JP2015080900A5 - - Google Patents

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Publication number
JP2015080900A5
JP2015080900A5 JP2013219641A JP2013219641A JP2015080900A5 JP 2015080900 A5 JP2015080900 A5 JP 2015080900A5 JP 2013219641 A JP2013219641 A JP 2013219641A JP 2013219641 A JP2013219641 A JP 2013219641A JP 2015080900 A5 JP2015080900 A5 JP 2015080900A5
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JP
Japan
Prior art keywords
silicon substrate
hole
adhesive layer
processing
sealing tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013219641A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015080900A (ja
JP6184291B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013219641A priority Critical patent/JP6184291B2/ja
Priority claimed from JP2013219641A external-priority patent/JP6184291B2/ja
Priority to US14/518,946 priority patent/US9511588B2/en
Publication of JP2015080900A publication Critical patent/JP2015080900A/ja
Publication of JP2015080900A5 publication Critical patent/JP2015080900A5/ja
Application granted granted Critical
Publication of JP6184291B2 publication Critical patent/JP6184291B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013219641A 2013-10-22 2013-10-22 シリコン基板の加工方法 Active JP6184291B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013219641A JP6184291B2 (ja) 2013-10-22 2013-10-22 シリコン基板の加工方法
US14/518,946 US9511588B2 (en) 2013-10-22 2014-10-20 Method for processing silicon substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013219641A JP6184291B2 (ja) 2013-10-22 2013-10-22 シリコン基板の加工方法

Publications (3)

Publication Number Publication Date
JP2015080900A JP2015080900A (ja) 2015-04-27
JP2015080900A5 true JP2015080900A5 (enExample) 2016-11-10
JP6184291B2 JP6184291B2 (ja) 2017-08-23

Family

ID=52826514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013219641A Active JP6184291B2 (ja) 2013-10-22 2013-10-22 シリコン基板の加工方法

Country Status (2)

Country Link
US (1) US9511588B2 (enExample)
JP (1) JP6184291B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101774750B1 (ko) * 2016-06-24 2017-09-05 한국과학기술연구원 멀티플렉스 케모타이핑 마이크로어레이 프린트용 헤드의 제조방법
ES2891701B2 (es) * 2020-07-20 2022-05-30 Consejo Superior Investigacion Proceso para la obtencion de chips janus, doble planares suspendidos de su-8, dichos chips janus, doble planares suspendidos de su-8 y su arreglo suspendido

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030052947A1 (en) * 2001-09-14 2003-03-20 Lin Chen-Hua Structure of an inkjet printhead chip and method for making the same
US7575298B2 (en) * 2002-04-12 2009-08-18 Silverbrook Research Pty Ltd Inkjet printhead with ink supply passage to nozzle etched from opposing sides of wafer
US6902867B2 (en) * 2002-10-02 2005-06-07 Lexmark International, Inc. Ink jet printheads and methods therefor
US7481943B2 (en) 2005-08-08 2009-01-27 Silverbrook Research Pty Ltd Method suitable for etching hydrophillic trenches in a substrate
JP5046366B2 (ja) * 2005-10-20 2012-10-10 信越化学工業株式会社 接着剤組成物及び該接着剤からなる接着層を備えたシート
JP2007130864A (ja) * 2005-11-10 2007-05-31 Seiko Epson Corp ウェハ固定治具、ノズル基板の製造方法並びに液滴吐出ヘッドの製造方法
KR100705642B1 (ko) * 2005-12-29 2007-04-09 삼성전자주식회사 잉크젯 프린터 헤드의 노즐 및 그 제작 방법
US20070182777A1 (en) * 2006-02-08 2007-08-09 Eastman Kodak Company Printhead and method of forming same
US7607227B2 (en) * 2006-02-08 2009-10-27 Eastman Kodak Company Method of forming a printhead
JP4321574B2 (ja) * 2006-02-27 2009-08-26 セイコーエプソン株式会社 ノズル基板の製造方法、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置
JP2008126420A (ja) * 2006-11-16 2008-06-05 Canon Inc インクジェット記録ヘッドおよびその作製方法
WO2008114252A2 (en) * 2007-03-18 2008-09-25 Nanopass Technologies Ltd Microneedle structures and corresponding production methods employing a backside wet etch
JP5305691B2 (ja) * 2008-02-27 2013-10-02 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP5218164B2 (ja) * 2009-03-10 2013-06-26 セイコーエプソン株式会社 ノズル基板の製造方法及び液滴吐出ヘッドの製造方法
JP5728795B2 (ja) * 2009-04-01 2015-06-03 セイコーエプソン株式会社 ノズルプレートの製造方法、及び、液滴吐出ヘッドの製造方法
US8888242B2 (en) * 2011-05-20 2014-11-18 Funai Electric Co., Ltd. Fluid ejection devices and methods for fabricating fluid ejection devices
JP6095320B2 (ja) * 2011-12-02 2017-03-15 キヤノン株式会社 液体吐出ヘッド用基板の製造方法

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