JP6184291B2 - シリコン基板の加工方法 - Google Patents
シリコン基板の加工方法 Download PDFInfo
- Publication number
- JP6184291B2 JP6184291B2 JP2013219641A JP2013219641A JP6184291B2 JP 6184291 B2 JP6184291 B2 JP 6184291B2 JP 2013219641 A JP2013219641 A JP 2013219641A JP 2013219641 A JP2013219641 A JP 2013219641A JP 6184291 B2 JP6184291 B2 JP 6184291B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- hole
- adhesive layer
- etching
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1648—Production of print heads with thermal bend detached actuators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Physics & Mathematics (AREA)
- Micromachines (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013219641A JP6184291B2 (ja) | 2013-10-22 | 2013-10-22 | シリコン基板の加工方法 |
| US14/518,946 US9511588B2 (en) | 2013-10-22 | 2014-10-20 | Method for processing silicon substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013219641A JP6184291B2 (ja) | 2013-10-22 | 2013-10-22 | シリコン基板の加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015080900A JP2015080900A (ja) | 2015-04-27 |
| JP2015080900A5 JP2015080900A5 (enExample) | 2016-11-10 |
| JP6184291B2 true JP6184291B2 (ja) | 2017-08-23 |
Family
ID=52826514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013219641A Active JP6184291B2 (ja) | 2013-10-22 | 2013-10-22 | シリコン基板の加工方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9511588B2 (enExample) |
| JP (1) | JP6184291B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101774750B1 (ko) * | 2016-06-24 | 2017-09-05 | 한국과학기술연구원 | 멀티플렉스 케모타이핑 마이크로어레이 프린트용 헤드의 제조방법 |
| ES2891701B2 (es) * | 2020-07-20 | 2022-05-30 | Consejo Superior Investigacion | Proceso para la obtencion de chips janus, doble planares suspendidos de su-8, dichos chips janus, doble planares suspendidos de su-8 y su arreglo suspendido |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030052947A1 (en) * | 2001-09-14 | 2003-03-20 | Lin Chen-Hua | Structure of an inkjet printhead chip and method for making the same |
| US7575298B2 (en) * | 2002-04-12 | 2009-08-18 | Silverbrook Research Pty Ltd | Inkjet printhead with ink supply passage to nozzle etched from opposing sides of wafer |
| US6902867B2 (en) * | 2002-10-02 | 2005-06-07 | Lexmark International, Inc. | Ink jet printheads and methods therefor |
| US7481943B2 (en) | 2005-08-08 | 2009-01-27 | Silverbrook Research Pty Ltd | Method suitable for etching hydrophillic trenches in a substrate |
| JP5046366B2 (ja) * | 2005-10-20 | 2012-10-10 | 信越化学工業株式会社 | 接着剤組成物及び該接着剤からなる接着層を備えたシート |
| JP2007130864A (ja) * | 2005-11-10 | 2007-05-31 | Seiko Epson Corp | ウェハ固定治具、ノズル基板の製造方法並びに液滴吐出ヘッドの製造方法 |
| KR100705642B1 (ko) * | 2005-12-29 | 2007-04-09 | 삼성전자주식회사 | 잉크젯 프린터 헤드의 노즐 및 그 제작 방법 |
| US20070182777A1 (en) * | 2006-02-08 | 2007-08-09 | Eastman Kodak Company | Printhead and method of forming same |
| US7607227B2 (en) * | 2006-02-08 | 2009-10-27 | Eastman Kodak Company | Method of forming a printhead |
| JP4321574B2 (ja) * | 2006-02-27 | 2009-08-26 | セイコーエプソン株式会社 | ノズル基板の製造方法、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置 |
| JP2008126420A (ja) * | 2006-11-16 | 2008-06-05 | Canon Inc | インクジェット記録ヘッドおよびその作製方法 |
| WO2008114252A2 (en) * | 2007-03-18 | 2008-09-25 | Nanopass Technologies Ltd | Microneedle structures and corresponding production methods employing a backside wet etch |
| JP5305691B2 (ja) * | 2008-02-27 | 2013-10-02 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| JP5218164B2 (ja) * | 2009-03-10 | 2013-06-26 | セイコーエプソン株式会社 | ノズル基板の製造方法及び液滴吐出ヘッドの製造方法 |
| JP5728795B2 (ja) * | 2009-04-01 | 2015-06-03 | セイコーエプソン株式会社 | ノズルプレートの製造方法、及び、液滴吐出ヘッドの製造方法 |
| US8888242B2 (en) * | 2011-05-20 | 2014-11-18 | Funai Electric Co., Ltd. | Fluid ejection devices and methods for fabricating fluid ejection devices |
| JP6095320B2 (ja) * | 2011-12-02 | 2017-03-15 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
-
2013
- 2013-10-22 JP JP2013219641A patent/JP6184291B2/ja active Active
-
2014
- 2014-10-20 US US14/518,946 patent/US9511588B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015080900A (ja) | 2015-04-27 |
| US9511588B2 (en) | 2016-12-06 |
| US20150111321A1 (en) | 2015-04-23 |
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