JP5563430B2 - 脆性材料を切断する方法 - Google Patents
脆性材料を切断する方法 Download PDFInfo
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- JP5563430B2 JP5563430B2 JP2010257622A JP2010257622A JP5563430B2 JP 5563430 B2 JP5563430 B2 JP 5563430B2 JP 2010257622 A JP2010257622 A JP 2010257622A JP 2010257622 A JP2010257622 A JP 2010257622A JP 5563430 B2 JP5563430 B2 JP 5563430B2
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- Prior art keywords
- nozzle
- coherent
- glass
- brittle material
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/003—Cooling means
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
前記脆性材料の表面を所定の経路に沿ってレーザで加熱する工程、および、
前記脆性材料の加熱された表面を、ノズルにより分配された冷却液のコヒーレント流で冷却する工程であって、該コヒーレント流が、50mm以上のコヒーレント長および約70マイクロメートルから約200マイクロメートルまでの範囲の直径を有するものである工程、
を有してなり、
前記ノズルの開口と前記脆性材料の表面との間の作業距離が前記コヒーレント流のコヒーレント長より短いことを特徴とする方法。
粘性領域と弾性領域を含むガラスの連続リボンを形成する工程、
前記弾性領域において前記ガラスの連続リボンの表面を所定の経路に沿ってレーザで加熱する工程、および
前記ガラスの連続リボンの加熱された表面を、ノズルにより分配された冷却液のコヒーレント流で冷却する工程であって、該コヒーレント流が、50mm以上のコヒーレント長および約70マイクロメートルから約150マイクロメートルまでの範囲の直径を有するものである工程、
を有してなり、
前記ノズルの開口と前記ガラスの連続リボンの表面との間の作業距離は、前記コヒーレント流のコヒーレント長より短いことを特徴とする方法。
12 脆性材料の板
14 レーザ
16 電磁エネルギービーム(光)
18 所定の経路
20 既存の割れ目
22 冷却液の流れ
24 ノズル
26 亀裂
28 円柱流
30 ノズルの開口
32 孔
40 ガラスリボン
42 エッジ・ロール
44 縁
Claims (10)
- 脆性材料にベント亀裂を形成する方法であって、
前記脆性材料の表面を所定の経路に沿ってレーザで加熱する工程、および、
前記脆性材料の加熱された表面を、ノズルにより分配された冷却液のコヒーレント流で冷却する工程であって、該冷却液のコヒーレント流が、50mm以上のコヒーレント長を有し、前記冷却液のコヒーレント流の直径が70マイクロメートルから200マイクロメートルまでの範囲である工程、
を有してなり、
前記ノズルの開口と前記脆性材料の表面との間の作業距離が前記冷却液のコヒーレント流のコヒーレント長より短いことを特徴とする方法。 - 前記冷却液のコヒーレント流が、円対称の開口を有する末広ノズルにより形成されることを特徴とする請求項1記載の方法。
- 前記冷却液のコヒーレント流が、真っ直ぐな壁の円筒の孔を有するノズルにより形成されることを特徴とする請求項1記載の方法。
- 前記作業距離が5mmより長いことを特徴とする請求項1記載の方法。
- 前記脆性材料の温度が300℃を超えることを特徴とする請求項1記載の方法。
- 前記ノズルの開口と前記脆性材料の加熱された表面との間の距離が前記所定の経路に沿って変動することを特徴とする請求項1記載の方法。
- 前記ノズルの中の前記冷却液の圧力が0.35kg/cm2 (34.3kPa)および0.70kg/cm2 (68.7kPa)の間の範囲にあることを特徴とする請求項1記載の方法。
- ガラスリボンの縁を分離する方法であって、
ガラスの連続リボンを形成する工程であって、該ガラスの連続リボンが粘性領域および弾性領域を含む工程、
前記ガラスの連続リボンの表面を前記弾性領域で所定の経路に沿ってレーザで加熱する工程、および、
前記ガラスの連続リボンの加熱された表面を、ノズルにより分配された水を含む冷却液のコヒーレント流で冷却する工程であって、該冷却液のコヒーレント流が、50mm以上のコヒーレント長および70マイクロメートルから150マイクロメートルまでの範囲の直径を有し、前記ガラスの連続リボンから縁を分離する工程、
を有してなり、
前記ノズルの開口と前記ガラスの連続リボンの加熱された表面との間の作業距離が前記冷却液のコヒーレント流のコヒーレント長より短いことを特徴とする方法。 - 前記ノズルの開口と前記ガラスの連続リボンの加熱された表面との間の作業距離が約5mmより長いことを特徴とする請求項8記載の方法。
- 前記ノズルの中の前記冷却液の圧力が0.35kg/cm2 (34.3kPa)および0.70kg/cm2 (68.7kPa)の間の範囲にあることを特徴とする請求項8記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/621,068 | 2009-11-18 | ||
US12/621,068 US8171753B2 (en) | 2009-11-18 | 2009-11-18 | Method for cutting a brittle material |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011116638A JP2011116638A (ja) | 2011-06-16 |
JP2011116638A5 JP2011116638A5 (ja) | 2013-12-05 |
JP5563430B2 true JP5563430B2 (ja) | 2014-07-30 |
Family
ID=43332619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010257622A Expired - Fee Related JP5563430B2 (ja) | 2009-11-18 | 2010-11-18 | 脆性材料を切断する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8171753B2 (ja) |
EP (1) | EP2332890B1 (ja) |
JP (1) | JP5563430B2 (ja) |
KR (1) | KR101605917B1 (ja) |
CN (1) | CN102167505A (ja) |
TW (1) | TWI417262B (ja) |
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US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
JP5696393B2 (ja) * | 2010-08-02 | 2015-04-08 | 日本電気硝子株式会社 | ガラスフィルムの割断方法 |
TWI513670B (zh) * | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
US8677783B2 (en) * | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
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CN103288340B (zh) * | 2013-05-20 | 2016-08-10 | 深圳市华星光电技术有限公司 | 玻璃基板的切割裂片装置及其切割裂片方法 |
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-
2009
- 2009-11-18 US US12/621,068 patent/US8171753B2/en not_active Expired - Fee Related
-
2010
- 2010-11-08 TW TW099138385A patent/TWI417262B/zh not_active IP Right Cessation
- 2010-11-11 KR KR1020100112027A patent/KR101605917B1/ko not_active IP Right Cessation
- 2010-11-12 EP EP10190949A patent/EP2332890B1/en not_active Not-in-force
- 2010-11-17 CN CN2010106238617A patent/CN102167505A/zh active Pending
- 2010-11-18 JP JP2010257622A patent/JP5563430B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2332890A1 (en) | 2011-06-15 |
KR101605917B1 (ko) | 2016-04-01 |
US8171753B2 (en) | 2012-05-08 |
TWI417262B (zh) | 2013-12-01 |
EP2332890B1 (en) | 2012-08-22 |
JP2011116638A (ja) | 2011-06-16 |
KR20110055406A (ko) | 2011-05-25 |
US20110113830A1 (en) | 2011-05-19 |
TW201127764A (en) | 2011-08-16 |
CN102167505A (zh) | 2011-08-31 |
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