KR101605917B1 - 취성물질의 절단 방법 - Google Patents

취성물질의 절단 방법 Download PDF

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Publication number
KR101605917B1
KR101605917B1 KR1020100112027A KR20100112027A KR101605917B1 KR 101605917 B1 KR101605917 B1 KR 101605917B1 KR 1020100112027 A KR1020100112027 A KR 1020100112027A KR 20100112027 A KR20100112027 A KR 20100112027A KR 101605917 B1 KR101605917 B1 KR 101605917B1
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KR
South Korea
Prior art keywords
nozzle
stream
brittle material
glass ribbon
cooling liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100112027A
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English (en)
Korean (ko)
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KR20110055406A (ko
Inventor
아나톨리 아나톨리에비치 아브라모프
웨이웨이 루오
Original Assignee
코닝 인코포레이티드
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Publication of KR20110055406A publication Critical patent/KR20110055406A/ko
Application granted granted Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/003—Cooling means for welding or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020100112027A 2009-11-18 2010-11-11 취성물질의 절단 방법 Expired - Fee Related KR101605917B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/621,068 2009-11-18
US12/621,068 US8171753B2 (en) 2009-11-18 2009-11-18 Method for cutting a brittle material

Publications (2)

Publication Number Publication Date
KR20110055406A KR20110055406A (ko) 2011-05-25
KR101605917B1 true KR101605917B1 (ko) 2016-04-01

Family

ID=43332619

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100112027A Expired - Fee Related KR101605917B1 (ko) 2009-11-18 2010-11-11 취성물질의 절단 방법

Country Status (6)

Country Link
US (1) US8171753B2 (enExample)
EP (1) EP2332890B1 (enExample)
JP (1) JP5563430B2 (enExample)
KR (1) KR101605917B1 (enExample)
CN (1) CN102167505A (enExample)
TW (1) TWI417262B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110300692A1 (en) * 2008-10-29 2011-12-08 Oerlikon Solar Ag, Trubbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
JP5696393B2 (ja) * 2010-08-02 2015-04-08 日本電気硝子株式会社 ガラスフィルムの割断方法
TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US9919381B2 (en) 2013-01-30 2018-03-20 Corning Incorporated Apparatus and methods for continuous laser cutting of flexible glass
CN103288340B (zh) * 2013-05-20 2016-08-10 深圳市华星光电技术有限公司 玻璃基板的切割裂片装置及其切割裂片方法
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
KR102421381B1 (ko) 2014-02-20 2022-07-18 코닝 인코포레이티드 얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치
US10017411B2 (en) * 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
WO2017091529A1 (en) * 2015-11-25 2017-06-01 Corning Incorporated Methods of separating a glass web
DE102019113635A1 (de) * 2019-05-22 2020-11-26 Schott Ag Verfahren und Vorrichtung zur Verarbeitung von Glaselementen
CN111014961A (zh) * 2019-12-25 2020-04-17 深圳市韵腾激光科技有限公司 一种激光切割裂片装置
CN114734153B (zh) * 2022-03-31 2023-02-14 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007314414A (ja) * 2006-05-23 2007-12-06 Jenoptik Automatisierungstechnik Gmbh フロートガラスリボンの端部を切り落とす方法及び装置
JP2008044804A (ja) * 2006-08-11 2008-02-28 Shibaura Mechatronics Corp 割断装置および割断方法
US20080283509A1 (en) * 2007-05-15 2008-11-20 Anatoli Anatolyevich Abramov Method and apparatus for scoring and separating a brittle material with a single beam of radiation

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2589183A (en) 1948-11-12 1952-03-11 Zielinski Joseph High-pressure jet nozzle
JPS4867145A (enExample) * 1971-12-20 1973-09-13
DE2619415C2 (de) 1976-05-03 1986-01-02 Dietz-Armaturen Gmbh, 5060 Bergisch Gladbach Schwallbrause zur Erzeugung eines freifallenden Flüssigkeitsflachstrahles
JPH0221955A (ja) 1988-07-07 1990-01-24 Nippon Steel Corp 流体噴射ノズル
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
EP0585694B1 (en) 1992-09-01 1997-12-10 Corning Incorporated Separating sheet glass
JP3255479B2 (ja) 1993-02-26 2002-02-12 東芝テック株式会社 インクジェットプリンタ
US5622540A (en) 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
WO1997007927A1 (en) 1995-08-31 1997-03-06 Corning Incorporated Method and apparatus for breaking brittle materials
US6407360B1 (en) 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6327875B1 (en) 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
DE19952331C1 (de) 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
CN1413136A (zh) 1999-11-24 2003-04-23 应用光子学公司 非金属材料的分离方法和装置
DE19959921C1 (de) 1999-12-11 2001-10-18 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE19963939B4 (de) 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
US6732952B2 (en) * 2001-06-08 2004-05-11 Carl L. C. Kah, Jr. Oscillating nozzle sprinkler with integrated adjustable arc, precipitation rate, flow rate, and range of coverage
KR100490048B1 (ko) 2001-06-19 2005-05-17 삼성전자주식회사 액정 표시 장치 제조용 인라인 시스템 및 이를 이용하는 액정 표시 장치의 제조 방법
TW568809B (en) 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
DE10148777B4 (de) * 2001-10-02 2019-01-24 Air Liquide Deutschland Gmbh Verfahren und Vorrichtung zum Kühlen einer Masse einer Substanz
US6744009B1 (en) 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
WO2005054142A1 (ja) 2003-12-05 2005-06-16 Asahi Glass Company, Limited 板ガラスの切断方法及び装置
US7185833B2 (en) 2004-03-18 2007-03-06 Ernest Geskin Method for fluid jet formation and apparatus for the same
US20060021977A1 (en) 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US7820941B2 (en) 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP4457933B2 (ja) * 2005-03-18 2010-04-28 澁谷工業株式会社 ハイブリッドレーザ加工装置
US20070039990A1 (en) 2005-05-06 2007-02-22 Kemmerer Marvin W Impact induced crack propagation in a brittle material
DE102005024563B9 (de) 2005-05-28 2006-12-14 Schott Ag Verfahren zum Trennen von Glas und Verwendung einer dafür geeigneten Flüssigkeit
WO2007018586A1 (en) 2005-07-28 2007-02-15 Gyrotron Technology, Inc. A method of separating non-metallic material using microwave radiation
GB0519111D0 (en) 2005-09-20 2005-10-26 Pilkington Deutschland Ag Glass cutting
US20070140311A1 (en) * 2005-12-20 2007-06-21 House Keith L Method and apparatus for characterizing a glass ribbon
US20080213978A1 (en) 2007-03-03 2008-09-04 Dynatex Debris management for wafer singulation
DE202006016674U1 (de) 2006-10-27 2007-02-22 Nordson Corporation, Westlake Auftragsvorrichtung zum Auftragen von flüssigem Material
JP2008229715A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ装置
KR101453587B1 (ko) 2007-04-30 2014-11-03 코닝 인코포레이티드 이동 유리 리본을 스코어링하기 위한 장치, 시스템, 및 방법
US7895861B2 (en) * 2007-05-09 2011-03-01 Corning Incorporated Conformable nosing device for reducing motion and stress within a glass sheet while manufacturing the glass sheet
US20080290077A1 (en) 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
JP2010538476A (ja) 2007-08-31 2010-12-09 アプライド マテリアルズ インコーポレイテッド 光電池製造ライン
JP5192216B2 (ja) * 2007-11-09 2013-05-08 株式会社ディスコ レーザー加工装置
US8011207B2 (en) 2007-11-20 2011-09-06 Corning Incorporated Laser scoring of glass sheets at high speeds and with low residual stress
US20090178298A1 (en) 2008-01-15 2009-07-16 Anatoli Anatolyevich Abramov Device for fluid removal after laser scoring

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007314414A (ja) * 2006-05-23 2007-12-06 Jenoptik Automatisierungstechnik Gmbh フロートガラスリボンの端部を切り落とす方法及び装置
JP2008044804A (ja) * 2006-08-11 2008-02-28 Shibaura Mechatronics Corp 割断装置および割断方法
US20080283509A1 (en) * 2007-05-15 2008-11-20 Anatoli Anatolyevich Abramov Method and apparatus for scoring and separating a brittle material with a single beam of radiation

Also Published As

Publication number Publication date
EP2332890B1 (en) 2012-08-22
TWI417262B (zh) 2013-12-01
US8171753B2 (en) 2012-05-08
US20110113830A1 (en) 2011-05-19
EP2332890A1 (en) 2011-06-15
KR20110055406A (ko) 2011-05-25
CN102167505A (zh) 2011-08-31
JP2011116638A (ja) 2011-06-16
JP5563430B2 (ja) 2014-07-30
TW201127764A (en) 2011-08-16

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