公司 | 一种半导体机械手机架 |
| JP6789384B2 (ja) * | 2017-04-06 | 2020-11-25 | 東京エレクトロン株式会社 | 基板処理装置および基板搬送方法 |
| TWI622777B (zh) * | 2017-07-07 | 2018-05-01 | Electronic component picking test classification equipment | |
| CN109273391B (zh) * | 2017-07-17 | 2021-10-26 | 台湾积体电路制造股份有限公司 | 晶圆传递模块及传递晶圆的方法 |
| JP7064885B2 (ja) * | 2018-01-05 | 2022-05-11 | 東京エレクトロン株式会社 | 基板把持機構、基板搬送装置及び基板処理システム |
| WO2020117201A1 (en) * | 2018-12-03 | 2020-06-11 | Lam Research Corporation | Pin-lifter test substrate |
| CN114446843B (zh) * | 2020-11-02 | 2025-05-27 | 上海华力集成电路制造有限公司 | 晶圆传送模块及其传送预传送的晶圆的方法 |
| JP7607395B2 (ja) * | 2020-12-09 | 2024-12-27 | 川崎重工業株式会社 | 基板搬送ロボット |
| KR102721980B1 (ko) | 2022-02-24 | 2024-10-25 | 삼성전자주식회사 | 기판 정렬 장치 및 이를 이용한 기판 정렬 방법 |
| KR102767876B1 (ko) * | 2022-10-27 | 2025-02-19 | 세메스 주식회사 | 티칭 방법, 티칭 방법을 실행하는 매체에 저장된 프로그램 및 반송 시스템 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60153788U (ja) * | 1984-03-21 | 1985-10-14 | シャープ株式会社 | 位置検知センサ付ロボツトハンド |
| JP2920454B2 (ja) * | 1993-06-10 | 1999-07-19 | 東京エレクトロン株式会社 | 処理装置 |
| US6330052B1 (en) * | 1997-06-13 | 2001-12-11 | Canon Kabushiki Kaisha | Exposure apparatus and its control method, stage apparatus, and device manufacturing method |
| TW432580B (en) * | 1998-09-29 | 2001-05-01 | Applied Materials Inc | Piezoelectric method and apparatus for semiconductor wafer detection |
| US6546307B1 (en) * | 1999-08-20 | 2003-04-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system |
| US6753498B2 (en) * | 2000-07-20 | 2004-06-22 | Tokyo Electron Limited | Automated electrode replacement apparatus for a plasma processing system |
| JP4055200B2 (ja) * | 2002-03-15 | 2008-03-05 | 株式会社安川電機 | 基板搬送用フォーク |
| KR101015778B1 (ko) * | 2003-06-03 | 2011-02-22 | 도쿄엘렉트론가부시키가이샤 | 기판 처리장치 및 기판 수수 위치의 조정 방법 |
| JP4403841B2 (ja) * | 2004-03-19 | 2010-01-27 | 株式会社安川電機 | ウェハ有無検出装置およびこれを用いた搬送ロボット装置 |
| JP4809594B2 (ja) * | 2004-08-02 | 2011-11-09 | 東京エレクトロン株式会社 | 検査装置 |
| US7680559B2 (en) * | 2005-02-08 | 2010-03-16 | Lam Research Corporation | Wafer movement control macros |
| JP4535499B2 (ja) * | 2005-04-19 | 2010-09-01 | 東京エレクトロン株式会社 | 加熱装置、塗布、現像装置及び加熱方法 |
| US7766566B2 (en) * | 2005-08-03 | 2010-08-03 | Tokyo Electron Limited | Developing treatment apparatus and developing treatment method |
| JP4684805B2 (ja) * | 2005-08-25 | 2011-05-18 | 東京エレクトロン株式会社 | プローブ装置及び被検査体とプローブとの接触圧の調整方法 |
| US8057153B2 (en) * | 2006-09-05 | 2011-11-15 | Tokyo Electron Limited | Substrate transfer device, substrate processing apparatus and substrate transfer method |
| JP5003315B2 (ja) * | 2007-07-03 | 2012-08-15 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法並びに記憶媒体 |
-
2010
- 2010-02-04 JP JP2010023502A patent/JP5083339B2/ja not_active Expired - Fee Related
- 2010-12-08 TW TW099142821A patent/TW201133687A/zh unknown
- 2010-12-09 KR KR1020100125400A patent/KR20110090753A/ko not_active Withdrawn
-
2011
- 2011-01-26 US US13/014,143 patent/US20110190927A1/en not_active Abandoned
- 2011-01-31 CN CN201110035364XA patent/CN102163571A/zh active Pending
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