JP2011108592A5 - - Google Patents
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- Publication number
- JP2011108592A5 JP2011108592A5 JP2009265285A JP2009265285A JP2011108592A5 JP 2011108592 A5 JP2011108592 A5 JP 2011108592A5 JP 2009265285 A JP2009265285 A JP 2009265285A JP 2009265285 A JP2009265285 A JP 2009265285A JP 2011108592 A5 JP2011108592 A5 JP 2011108592A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal plate
- copper
- superconducting compound
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000000992 sputter etching Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 239000002156 adsorbate Substances 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 2
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009265285A JP5517196B2 (ja) | 2009-11-20 | 2009-11-20 | 超電導化合物用基板及びその製造方法 |
| KR1020177005588A KR101834356B1 (ko) | 2009-11-20 | 2010-11-12 | 초전도 화합물용 기판 |
| PCT/JP2010/006649 WO2011061909A1 (ja) | 2009-11-20 | 2010-11-12 | 超電導化合物用基板及びその製造方法 |
| CN201080051041.3A CN102667968B (zh) | 2009-11-20 | 2010-11-12 | 超导化合物用基板及其制造方法 |
| EP10831308.1A EP2503560A4 (en) | 2009-11-20 | 2010-11-12 | Substrate for superconducting compound and method for manufacturing the substrate |
| CN201410324551.3A CN104091647B (zh) | 2009-11-20 | 2010-11-12 | 超导化合物用基板及其制造方法 |
| RU2012125607/07A RU2012125607A (ru) | 2009-11-20 | 2010-11-12 | Подложка для сверхпроводящего соединения и способ ее получения |
| US13/510,406 US8993064B2 (en) | 2009-11-20 | 2010-11-12 | Substrate for superconducting compound and method for manufacturing the substrate |
| IN4891DEN2012 IN2012DN04891A (cg-RX-API-DMAC7.html) | 2009-11-20 | 2010-11-12 | |
| KR1020127012288A KR101763850B1 (ko) | 2009-11-20 | 2010-11-12 | 초전도 화합물용 기판의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009265285A JP5517196B2 (ja) | 2009-11-20 | 2009-11-20 | 超電導化合物用基板及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014063666A Division JP5918920B2 (ja) | 2014-03-26 | 2014-03-26 | 超電導化合物用基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011108592A JP2011108592A (ja) | 2011-06-02 |
| JP2011108592A5 true JP2011108592A5 (cg-RX-API-DMAC7.html) | 2012-12-20 |
| JP5517196B2 JP5517196B2 (ja) | 2014-06-11 |
Family
ID=44059396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009265285A Active JP5517196B2 (ja) | 2009-11-20 | 2009-11-20 | 超電導化合物用基板及びその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8993064B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2503560A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5517196B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR101834356B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN104091647B (cg-RX-API-DMAC7.html) |
| IN (1) | IN2012DN04891A (cg-RX-API-DMAC7.html) |
| RU (1) | RU2012125607A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2011061909A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101306181B1 (ko) * | 2008-11-12 | 2013-09-09 | 도요 고한 가부시키가이샤 | 반도체 소자 형성의 에피택셜 성장막 형성용 금속 적층 기판의 제조 방법 및 반도체 소자 형성의 에피택셜 성장막 형성용 금속 적층 기판 |
| JP2013101832A (ja) * | 2011-11-08 | 2013-05-23 | Toyo Kohan Co Ltd | エピタキシャル成長用基板及びその製造方法、並びに超電導線材用基板 |
| JP5650098B2 (ja) * | 2011-11-22 | 2015-01-07 | Jx日鉱日石金属株式会社 | 超電導膜形成用圧延銅箔 |
| JP5650099B2 (ja) * | 2011-11-22 | 2015-01-07 | Jx日鉱日石金属株式会社 | 超電導膜形成用圧延銅箔 |
| US9002424B2 (en) * | 2012-04-16 | 2015-04-07 | Furukawa Electric Co., Ltd. | Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method |
| JP6543439B2 (ja) * | 2014-04-01 | 2019-07-10 | 東洋鋼鈑株式会社 | 金属積層材の製造方法 |
| JP6381944B2 (ja) * | 2014-04-01 | 2018-08-29 | 東洋鋼鈑株式会社 | 金属積層材の製造方法 |
| KR102403087B1 (ko) * | 2014-10-27 | 2022-05-27 | 도요 고한 가부시키가이샤 | 초전도 선재용 기판 및 그 제조 방법과 초전도 선재 |
| US10832843B2 (en) * | 2015-03-17 | 2020-11-10 | The University Of Houston System | Superconductor compositions |
| JP6074527B2 (ja) * | 2016-03-08 | 2017-02-01 | 東洋鋼鈑株式会社 | エピタキシャル成長用基板及びその製造方法、並びに超電導線材用基板 |
| US11840045B2 (en) * | 2017-03-29 | 2023-12-12 | Toyo Kohan Co., Ltd. | Roll-bonded laminate |
| JP7162960B2 (ja) * | 2018-08-06 | 2022-10-31 | 東洋鋼鈑株式会社 | 圧延接合体及びその製造方法、並びに電子機器用の放熱補強部材 |
| KR20210122784A (ko) * | 2019-02-08 | 2021-10-12 | 스미토모 덴키 고교 가부시키가이샤 | 초전도 선재 및 영구 전류 스위치 |
| KR102174616B1 (ko) * | 2019-09-18 | 2020-11-05 | 황교찬 | 결제시스템 및 이의 결제방법 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003193211A (ja) * | 2001-12-27 | 2003-07-09 | Nippon Mining & Metals Co Ltd | 銅張積層板用圧延銅箔 |
| CN100365741C (zh) * | 2003-03-31 | 2008-01-30 | 财团法人国际超电导产业技术研究中心 | 氧化物超导线材用金属基材、氧化物超导线材及其制造方法 |
| JP4155124B2 (ja) * | 2003-06-30 | 2008-09-24 | 住友金属工業株式会社 | 金属クラッド板およびその製造方法 |
| JP5123462B2 (ja) * | 2004-10-27 | 2013-01-23 | 住友電気工業株式会社 | 膜形成用配向基板および超電導線材ならびに膜形成用配向基板の製造方法 |
| KR101441139B1 (ko) * | 2005-07-29 | 2014-09-17 | 아메리칸 수퍼컨덕터 코포레이션 | 고온 초전도 와이어 및 코일 |
| JP4800740B2 (ja) * | 2005-10-21 | 2011-10-26 | 財団法人国際超電導産業技術研究センター | 希土類系テープ状酸化物超電導体及びその製造方法 |
| JP5074083B2 (ja) * | 2007-04-17 | 2012-11-14 | 中部電力株式会社 | エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 |
| JP5203626B2 (ja) * | 2007-04-17 | 2013-06-05 | 中部電力株式会社 | エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 |
| JP5324763B2 (ja) * | 2007-08-21 | 2013-10-23 | 中部電力株式会社 | エピタキシャル膜形成用配向基板及びエピタキシャル膜形成用配向基板の表面改質方法 |
| JP5382911B2 (ja) * | 2008-11-12 | 2014-01-08 | 東洋鋼鈑株式会社 | 酸化物超電導線材用金属積層基板の製造方法及び該基板を用いた酸化物超電導線材 |
| IN2012DN00632A (cg-RX-API-DMAC7.html) * | 2009-07-17 | 2015-08-21 | Toyo Kohan Co Ltd |
-
2009
- 2009-11-20 JP JP2009265285A patent/JP5517196B2/ja active Active
-
2010
- 2010-11-12 KR KR1020177005588A patent/KR101834356B1/ko not_active Expired - Fee Related
- 2010-11-12 KR KR1020127012288A patent/KR101763850B1/ko active Active
- 2010-11-12 IN IN4891DEN2012 patent/IN2012DN04891A/en unknown
- 2010-11-12 EP EP10831308.1A patent/EP2503560A4/en not_active Withdrawn
- 2010-11-12 RU RU2012125607/07A patent/RU2012125607A/ru not_active Application Discontinuation
- 2010-11-12 CN CN201410324551.3A patent/CN104091647B/zh not_active Expired - Fee Related
- 2010-11-12 US US13/510,406 patent/US8993064B2/en active Active
- 2010-11-12 CN CN201080051041.3A patent/CN102667968B/zh not_active Expired - Fee Related
- 2010-11-12 WO PCT/JP2010/006649 patent/WO2011061909A1/ja not_active Ceased