JP2011116638A5 - - Google Patents
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- Publication number
- JP2011116638A5 JP2011116638A5 JP2010257622A JP2010257622A JP2011116638A5 JP 2011116638 A5 JP2011116638 A5 JP 2011116638A5 JP 2010257622 A JP2010257622 A JP 2010257622A JP 2010257622 A JP2010257622 A JP 2010257622A JP 2011116638 A5 JP2011116638 A5 JP 2011116638A5
- Authority
- JP
- Japan
- Prior art keywords
- coherent
- glass
- nozzle
- continuous ribbon
- brittle material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001427 coherent effect Effects 0.000 claims 12
- 238000000034 method Methods 0.000 claims 12
- 239000011521 glass Substances 0.000 claims 9
- 239000002826 coolant Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 239000000110 cooling liquid Substances 0.000 claims 5
- 238000001816 cooling Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/621,068 | 2009-11-18 | ||
| US12/621,068 US8171753B2 (en) | 2009-11-18 | 2009-11-18 | Method for cutting a brittle material |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011116638A JP2011116638A (ja) | 2011-06-16 |
| JP2011116638A5 true JP2011116638A5 (enExample) | 2013-12-05 |
| JP5563430B2 JP5563430B2 (ja) | 2014-07-30 |
Family
ID=43332619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010257622A Expired - Fee Related JP5563430B2 (ja) | 2009-11-18 | 2010-11-18 | 脆性材料を切断する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8171753B2 (enExample) |
| EP (1) | EP2332890B1 (enExample) |
| JP (1) | JP5563430B2 (enExample) |
| KR (1) | KR101605917B1 (enExample) |
| CN (1) | CN102167505A (enExample) |
| TW (1) | TWI417262B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102203943B (zh) * | 2008-10-29 | 2013-07-31 | 欧瑞康太阳能股份公司(特吕巴赫) | 通过多激光束照射将在基板上形成的半导体膜划分成多个区域的方法 |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| JP5696393B2 (ja) * | 2010-08-02 | 2015-04-08 | 日本電気硝子株式会社 | ガラスフィルムの割断方法 |
| US8720228B2 (en) * | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
| US8677783B2 (en) * | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| KR101948382B1 (ko) | 2013-01-30 | 2019-02-14 | 코닝 인코포레이티드 | 가요성 유리의 연속 레이저 절단을 위한 장치 및 방법 |
| CN103288340B (zh) * | 2013-05-20 | 2016-08-10 | 深圳市华星光电技术有限公司 | 玻璃基板的切割裂片装置及其切割裂片方法 |
| US9260337B2 (en) | 2014-01-09 | 2016-02-16 | Corning Incorporated | Methods and apparatus for free-shape cutting of flexible thin glass |
| JP2017508704A (ja) | 2014-02-20 | 2017-03-30 | コーニング インコーポレイテッド | フレキシブル薄型ガラスにおいてアール部を切断する方法および装置 |
| US10017411B2 (en) * | 2014-11-19 | 2018-07-10 | Corning Incorporated | Methods of separating a glass web |
| KR20180075707A (ko) | 2015-11-25 | 2018-07-04 | 코닝 인코포레이티드 | 유리 웹의 분리 방법들 |
| DE102019113635A1 (de) * | 2019-05-22 | 2020-11-26 | Schott Ag | Verfahren und Vorrichtung zur Verarbeitung von Glaselementen |
| CN111014961A (zh) * | 2019-12-25 | 2020-04-17 | 深圳市韵腾激光科技有限公司 | 一种激光切割裂片装置 |
| CN114734153B (zh) * | 2022-03-31 | 2023-02-14 | 武汉华日精密激光股份有限公司 | 一种用于激光器加工脆性材料的裂片方法及系统 |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2589183A (en) * | 1948-11-12 | 1952-03-11 | Zielinski Joseph | High-pressure jet nozzle |
| JPS4867145A (enExample) * | 1971-12-20 | 1973-09-13 | ||
| DE2619415C2 (de) * | 1976-05-03 | 1986-01-02 | Dietz-Armaturen Gmbh, 5060 Bergisch Gladbach | Schwallbrause zur Erzeugung eines freifallenden Flüssigkeitsflachstrahles |
| JPH0221955A (ja) * | 1988-07-07 | 1990-01-24 | Nippon Steel Corp | 流体噴射ノズル |
| RU2024441C1 (ru) | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
| DE69315643T2 (de) | 1992-09-01 | 1998-04-02 | Corning Inc | Zerteilen von Glasscheiben |
| JP3255479B2 (ja) | 1993-02-26 | 2002-02-12 | 東芝テック株式会社 | インクジェットプリンタ |
| US5622540A (en) | 1994-09-19 | 1997-04-22 | Corning Incorporated | Method for breaking a glass sheet |
| WO1997007927A1 (en) | 1995-08-31 | 1997-03-06 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| TW419867B (en) * | 1998-08-26 | 2001-01-21 | Samsung Electronics Co Ltd | Laser cutting apparatus and method |
| US6252197B1 (en) * | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
| US6259058B1 (en) * | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
| US6211488B1 (en) * | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
| US6420678B1 (en) * | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
| US6327875B1 (en) * | 1999-03-09 | 2001-12-11 | Corning Incorporated | Control of median crack depth in laser scoring |
| DE19952331C1 (de) * | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
| AU1790001A (en) * | 1999-11-24 | 2001-06-04 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
| DE19959921C1 (de) * | 1999-12-11 | 2001-10-18 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
| DE19963939B4 (de) * | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
| US6732952B2 (en) * | 2001-06-08 | 2004-05-11 | Carl L. C. Kah, Jr. | Oscillating nozzle sprinkler with integrated adjustable arc, precipitation rate, flow rate, and range of coverage |
| KR100490048B1 (ko) * | 2001-06-19 | 2005-05-17 | 삼성전자주식회사 | 액정 표시 장치 제조용 인라인 시스템 및 이를 이용하는 액정 표시 장치의 제조 방법 |
| TW568809B (en) * | 2001-09-21 | 2004-01-01 | Mitsuboshi Diamond Ind Co Ltd | Method for scribing substrate of brittle material and scriber |
| DE10148777B4 (de) * | 2001-10-02 | 2019-01-24 | Air Liquide Deutschland Gmbh | Verfahren und Vorrichtung zum Kühlen einer Masse einer Substanz |
| US6744009B1 (en) * | 2002-04-02 | 2004-06-01 | Seagate Technology Llc | Combined laser-scribing and laser-breaking for shaping of brittle substrates |
| CN1890188A (zh) | 2003-12-05 | 2007-01-03 | 旭硝子株式会社 | 平板玻璃的切割方法及装置 |
| US7185833B2 (en) * | 2004-03-18 | 2007-03-06 | Ernest Geskin | Method for fluid jet formation and apparatus for the same |
| US7820941B2 (en) | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
| US20060021977A1 (en) | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
| JP4457933B2 (ja) * | 2005-03-18 | 2010-04-28 | 澁谷工業株式会社 | ハイブリッドレーザ加工装置 |
| US20070039990A1 (en) | 2005-05-06 | 2007-02-22 | Kemmerer Marvin W | Impact induced crack propagation in a brittle material |
| DE102005024563B9 (de) * | 2005-05-28 | 2006-12-14 | Schott Ag | Verfahren zum Trennen von Glas und Verwendung einer dafür geeigneten Flüssigkeit |
| WO2007018586A1 (en) | 2005-07-28 | 2007-02-15 | Gyrotron Technology, Inc. | A method of separating non-metallic material using microwave radiation |
| GB0519111D0 (en) | 2005-09-20 | 2005-10-26 | Pilkington Deutschland Ag | Glass cutting |
| US20070140311A1 (en) * | 2005-12-20 | 2007-06-21 | House Keith L | Method and apparatus for characterizing a glass ribbon |
| DE102006024825A1 (de) * | 2006-05-23 | 2007-11-29 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes |
| JP2008044804A (ja) * | 2006-08-11 | 2008-02-28 | Shibaura Mechatronics Corp | 割断装置および割断方法 |
| US20080213978A1 (en) * | 2007-03-03 | 2008-09-04 | Dynatex | Debris management for wafer singulation |
| DE202006016674U1 (de) * | 2006-10-27 | 2007-02-22 | Nordson Corporation, Westlake | Auftragsvorrichtung zum Auftragen von flüssigem Material |
| JP2008229715A (ja) * | 2007-03-23 | 2008-10-02 | Toray Eng Co Ltd | レーザスクライブ装置 |
| JP5235987B2 (ja) | 2007-04-30 | 2013-07-10 | コーニング インコーポレイテッド | 移動中の帯状ガラスに切断線を設ける装置、システム及び方法 |
| US7895861B2 (en) * | 2007-05-09 | 2011-03-01 | Corning Incorporated | Conformable nosing device for reducing motion and stress within a glass sheet while manufacturing the glass sheet |
| US7982162B2 (en) * | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
| US20080290077A1 (en) | 2007-05-22 | 2008-11-27 | Demeritt Jeffery Alan | Separation of transparent glasses and systems and methods therefor |
| JP2010538476A (ja) | 2007-08-31 | 2010-12-09 | アプライド マテリアルズ インコーポレイテッド | 光電池製造ライン |
| JP5192216B2 (ja) * | 2007-11-09 | 2013-05-08 | 株式会社ディスコ | レーザー加工装置 |
| US8011207B2 (en) | 2007-11-20 | 2011-09-06 | Corning Incorporated | Laser scoring of glass sheets at high speeds and with low residual stress |
| US20090178298A1 (en) | 2008-01-15 | 2009-07-16 | Anatoli Anatolyevich Abramov | Device for fluid removal after laser scoring |
-
2009
- 2009-11-18 US US12/621,068 patent/US8171753B2/en not_active Expired - Fee Related
-
2010
- 2010-11-08 TW TW099138385A patent/TWI417262B/zh not_active IP Right Cessation
- 2010-11-11 KR KR1020100112027A patent/KR101605917B1/ko not_active Expired - Fee Related
- 2010-11-12 EP EP10190949A patent/EP2332890B1/en not_active Not-in-force
- 2010-11-17 CN CN2010106238617A patent/CN102167505A/zh active Pending
- 2010-11-18 JP JP2010257622A patent/JP5563430B2/ja not_active Expired - Fee Related
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