TWI432113B - A method for producing a copper-clad laminate, a copper foil for use, and a laminated apparatus for a copper-clad laminate - Google Patents

A method for producing a copper-clad laminate, a copper foil for use, and a laminated apparatus for a copper-clad laminate Download PDF

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Publication number
TWI432113B
TWI432113B TW100101910A TW100101910A TWI432113B TW I432113 B TWI432113 B TW I432113B TW 100101910 A TW100101910 A TW 100101910A TW 100101910 A TW100101910 A TW 100101910A TW I432113 B TWI432113 B TW I432113B
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Taiwan
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copper foil
copper
clad laminate
preliminary heating
heating
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TW100101910A
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English (en)
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TW201146111A (en
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Kaichiro Nakamuro
Toshiyuki Ono
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Jx Nippon Mining & Metals Corp
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Publication of TW201146111A publication Critical patent/TW201146111A/zh
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Publication of TWI432113B publication Critical patent/TWI432113B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/64—Joining a non-plastics element to a plastics element, e.g. by force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8341—Roller, cylinder or drum types; Band or belt types; Ball types
    • B29C66/83411—Roller, cylinder or drum types
    • B29C66/83413—Roller, cylinder or drum types cooperating rollers, cylinders or drums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
    • B29C66/91643—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
    • B29C66/91645—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/44—Joining a heated non plastics element to a plastics element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74281—Copper or alloys of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
    • B29C66/949—Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

覆銅積層板之製造方法、其所使用之銅箔、及覆銅積層板之積層裝置
本發明係關於一種適用於電氣電路之彎曲部分之撓性印刷電路基板(FPC：Flexible Printed Circuit)所使用之撓性覆銅積層板、其所使用之銅箔、及覆銅積層板之積層裝置。
當前，行動電話等之配線中之彎曲部分所使用之FPC係藉由被稱為澆鑄法之方法、或被稱為積層法之方法而製造，上述澆鑄法係於銅箔塗佈聚醯亞胺清漆，並加熱使其乾燥、硬化而形成積層板，上述積層法係使預先塗佈有具有接著力之熱可塑性聚醯亞胺而成之聚醯亞胺膜與銅箔疊合，通過加熱輥等進行壓接。以該等方法獲得之撓性覆銅積層板被稱為雙層撓性覆銅積層板。
另外，亦已知由環氧系等之接著劑將銅箔與聚醯亞胺膜接著而成之三層撓性覆銅積層板。
該等FPC用銅箔，已知使其再結晶退火而提供彎曲性之200面之I/I0為40以上的技術(專利文獻1、2)。
進而，本發明人等提出下述技術報告：於以積層法製造雙層撓性覆銅積層板時，將積層速度放慢一定程度，以使得銅箔之結晶粒徑增大，使彎曲性提高(專利文獻3)。
專利文獻1：日本特開2001-323354號公報(段落0014)
專利文獻2：日本特開平11-286760號公報
專利文獻3：日本特開2009-292090號公報(申請專利範圍第3項)
然而，於以積層法製作之CCL(Copper Clad Laminate：覆銅積層板)中，產生了銅箔之朝向(200)方位之配向度並未變高、彎曲性降低之問題。認為其原因在於，於積層法之情形時，由於係用加熱輥壓接膜與銅箔，因此銅箔經加熱輥急速地加熱，朝向(200)方位之配向度不會變高。
另外，專利文獻3所記載之技術因為將積層速度放慢一定程度，而銅箔於積層時經緩慢地加熱，而提高了朝向(200)方位之配向度，但放慢積層速度，則會存在生產性降低之問題。
因此，本發明之目的在於提供一種彎曲性與生產性皆優異之覆銅積層板之製造方法、其所使用之銅箔、及覆銅積層板之積層裝置。
本發明之覆銅積層板之製造方法係於以積層法將銅箔與樹脂層加熱積層之前，進行如下預備加熱，即，將上述銅箔於3秒以內升溫至220～280℃之到達溫度，且保持在上述到達溫度1秒～5秒。
本發明之覆銅積層板之製造方法係於以積層法將銅箔與樹脂層加熱積層之前，對上述銅箔進行預備加熱，使得再結晶晶粒所占之面積率於上述銅箔表面之金屬組織中為10%以上80%以下，且使上述預備加熱後之上述銅箔之拉伸強度為上述預備加熱前之拉伸強度的40～90%。
較佳為在與上述加熱積層相同之生產線上進行上述預備加熱。
較佳為藉由上述銅箔與熱源之直接接觸、或者藉由來自熱源之輻射熱而進行上述預備加熱。
本發明之銅箔用於上述覆銅積層板之製造方法，當使此銅箔直接接觸於保持於250℃之熱源1秒鐘～5秒鐘時，其本身之表面之金屬組織中再結晶晶粒所占之面積率為10～80%，且上述接觸後之上述銅箔之拉伸強度為上述接觸前之拉伸強度的40～90%，之後使該銅箔直接接觸於保持於350℃之熱源1秒鐘～5秒鐘時，I/I0(200)成為60以上。另外，再結晶晶粒所占之面積為10～80%即可，但更佳為40～80%。其原因在於，於此情形時，使上述銅箔與保持於350℃之熱源直接接觸1秒鐘～5秒鐘時之I/I0(200)超過65，從而可獲得更高之彎曲性。
於本發明之銅箔中，較佳為含有合計0.05質量%以下之選自Ag及Sn之群之1種以上。
本發明之覆銅積層板之積層裝置係將銅箔與樹脂層連續積層，其具備：預備加熱裝置，其對上述銅箔進行預備加熱；以及熱壓機，其配置於上述預備加熱裝置之後段，對樹脂層與經上述預備加熱之銅箔進行加熱積層。
根據本發明，可獲得彎曲性與生產性皆優異之覆銅積層板。
為了獲得發揮高彎曲性之撓性覆銅積層板，重點在於在成為積層板之時間點，使銅箔之金屬組織再結晶成為對彎曲性而言較佳之狀態。彎曲性最佳之金屬組織係立方體方位非常發達，且晶界較少、換言之為結晶晶粒較大之組織。此處，立方體方位之發達程度可藉由200面之X射線繞射強度比I/I0(I：銅箔之200面之繞射強度，I0：銅粉末之200面之繞射強度)之大小來表示，該值越大，表示立方體方位越發達。
另一方面，若將積層為撓性覆銅積層板之前的銅箔材料預先以適於(200)方位之再結晶之溫度範圍充分地進行退火而提高朝向(200)方位之配向度，則彎曲性變佳，但由於經再結晶之銅箔非常柔軟，故於操作時容易產生彎折或皺褶。因此，對於尚未安裝於積層裝置的銅箔線圈而言，銅箔需要一定程度之強度，而欲充分提高朝向(200)方位之配向度則較困難。
因此，若將銅箔進行預備加熱使其局部再結晶而充分地提高朝向(200)方位之配向度之後，再與樹脂層積層，則可賦予CCL彎曲性。特別是若將銅箔線圈於連續積層裝置之生產線上進行預備加熱，並於同一生產線上立即與樹脂層積層，則可在不考慮銅箔強度之下於積層前使銅箔局部再結晶，使朝向(200)方位之配向度提高以賦予彎曲性。
以下，對本發明之實施形態之覆銅積層板之製造方法加以說明。
再者，於本發明中，只要無特別說明，則%係表示質量%(質量%)。圖1表示本發明之覆銅積層板之積層裝置1之構成例。再者，圖1之積層裝置1係雙面CCL用之裝置，首先，於第1銅箔4上塗佈清漆狀之樹脂組成物2a，使其硬化而形成樹脂層2。然後，於該單面CCL之樹脂層2面疊合第2銅箔6，並以積層輥20、21進行加熱積層。
因此，於圖1之積層裝置1中，第2銅箔6之預備加熱成為本發明之對象。
圖1中，積層裝置1具備：對銅箔6進行預備加熱之1對加熱輥(預備加熱裝置)30、31；以及配置於加熱輥30、31後段之1對積層輥20、21(熱壓機)。將線圈狀之銅箔6捲出，以加熱輥30、31進行預備加熱(於積層裝置1之同一生產線上)後，立即連續地導入至積層輥20、21。加熱輥30、31與積層輥20、21位於積層裝置1之同一生產線上。而且，加熱輥30、31位於緊靠積層輥20、21之前方之位置(加熱輥30、31與積層輥20、21之間無其他輥)。因此，可在不考慮銅箔強度之下以加熱輥30、31對銅箔6充分地進行預備加熱而使其再結晶化後，再導入至積層輥20、21。
具體說明圖1中之覆銅積層板之製造方法。首先，將線圈狀之第1銅箔4連續地捲出，於其單面，使用施料輥機(application roller)10、11連續地塗佈清漆狀之樹脂組成物2a。該樹脂組成物2a硬化後成為樹脂層2。其次，將塗佈有樹脂組成物2a之第1銅箔4導入至乾燥裝置15中，使樹脂組成物2a硬化(或半硬化)。以此方式於第1銅箔4之單面形成樹脂層，獲得單面覆銅積層板。此處，有時亦會於第1步驟結束後捲繞成線圈狀進行第2步驟。
其次，將線圈狀之第2銅箔6連續地捲出，以加熱輥30、31進行如下預備加熱，即，將第2銅箔6於3秒以內升溫至220～280℃之到達溫度，且保持在該到達溫度1秒～5秒。藉此，將第2銅箔6於適度地再結晶化之狀態下積層。另外，只要升溫及保持溫度之條件係包含於上述條件範圍內之條件，則該預備加熱既可由單一之加熱裝置進行，亦可由多個加熱裝置進行。
此處，若於上述到達溫度下之保持時間未達1秒，則銅箔6之再結晶集合組織並不夠發達。認為其原因在於，於優先方位成長以前，會隨機地引起再結晶晶粒之核生成，導致各自成長。若使於上述到達溫度下之保持時間為1秒以上，則僅可使易於再結晶之優先方位進行核生成，藉由其後之積層法中之加熱積層時之加熱，可使由預備加熱所生成之優先方位之核成長。另一方面，若保持時間超過5秒，則生產性降低。
另外，若到達溫度未達220℃，則銅箔6之再結晶集合組織並不夠發達，而且，由於保持時間變長而導致生產性降低。若到達溫度超過280℃，則銅箔整體會再結晶，變得接近於完全軟化，強度降低，而加熱積層變得困難。進而，由於係將銅箔以短時間加熱至高溫，因此於優先方位成長之前會隨機地引起再結晶晶粒之核生成，朝向(200)方位之配向度不會變高。而且，若到達溫度超過280℃，則銅箔表面會氧化而使蝕刻性或與樹脂層之密合性降低、或銅箔表面之防銹劑揮發而使保存性降低。
藉由該預備加熱將銅箔6之再結晶率(於銅箔6表面之金屬組織中，再結晶晶粒所占之面積率)調整為10～80%，將拉伸強度調整為預備加熱前之40～90%。此處，以((預備加熱後之拉伸強度)/(預備加熱前之拉伸強度))×100來規定「拉伸強度比」。
圖2係示意性地表示由預備加熱產生之銅箔之再結晶率與拉伸強度比之關係。若再結晶率未達10%，則銅箔6之再結晶集合組織並不足夠發達，若再結晶率超過80%，則銅箔整體會再結晶，接近於完全軟化，而強度降低，加熱積層變得困難。
另外，若拉伸強度超過預備加熱前之90%，則再結晶率亦未達10%，銅箔6之再結晶集合組織並不足夠發達。於拉伸強度未達預備加熱前之40%之情形時，再結晶率亦超過80%，銅箔整體會再結晶，而接近於完全軟化。
預備加熱亦可於與利用積層輥20、21等之加熱積層(積層壓製)不同之生產線上進行，亦可於同一生產線上進行。但是，於由於預備加熱而導致銅箔之強度大幅降低之情形時，為防止產生皺褶或彎折，較佳為於同一生產線上進行加熱積層與預備加熱。
預備加熱之方法並無特別限制，但較佳為藉由銅箔與熱源之直接接觸、或者藉由來自熱源之輻射熱而進行。其原因在於，一般於銅箔之熱處理中所使用之對流式加熱裝置(退火爐等)因材料之升溫速度較慢而難以獲得特定之熱處理條件，而且由於設備大型化而難以與積層之熱壓機設置於同一生產線上。
銅箔與熱源之直接接觸法之具體例，可舉出上述加熱輥30、31。來自熱源之輻射熱法之具體例，可舉出紅外線加熱(IR加熱)。
並且，例如於加熱至350～400℃之積層輥20、21之間使樹脂層2(背面積層有第1銅箔4者)及第2銅箔6連續地通過。此時，使第2銅箔6對準第1銅箔4之樹脂層2側而進行加熱積層(laminate)，獲得雙面覆銅積層板8。將雙面覆銅積層板8適當地捲繞成線圈。
本發明之覆銅積層板製造方法所使用之銅箔(相當於第2銅箔6)具有下述特性：使其與保持於250℃之熱源直接接觸1秒鐘～5秒鐘時，於自身之表面之金屬組織中再結晶晶粒所占之面積率為10～80%，且上述接觸後之上述銅箔之拉伸強度為上述接觸前之拉伸強度的40～90%，其後使其與保持於350℃之熱源直接接觸1秒鐘～5秒鐘，此時I/I0(200)成為60以上。
與保持於250℃之熱源接觸後之銅箔之特性係表示經上述預備加熱而獲得之特性。另外，直接接觸於保持於350℃之熱源1秒鐘～5秒鐘時之特性係表示經過利用積層之加熱積層時的加熱所獲得之特性，若I/I0(200)為60以上，則所獲得之CCL之彎曲性優異。
另外，本發明之覆銅積層板製造方法所使用之銅箔之組成並無限制，但較佳為精銅(JIS-1100)、無氧銅(JIS-1020)、以及該等中含有合計0.05質量%以下的選自Ag及Sn之群之1種以上者。若選自Ag及Sn之群之1種以上之合計量超過0.05質量%，則會防礙銅箔之再結晶，故有可能無法藉由預備加熱而獲得特定之組織。
為了促進銅箔之再結晶，銅箔之半軟化溫度較佳為100℃～200℃。半軟化溫度更佳為100℃～140℃左右。此處所謂半軟化溫度，係指使30分鐘退火後之強度成為退火前之強度與完全再結晶狀態下之強度的中間值之退火溫度。
樹脂層2，可使用：聚醯亞胺；PET(聚對酞酸乙二酯)；環氧樹脂、酚樹脂等熱硬化性樹脂；飽和聚酯樹脂等熱可塑性樹脂；但並不限定於該等。另外，亦可將使該等樹脂層之成分溶解於溶劑中所得之清漆(例如，聚醯亞胺之前驅物之聚醯胺酸溶液)塗佈於第1銅箔4之單面上並加熱，藉此去除溶媒而進行反應(例如醯亞胺化反應)，使其硬化。可使樹脂層2之厚度為例如1～15μm左右。
另外，樹脂層2亦可使用膜狀者，並將其加熱積層於第1銅箔4及/或第2銅箔6。
雙面CCL用之覆銅積層板之積層裝置，除如上所述於銅箔4之單面上以澆鑄法形成樹脂層2後使銅箔6對準該樹脂層2面而進行加熱積層之裝置外，亦可為於樹脂膜之兩面加熱積層銅箔之裝置。於後者之情形時，可於樹脂膜之兩面同時加熱積層2片銅箔，亦可於樹脂膜之單面加熱積層第1銅箔之後，加熱積層第2銅箔。於此情形時，較佳為設置對第1銅箔及第2銅箔均進行預備加熱之預備加熱裝置。
單面CCL用之覆銅積層板之積層裝置，可舉出於樹脂膜之單面加熱積層第1銅箔之裝置，設置對銅箔進行預備加熱之預備加熱裝置。
進而，於樹脂膜加熱積層銅箔時，可使用於樹脂膜側預先形成有接著層者，但亦可不使用接著層而將樹脂膜與銅箔進行加熱積層。另外，樹脂膜與接著層之組成不同者成為3層CCL，當樹脂膜與接著層之組成相同時，加熱積層後成為由銅箔與樹脂膜積層而成之2層CCL。
實施例
<銅箔>
使用以如下方法獲得之銅箔：製造表1所示之組成之鑄錠，利用熱軋加工至10mm左右，反覆實施冷軋與退火而進行製造，於冷軋後，於表1所示之條件下進行預備加熱。預備加熱係以加熱至特定溫度之2片銅板夾持銅箔(下述彎曲性之評價中之CCL)而進行。銅箔之組成如表所示。銅箔係以99%之最終加工度進行壓延，使厚度為18μm。對預備加熱後之箔之單面實施化學處理(銅系粗化鍍敷)，供CCL之積層用。
測定預備加熱前後之銅箔之再結晶率、拉伸強度比，進而測定預備加熱後之銅箔之半軟化溫度。再結晶率之測定係利用電子顯微鏡觀察銅箔表面，將所獲得之圖像進行二元化後，將其進行圖像解析，計算再結晶部之面積率。拉伸強度係依據JIS。
另外，以加熱至350℃之2片銅板夾持預備加熱後之銅箔並保持1秒鐘後，測定200面之X射線繞射強度比I/I0。
<CCL之製造>
用以藉由積層法而製造雙層撓性覆銅積層板之聚醯亞胺膜，係使用於兩面塗佈有熱可塑性聚醯亞胺作為接著劑之厚度25μm之膜(宇部興產公司製造之Upilex VT)。表面之熱可塑性聚醯亞胺接著劑並非與核心部之聚醯亞胺膜不同種類之樹脂，與銅箔積層之後，整體成為基體樹脂並成為雙層撓性覆銅積層板。
於兩面具有接著劑之上述聚醯亞胺膜之兩面，將上述預備加熱後之2片銅箔以化學處理面分別面向膜之方式疊合，將膜夾入於各銅箔進行積層，利用約300℃之加熱輥以3m/分之通箔速度進行加熱積層(laminate)。
<彎曲性之評價>
以積層法獲得之雙層撓性覆銅積層板(CCL)中，以氯化鐵水溶液蝕刻去除其中一片銅箔。此後，使用已知之光蝕刻法技術，於殘餘之銅箔上形成電路寬200μm之配線，將塗佈有環氧系接著劑之聚醯亞胺膜作為覆蓋層進行熱壓接，製作彎曲試驗用之FPC。
使用IPC滑動彎曲試驗機，對上述FPC片施加使其以彎曲半徑1mm反覆進行每分鐘100次之滑動的負荷，在配線之電阻自初始上升10%後之彎曲次數時停止。將彎曲次數超過10萬次之情形判定為良(○)，未達10萬次之情形判定為差(×)。
關於搬運性，於積層後之CCL中，將每1m通過長度上產生5處以上之由彎折或皺褶引起的銅箔之孔或破裂者評價為×。
另外，關於生產性，將預備加熱之保持時間超過5秒者評價為×。
將所獲得之結果示於表1。再者，表1之TPC表示精銅(JIS-1100)，OFC表示無氧銅(JIS-1020)。另外，例如Ag190ppm－TPC表示於TPC中添加有190質量ppm之Ag之組成。
由表1顯然可知，於各實施例之情形時，在藉由積層法進行加熱積層之前，進行如下預備加熱，即，將銅箔於3秒以內升溫至220～280℃之到達溫度，且保持在該到達溫度1秒～5秒。因此，於模擬積層時之加熱之350℃×1秒之加熱後，銅箔之200面之配向度成為60以上，從而成為生產性、搬運性及彎曲性均優異者。
圖3表示預備加熱後之實施例1之銅箔之組織的顯微鏡照片，圖4表示預備加熱後進而進行350℃×1秒之加熱後的實施例1之銅箔之組織的顯微鏡照片。可知，藉由預備加熱而使局部產生再結晶組織，進而藉由積層時之加熱(350℃×1秒)而使再結晶組織增加。
另一方面，於未進行預備加熱之比較例6、及預備加熱時之到達溫度未達220℃之比較例1、3之情形時，350℃×1秒之加熱後之銅箔之200面的配向度均未達60，所獲得之CCL之彎曲性較差。
於到達預備加熱時之到達溫度之升溫時間超過3秒之比較例2之情形時，即便到達溫度與保持時間適當，亦不會獲得充分之再結晶率，所獲得之CCL之彎曲性較差。認為其原因在於，由於銅箔長時間曝露於低溫下而導致成為再結晶之驅動力之差排被釋放。再者，比較例2係模擬升溫速度較慢之對流式加熱裝置(退火爐等)之例。
另外，於預備加熱時之到達溫度超過280℃之比較例4、5之情形時，再結晶率成為100%而接近於完全軟化，強度降低，搬運性較差。另外，350℃×1秒之加熱後之銅箔之200面之配向度亦未達60，所獲得之CCL之彎曲性較差。
於預備加熱時之保持時間超過5秒之比較例7之情形時，預備加熱時間變長，生產性較差，並且再結晶率成為100%而接近於完全軟化，強度降低，搬運性較差。
於銅箔中之Sn之添加量超過0.05質量%(500ppm)之比較例8之情形時，即便進行預備加熱亦不會產生再結晶，350℃×1秒之加熱後之銅箔之200面之配向度未達60，所獲得之CCL之彎曲性較差。
1．．．覆銅積層板之積層裝置
2．．．樹脂層
2a．．．樹脂組成物
4．．．第1銅箔
6．．．第2銅箔
8．．．雙面覆銅積層板
10、11．．．施料輥機
15．．．乾燥裝置
20、21．．．積層輥(熱壓機)
30、31．．．加熱輥(預備加熱裝置)
圖1係表示本發明之實施形態之覆銅積層板之積層裝置圖。
圖2係示意性地表示由預備加熱產生之銅箔之再結晶率與拉伸強度比的關係圖。
圖3係表示預備加熱後之實施例1之銅箔之組織的顯微鏡照片圖。
圖4係預備加熱後再進行350℃×1秒加熱後之實施例1之銅箔之組織的顯微鏡照片圖。
2．．．樹脂層
2a．．．樹脂組成物
4．．．第1銅箔
6．．．第2銅箔
8．．．雙面覆銅積層板
10、11．．．施料輥機
15．．．乾燥裝置
20、21．．．積層輥(熱壓機)
30、31．．．加熱輥(預備加熱裝置)

Claims (7)

  1. 一種覆銅積層板之製造方法，其特徵在於：於以積層法將銅箔與樹脂層加熱積層之前，進行如下預備加熱，即，將該銅箔於3秒以內升溫至220~280℃之到達溫度，且保持在該到達溫度1秒~5秒；藉由該預備加熱，使得該預備加熱後之該銅箔的再結晶晶粒所占之面積率於該銅箔表面之金屬組織中為10%以上80%以下，且使該預備加熱後之該銅箔之拉伸強度為該預備加熱前之拉伸強度的40~90%。
  2. 如申請專利範圍第1項之覆銅積層板之製造方法，其中，在與該加熱積層相同之生產線上進行該預備加熱。
  3. 如申請專利範圍第1項之覆銅積層板之製造方法，其係藉由該銅箔與熱源之直接接觸、或者藉由來自熱源之輻射熱而進行該預備加熱。
  4. 如申請專利範圍第2項之覆銅積層板之製造方法，其係藉由該銅箔與熱源之直接接觸、或者藉由來自熱源之輻射熱而進行該預備加熱。
  5. 一種銅箔，用於申請專利範圍第1至4項中任一項之覆銅積層板之製造方法，當使此銅箔直接接觸於保持於250℃之熱源1秒鐘~5秒鐘時，其本身之表面之金屬組織中再結晶晶粒所占之面積率為10~80%，且該接觸後之該銅箔之拉伸強度為該接觸前之拉伸強度的40~90%，之後使該銅箔直接接觸於保持於350℃之熱源1秒鐘~ 5秒鐘時，I/I0(200)成為60以上。
  6. 如申請專利範圍第5項之銅箔，其中，含有合計0.05質量%以下之選自Ag及Sn之群之1種以上。
  7. 一種覆銅積層板之積層裝置，係將申請專利範圍第5或6項之銅箔與樹脂層連續積層，具備：預備加熱裝置，其對該銅箔進行預備加熱；以及熱壓機，其配置於該預備加熱裝置之後段，對樹脂層與該經預備加熱之銅箔進行加熱積層。
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