CN102315585A - 大功率半导体激光器模块的风冷散热装置 - Google Patents
大功率半导体激光器模块的风冷散热装置 Download PDFInfo
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- CN102315585A CN102315585A CN 201110210154 CN201110210154A CN102315585A CN 102315585 A CN102315585 A CN 102315585A CN 201110210154 CN201110210154 CN 201110210154 CN 201110210154 A CN201110210154 A CN 201110210154A CN 102315585 A CN102315585 A CN 102315585A
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- heat
- heat sink
- oxygen
- free copper
- laser module
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000001816 cooling Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound 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Abstract
大功率半导体激光器模块的风冷散热装置属于半导体激光器散热领域，该该装置包括基板热沉、TEC、无氧铜热沉、热管、散热片、大风扇、小风扇和底板，所述基板热沉下固定TEC，TEC下面固定无氧铜热沉，所述热管一端固定在无氧铜热沉下，散热片以等距离固定在热管另一端，所述大风扇安装在散热片下，所述小风扇安装在无氧铜热沉下。本发明是一种无水冷、体积小、重量轻、传热效率高、控制精度高、制冷效率高、成本低、加工方便、无噪声、可以应用在功率几百瓦的激光器模块上的新型高功率半导体激光器模块风冷散热装置。
Description
大功率半导体 激光器模块的风冷散热装置
技术领域
[0001] 本发明属于半导体激光器散热领域，涉及一种大功率半导体激光器模块的风冷散热装置。
背景技术
[0002] 随着对大功率的追求，激光器的散热也变得更加困难起来。因为半导体激光器能产生很高的峰值功率，这些器件的电光转换效率为40%-50%，即所输入的电能50%-60% 都转换为热能在管芯焊接的地方产生的热流量大约为lkW/cm。这种热负载是限制激光器正常工作的关键因素。所以，如果散热问题解决得不好，就会导致激光器温度的迅速提高，而导致激光器的光学灾变。目前大功率激光器常用的散热方式大通道和微通道热沉水循环制冷，他们通过调节热沉循环管道内水流量达到温控的目的，但是这种制冷方法体积大，制冷不均勻，温度控制精度不高。以前国内使用半导体制冷结合风冷的制冷方式都是应用在功率较低的单管激光器上，而且只是使用简单的散热片和风扇的结合制冷，制冷效率低。
发明内容
[0003] 本发明提供一种大功率半导体激光器模块的风冷散热装置，其利用 TEC (Thermoelectric Cooler，半导体致冷片）、超导热管、散热片、风扇等高效的结合实现对大功率半导体激光器模块高效的散热，从而提高了激光器的热量输出，延长了激光器的使用寿命。
[0004] 大功率半导体激光器模块的风冷散热装置，包括基板热沉、TEC、无氧铜热沉、热管、散热片、大风扇、小风扇和底板，所述TEC固定在基板热沉下面，无氧铜热沉固定在TEC 下面，所述热管的一端固定在无氧铜热沉下面，散热片以等距离固定在热管的另一端，所述大风扇安装在散热片下面，所述小风扇安装在无氧铜热沉下面。
[0005] 本发明是一种无水冷、体积小、重量轻、传热效率高、控制精度高、制冷效率高、成本低、加工方便、无噪声、可以应用在功率几百瓦的激光器模块上的新型高功率半导体激光器模块风冷散热装置。
附图说明
[0006] 图1是本发明大功率半导体激光器模块的风冷散热装置的整体结构示意图。
[0007] 图2是本发明大功率半导体激光器模块的风冷散热装置的热沉底板凹槽的结合示意图。
[0008] 图中：1、基板热沉，2、TEC，3、无氧铜热沉，4、热管散，5、热片，6、大风扇，7、小风扇， 8、底板，9、底板凹槽。
具体实施方式
[0009] 如图1所示，大功率半导体激光器模块的风冷散热装置，包括基板热沉1、TEC 2、无氧铜热沉3、热管4、散热片5、大风扇6、小风扇7和底板8，所述TEC 2固定在基板热沉1 下面，无氧铜热沉3固定在TEC 2下面，所述热管4的一端固定在无氧铜热沉3下面，散热片5以等距离固定在热管4的另一端，所述大风扇6安装在散热片5下面，所述小风扇7安装在无氧铜热沉3下面。
[0010] 所述基板热沉1和无氧铜热沉3均采用无氧铜为材料，所述热管4由管壳、吸液芯和端盖组成。
[0011] 先将散热片5加工好，再将散热片5表面上镀一层镍，防止氧化，每一片散热片5 都要在等间距的地方打出安插热管4的圆孔，50片散热片5等间距平行排列为散热片组，散热片5间距2mm，便于空气流动带走热量。将热管4 一端即热管的冷端插入到散热片组中， 在每一片散热片5和热管4接触的地方涂一层钎焊料，用钎焊设备对钎焊料加热，钎焊料熔融时和热管紧密接触，便于良好的散热。将热管的另一端即热管的热端放在图2的无氧铜热沉3的凹槽9中，在凹槽9中事先涂有导热硅胶，便于挤掉空气间隙，紧密接触散热。每个激光器芯片产生的热量，以热传导的方式通过基板热沉1传导到TEC 2，TEC 2利用温差电制冷的热传导方式，将热量由温度高的热端传至温度低的冷端。TEC 2冷端在通过无氧铜热沉3传导到热管4，热管4内的工作流体吸收热量，蒸发，把热量传导到热管4的另一端。 热管4的冷端通过钎焊紧密的和散热片5焊接，通过大风扇6和小风扇7的空气对流和散热片进行热量交换并释放到空气环境中。释放出热量的工作流体冷凝，被热管内的毛细结构循环回热管热端，继续带走热量，这样往复循环，实现实现百瓦级大功率激光模块的整体的风冷散热。
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Claims (5)
1.大功率半导体激光器模块的风冷散热装置，其特征在于，该装置包括基板热沉（1)、 TEC(2)、无氧铜热沉（3)、热管（4)、散热片（5)、大风扇（6)、小风扇(7)和底板（8)，所述 TEC(2)固定在基板热沉（1)下面，无氧铜热沉（3)固定在TEC(2)下面，所述热管（4)的一端固定在无氧铜热沉（3)下面，散热片（5)以等距离固定在热管（4)的另一端，所述大风扇 (6)安装在散热片（5)下面，所述小风扇（7)安装在无氧铜热沉（3)下面。
2.如权利要求1所述的大功率半导体激光器模块的风冷散热装置，其特征在于，所述基板热沉（1)和无氧铜热沉（3)均由无氧铜材料制成。
3.如权利要求1所述的大功率半导体激光器模块的风冷散热装置，其特征在于，所述热管（4)由管壳、吸液芯和端盖组成。
4.如权利要求1所述的大功率半导体激光器模块的风冷散热装置，其特征在于，所述散热片（5)与热管（4)之间采用钎焊焊接。
5.如权利要求1所述的大功率半导体激光器模块的风冷散热装置，其特征在于，所述在无氧铜热沉（3)与底板（8)之间和无氧铜热沉（3)与热管（4)之间均涂有一层导热硅脂。
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| CN104836112B (zh) * | 2015-04-17 | 2018-07-10 | 中国科学院苏州生物医学工程技术研究所 | 一种单管半导体激光器串联结构的绝缘散热装置 |
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