JP2011153776A - 冷却装置 - Google Patents

冷却装置 Download PDF

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Publication number
JP2011153776A
JP2011153776A JP2010016409A JP2010016409A JP2011153776A JP 2011153776 A JP2011153776 A JP 2011153776A JP 2010016409 A JP2010016409 A JP 2010016409A JP 2010016409 A JP2010016409 A JP 2010016409A JP 2011153776 A JP2011153776 A JP 2011153776A
Authority
JP
Japan
Prior art keywords
heat
cooling device
heat pipe
pipe
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010016409A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011153776A5 (enExample
Inventor
Shigetoshi Ipposhi
茂俊 一法師
Tatsuro Hirose
達朗 廣瀬
Kazuo Kadowaki
一夫 門脇
Takumi Kijima
拓己 貴島
Takayuki Nakao
貴行 中尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2010016409A priority Critical patent/JP2011153776A/ja
Priority to US12/910,107 priority patent/US20110179806A1/en
Publication of JP2011153776A publication Critical patent/JP2011153776A/ja
Publication of JP2011153776A5 publication Critical patent/JP2011153776A5/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2107—Temperatures of a Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2010016409A 2010-01-28 2010-01-28 冷却装置 Pending JP2011153776A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010016409A JP2011153776A (ja) 2010-01-28 2010-01-28 冷却装置
US12/910,107 US20110179806A1 (en) 2010-01-28 2010-10-22 Cooling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010016409A JP2011153776A (ja) 2010-01-28 2010-01-28 冷却装置

Publications (2)

Publication Number Publication Date
JP2011153776A true JP2011153776A (ja) 2011-08-11
JP2011153776A5 JP2011153776A5 (enExample) 2011-12-01

Family

ID=44307906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010016409A Pending JP2011153776A (ja) 2010-01-28 2010-01-28 冷却装置

Country Status (2)

Country Link
US (1) US20110179806A1 (enExample)
JP (1) JP2011153776A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013245933A (ja) * 2012-05-28 2013-12-09 Industrial Technology Research Inst 給水機とそれに使用される熱電ヒートポンプ装置
JP2015053311A (ja) * 2013-09-05 2015-03-19 パナソニック株式会社 冷却システム
JP2017520745A (ja) * 2014-07-15 2017-07-27 フラウンホーファー−ゲゼルシャフト ツール フエルデルング デア アンゲヴァンテン フォルシュング エー．ファオ． 少なくとも一本のヒートパイプ、特に熱サイホンを有する空調装置
WO2018047537A1 (ja) * 2016-09-09 2018-03-15 株式会社デンソー 機器温調装置
KR20180043040A (ko) * 2016-10-19 2018-04-27 현대모비스 주식회사 파워모듈
WO2018105371A1 (ja) * 2016-12-07 2018-06-14 パナソニックＩｐマネジメント株式会社 熱電変換装置および印刷機
KR102001029B1 (ko) * 2018-12-28 2019-07-17 (주)동천기공 펠티에 소자를 이용한 태양광 발전 접속반 다이오드 모듈 방열 모듈
JP2021194561A (ja) * 2020-06-10 2021-12-27 ヤンマーホールディングス株式会社 冷却装置およびそれを備えた処理システム
JP2022533682A (ja) * 2020-03-12 2022-07-25 タン，シドニー 冷熱厚膜集積回路

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US20130019918A1 (en) 2011-07-18 2013-01-24 The Regents Of The University Of Michigan Thermoelectric devices, systems and methods
US10205080B2 (en) 2012-01-17 2019-02-12 Matrix Industries, Inc. Systems and methods for forming thermoelectric devices
KR20150086466A (ko) 2012-08-17 2015-07-28 실리시움 에너지, 인크. 열전 디바이스 형성 시스템 및 형성 방법
WO2014070795A1 (en) 2012-10-31 2014-05-08 Silicium Energy, Inc. Methods for forming thermoelectric elements
WO2014115839A1 (ja) * 2013-01-25 2014-07-31 古河電気工業株式会社 ヒートパイプ
CN104848588A (zh) * 2014-02-19 2015-08-19 吕海波 高温水暖空调
EP3123532B1 (en) * 2014-03-25 2018-11-21 Matrix Industries, Inc. Thermoelectric devices and systems
GB2531260B (en) * 2014-10-13 2019-08-14 Bae Systems Plc Peltier effect heat transfer system
FR3031969B1 (fr) * 2015-01-27 2017-01-27 Airbus Defence & Space Sas Satellite artificiel et procede de remplissage d'un reservoir de gaz propulsif dudit satellite artificiel
WO2016193618A1 (fr) * 2015-06-02 2016-12-08 Airbus Defence And Space Sas Satellite artificiel
TW201809931A (zh) 2016-05-03 2018-03-16 麥崔克斯工業股份有限公司 熱電裝置及系統
US11249522B2 (en) * 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
USD819627S1 (en) 2016-11-11 2018-06-05 Matrix Industries, Inc. Thermoelectric smartwatch
JP2019128465A (ja) * 2018-01-25 2019-08-01 セイコーエプソン株式会社 光源装置およびプロジェクター
US11570411B2 (en) * 2019-01-10 2023-01-31 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11191187B2 (en) * 2019-04-30 2021-11-30 Deere & Company Electronic assembly with phase-change material for thermal performance
US11496828B2 (en) 2019-09-12 2022-11-08 Apple Inc. Sensor drying pathway via capillary-induced pressure gradient
US11313625B2 (en) * 2019-12-16 2022-04-26 Yuan-Hsin Sun Intensified cassette-type heat dissipation module
CN112466981B (zh) * 2020-10-30 2022-03-11 武汉大学 一种用于高功率脉冲激光能量衰减的制冷陷阱衰减器
CN112799485A (zh) * 2020-12-31 2021-05-14 北京市鑫全盛科技有限公司 具备半导体辅助热泵的电子设备散热装置
CN112968228A (zh) * 2021-02-01 2021-06-15 徐州储盈电子科技有限公司 一种电动车锂电池散热装置
CN119790720A (zh) * 2022-08-29 2025-04-08 三星电子株式会社 包括包围多个集成电路的热管的电子装置
CN117316903B (zh) * 2023-11-28 2024-02-23 合众新能源汽车股份有限公司 一种座舱域控制器用热电半导体散热结构及车辆

Citations (10)

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Publication number Priority date Publication date Assignee Title
JPS6349184U (enExample) * 1986-09-17 1988-04-02
JPH0396259A (ja) * 1989-09-08 1991-04-22 Furukawa Electric Co Ltd:The ヒートパイプ式冷却器
JPH0459194U (enExample) * 1990-09-27 1992-05-21
JPH0563385A (ja) * 1991-08-30 1993-03-12 Hitachi Ltd ヒートパイプ付き電子機器及び計算機
JP2000228880A (ja) * 1999-02-08 2000-08-15 Toshiba Corp 電力変換装置、電力変換装置用ヒートパイプ式冷却器、及び電力変換装置用ヒートパイプ式冷却装置
JP2001332806A (ja) * 2000-03-16 2001-11-30 Konica Corp レーザ露光装置
JP2002130968A (ja) * 2000-10-20 2002-05-09 Furukawa Electric Co Ltd:The 板型ヒートパイプを備えた冷却装置およびそれを用いた冷却方法
JP2005259794A (ja) * 2004-03-09 2005-09-22 Furukawa Electric Co Ltd:The 半導体素子冷却用ヒートシンク
JP2007178043A (ja) * 2005-12-27 2007-07-12 Toshiba Corp 熱流制御システムおよびペルチェモジュール動作特性推定方法
JP2008275580A (ja) * 2007-05-02 2008-11-13 Wise Life Technology Co Ltd 熱測量システム

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JPH11121816A (ja) * 1997-10-21 1999-04-30 Morikkusu Kk 熱電モジュールユニット

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6349184U (enExample) * 1986-09-17 1988-04-02
JPH0396259A (ja) * 1989-09-08 1991-04-22 Furukawa Electric Co Ltd:The ヒートパイプ式冷却器
JPH0459194U (enExample) * 1990-09-27 1992-05-21
JPH0563385A (ja) * 1991-08-30 1993-03-12 Hitachi Ltd ヒートパイプ付き電子機器及び計算機
JP2000228880A (ja) * 1999-02-08 2000-08-15 Toshiba Corp 電力変換装置、電力変換装置用ヒートパイプ式冷却器、及び電力変換装置用ヒートパイプ式冷却装置
JP2001332806A (ja) * 2000-03-16 2001-11-30 Konica Corp レーザ露光装置
JP2002130968A (ja) * 2000-10-20 2002-05-09 Furukawa Electric Co Ltd:The 板型ヒートパイプを備えた冷却装置およびそれを用いた冷却方法
JP2005259794A (ja) * 2004-03-09 2005-09-22 Furukawa Electric Co Ltd:The 半導体素子冷却用ヒートシンク
JP2007178043A (ja) * 2005-12-27 2007-07-12 Toshiba Corp 熱流制御システムおよびペルチェモジュール動作特性推定方法
JP2008275580A (ja) * 2007-05-02 2008-11-13 Wise Life Technology Co Ltd 熱測量システム

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013245933A (ja) * 2012-05-28 2013-12-09 Industrial Technology Research Inst 給水機とそれに使用される熱電ヒートポンプ装置
TWI502158B (zh) * 2012-05-28 2015-10-01 Ind Tech Res Inst 飲水機及其所使用之熱電熱泵裝置
US9310113B2 (en) 2012-05-28 2016-04-12 Industrial Technology Research Institute Thermoelectric heat pump apparatus
JP2015053311A (ja) * 2013-09-05 2015-03-19 パナソニック株式会社 冷却システム
JP2017520745A (ja) * 2014-07-15 2017-07-27 フラウンホーファー−ゲゼルシャフト ツール フエルデルング デア アンゲヴァンテン フォルシュング エー．ファオ． 少なくとも一本のヒートパイプ、特に熱サイホンを有する空調装置
JPWO2018047537A1 (ja) * 2016-09-09 2019-02-28 株式会社デンソー 機器温調装置
WO2018047537A1 (ja) * 2016-09-09 2018-03-15 株式会社デンソー 機器温調装置
KR20180043040A (ko) * 2016-10-19 2018-04-27 현대모비스 주식회사 파워모듈
KR102552717B1 (ko) * 2016-10-19 2023-07-06 현대모비스 주식회사 파워모듈
WO2018105371A1 (ja) * 2016-12-07 2018-06-14 パナソニックＩｐマネジメント株式会社 熱電変換装置および印刷機
CN110036494A (zh) * 2016-12-07 2019-07-19 松下知识产权经营株式会社 热电变换装置和印刷机
KR102001029B1 (ko) * 2018-12-28 2019-07-17 (주)동천기공 펠티에 소자를 이용한 태양광 발전 접속반 다이오드 모듈 방열 모듈
JP2022533682A (ja) * 2020-03-12 2022-07-25 タン，シドニー 冷熱厚膜集積回路
JP7197758B2 (ja) 2020-03-12 2022-12-28 タン，シドニー 冷熱厚膜集積回路
JP2021194561A (ja) * 2020-06-10 2021-12-27 ヤンマーホールディングス株式会社 冷却装置およびそれを備えた処理システム
JP7478034B2 (ja) 2020-06-10 2024-05-02 ヤンマーホールディングス株式会社 冷却装置およびそれを備えた処理システム

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