CN102712138A - 覆铜层压板的制备方法、其所使用的铜箔及覆铜层压板的层压装置 - Google Patents

覆铜层压板的制备方法、其所使用的铜箔及覆铜层压板的层压装置 Download PDF

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CN102712138A
CN102712138A CN2011800067449A CN201180006744A CN102712138A CN 102712138 A CN102712138 A CN 102712138A CN 2011800067449 A CN2011800067449 A CN 2011800067449A CN 201180006744 A CN201180006744 A CN 201180006744A CN 102712138 A CN102712138 A CN 102712138A
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copper foil
mentioned
preheating
clad laminate
copper
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中室嘉一
小野俊之
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/64—Joining a non-plastics element to a plastics element, e.g. by force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
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    • B29C66/83413—Roller, cylinder or drum types cooperating rollers, cylinders or drums
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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Abstract

本发明提供挠曲性和生产能力均优异的覆铜层压板的制备方法、其所使用的铜箔，及覆铜层压板的层压装置。在通过层压法将铜箔和树脂层加热层压前，进行将铜箔在3秒以内升温至220~280℃的到达温度，并且于到达温度下保持1秒～5秒的预热。

Description

覆铜层压板的制备方法、其所使用的铜箔及覆铜层压板的层压装置
技术领域
本发明涉及在适用于电路挠曲部分的柔性印刷电路基板(FPC：Flexible Printed Circuit)中使用的柔性覆铜层压板、其所使用的铜箔及覆铜层压板的层压装置。
背景技术
目前，在移动电话等的布线中，挠曲部分所使用的FPC通过被称为流延(cast)法的方法或被称为层压法的方法制备，上述流延法为于铜箔上涂布聚酰亚胺清漆，加热干燥、固化而制成层压板的方法，上述层压法为将预先涂布有具有粘接力的热塑性聚酰亚胺的聚酰亚胺膜与铜箔重叠，通过加热辊等进行压接的方法。通过这些方法制得的柔性覆铜层压板被称为双层柔性覆铜层压板。
另外，还已知有通过环氧类等粘接剂粘接铜箔和聚酰亚胺膜的三层柔性覆铜层压板。
作为这些FPC用铜箔，已知有进行再结晶退火，使给予挠曲性的200面的I/I0为40以上的技术(专利文献1、2)。
此外，本发明人报道了在以层压法制备双层柔性覆铜层压板时，将层压速度放慢一定程度，增大铜箔的结晶粒径，提高挠曲性的技术(专利文献3)。
专利文献1：日本特开2001-323354号公报(段落0014)
专利文献2：日本特开平11-286760号公报
专利文献3：日本特开2009-292090号公报(权利要求3)。
发明内容
发明所要解决的课题
但是，在以层压法制备的CCL (Copper Clad Laminate：覆铜层压板)中，产生了铜箔在(200)方向的取向度未升高、挠曲性降低的问题。认为其原因在于：在层压法的情况下，由于通过加热辊压接膜和铜箔，所以铜箔被加热辊迅速加热，在(200)方向的取向度未升高。
另外，专利文献3所记载的技术由于将层压速度放慢一定程度，所以在层压时缓慢加热铜箔，提高在(200)方向的取向度，但若放慢层压速度，则存在生产能力降低的问题。
因此，本发明的目的在于：提供挠曲性和生产能力均优异的覆铜层压板的制备方法、其所使用的铜箔及覆铜层压板的层压装置。
解决课题的手段
本发明的覆铜层压板的制备方法为，在通过层压法将铜箔和树脂层加热层压前，进行将上述铜箔在3秒以内升温至220~280℃的到达温度、并且于上述到达温度下保持1秒~5秒的预热。
本发明的覆铜层压板的制备方法为，在通过层压法将铜箔和树脂层加热层压前，对上述铜箔进行预热，使再结晶晶粒所占的面积率在上述铜箔表面的金属组织中为10%以上且80%以下，并且使上述预热后的上述铜箔的拉伸强度为上述预热前的拉伸强度的40~90%。
优选在与上述加热层压相同的生产线上进行上述预热。
优选通过上述铜箔与热源的直接接触或来自热源的辐射热进行上述预热。
本发明的铜箔为上述覆铜层压板的制备方法中使用的铜箔，当其与保持在250℃的热源直接接触1秒~5秒时，使自身表面的金属组织中再结晶晶粒所占的面积率为10~80%，并且使上述接触后的上述铜箔的拉伸强度为上述接触前的拉伸强度的40~90%；此后当与保持在350℃的热源直接接触1秒~5秒时，使I/I0 (200)为60以上。另外，虽然再结晶晶粒所占的面积只要为10~80%即可，但更优选为40~80%。其原因在于：在此情况下与保持在350℃的热源直接接触1秒~5秒时的I/I0 (200)超过65，可获得更高的挠曲性。
在本发明的铜箔中，优选含有合计0.05%质量以下的选自Ag和Sn的1种以上。
本发明的覆铜层压板的层压装置为连续层压铜箔和树脂层的覆铜层压板的层压装置，其中，具备预热上述铜箔的预热装置，和配置于上述预热装置的后段，加热层压树脂层和经上述预热的铜箔的热压机。
发明的效果
根据本发明，可获得挠曲性和生产能力均优异的覆铜层压板。
附图说明
[图1] 示出本发明实施方式所涉及的覆铜层压板的层压装置的图。
[图2] 示意性表示由预热产生的铜箔再结晶率与拉伸强度比的关系的图。
[图3] 示出预热后实施例1的铜箔的组织显微镜照片的图。
[图4] 示出在预热后进一步以350℃×1秒加热后实施例1的铜箔的组织显微镜照片的图。
具体实施方式
为获得发挥高挠曲性的柔性覆铜层压板，重点在于：在形成层压板的时间点，使铜箔的金属组织再结晶成为对挠曲性而言优选的状态。对于挠曲性而言最优选的金属组织为立方取向非常发达，并且晶界少，即晶粒大的组织。在这里，立方取向的发达程度可以200面的X射线衍射强度比I/I0 (I：铜箔的200面的衍射强度，I0：铜粉末的200面的衍射强度)的大小表示，该值越大表示立方取向越发达。
另一方面，若将层压为柔性覆铜层压板前的铜箔材料预先在适合(200)方向的再结晶的温度范围内进行充分退火，提高在(200)方向的取向度，则挠曲性变好，但是由于再结晶的铜箔非常柔软，所以在处理时易发生弯折或褶皱。因此，对于在层压装置安装前的铜箔线圈(coil)，铜箔需要具有一定程度的强度，难以充分提高在(200)方向的取向度。
因此，若在将铜箔预热而使其部分地再结晶，充分提高在(200)方向的取向度后，与树脂层层压，则可赋予CCL挠曲性。特别是若将铜箔线圈在连续层压装置的生产线上进行预热，并在同一生产线上立即与树脂层层压，则可不考虑铜箔的强度而在层压前使铜箔部分地再结晶，提高在(200)方向的取向度，赋予挠曲性。
以下对本发明实施方式所涉及的覆铜层压板的制备方法进行说明。需说明的是，在本发明中，只要无特殊说明，%均表示%质量(%质量)。图1示出本发明的覆铜层压板的层压装置1的构成实例。需说明的是，图1的层压装置1为双面CCL用装置，首先于第1铜箔4上涂布清漆状的树脂组合物2a，固化形成树脂层2。然后，在该单面CCL的树脂层2面上叠加第2铜箔6，通过层压辊20、21进行加热层压。
因此，在图1的层压装置1中，第2铜箔6的预热成为本发明的对象。
在图1中，层压装置1具备预热铜箔6的1对加热辊(预热装置) 30、31和配置于加热辊30、31的后段的1对层压辊20、21 (热压机)。将线圈状的铜箔6卷出，在通过加热辊30、31进行预热后(在层压装置1的同一生产线上)，立即连续导入至层压辊20、21。加热辊30、31与层压辊20、21在层压装置1的同一生产线上。另外，加热辊30、31位于紧靠层压辊20、21之前的位置(加热辊30、31与层压辊20、21之间无其它辊)。因此，可在不考虑铜箔的强度而通过加热辊30、31充分预热铜箔6使其再结晶化后，导入层压辊20、21。
对图1中的覆铜层压板的制备方法进行具体说明。首先，连续卷出线圈状的第1铜箔4，在其单面使用施料辊10、11连续涂布清漆状的树脂组合物2a。该树脂组合物2a在固化后形成树脂层2。接着，将涂布有树脂组合物2a的第1铜箔4导入至干燥装置15，使树脂组合物2a固化(或半固化)。以此方式，在第1铜箔4的单面形成树脂层，获得单面覆铜层压板。在这里，也可在第1工序结束后卷绕成线圈状，进入第2工序。
接着，连续卷出线圈状的第2铜箔6，通过加热辊30、31进行在3秒以内升温至220~280℃的到达温度，并且在该到达温度下保持1秒~5秒的预热。由此，将第2铜箔6在适度再结晶化的状态下层压。另外，只要升温与保持温度的条件为上述条件范围所包含的条件，则该预热可通过单一加热装置进行，也可通过多个加热装置进行。
在这里，若在上述到达温度下的保持时间不足1秒，则铜箔6的再结晶织构不够发达。认为其原因在于：在优先取向成长以前，无规地引起再结晶晶粒的成核，导致各自成长。若将在上述到达温度下的保持时间设定为1秒以上，则可以仅在易再结晶的优先取向成核，通过此后以层压法加热层压时的加热，可使因预热生成的优先取向的核成长。另一方面，若保持时间超过5秒，则生产能力降低。
另外，若到达温度不足220℃，则铜箔6的再结晶织构不够发达，而且保持时间延长，所以生产能力降低。若到达温度超过280℃，则铜箔整体再结晶，接近完全软化，强度降低，使得加热层压变困难。此外，通过在短时间内将铜箔加热至高温，在优先取向成长前无规地引起再结晶晶粒的成核，在(200)方向的取向度并未升高。另外，若到达温度超过280℃，则铜箔表面氧化，蚀刻性或与树脂层的密合性降低，或铜箔表面的防锈剂挥发，保存性降低。
通过该预热，将铜箔6的再结晶率(在铜箔6表面的金属组织中再结晶晶粒所占的面积率)调整为10~80%，将拉伸强度调整为预热前的40~90%。在这里，以((预热后的拉伸强度)/(预热前的拉伸强度))×100来规定“拉伸强度比”。
图2示意性表示由预热造成的铜箔再结晶率与拉伸强度比的关系。若再结晶率不足10%，则铜箔6的再结晶织构不够发达，若再结晶率超过80%，则铜箔整体再结晶，接近完全软化，强度降低，使得加热层压变困难。
另外，若拉伸强度超过预热前的90%，则使得再结晶率也不足10%，铜箔6的再结晶织构不够发达。当拉伸强度不足预热前的40%时，再结晶率也超过80%，铜箔整体再结晶，接近完全软化。
预热可在与利用层压辊20、21等的加热层压(层压压制)不同的生产线上进行，也可在同一生产线上进行。但是，当铜箔的强度因预热而大幅降低时，为防止褶皱或弯折的发生，优选在同一生产线上进行加热层压和预热。
预热的方法无特殊限制，但优选通过铜箔与热源的直接接触或来自热源的辐射热进行。其原因在于：就通常在铜箔的热处理中使用的对流式加热装置(退火炉等)而言，材料的升温速度慢，难以获得规定的热处理条件，而且由于设备大型化而难以与层压的热压机设置于同一生产线上。
作为铜箔与热源的直接接触法的具体实例，可列举出上述加热辊30、31。作为来自热源的辐射热法的具体实例，可列举出红外线加热(IR加热)。
然后，例如在加热至350~400℃的层压辊20、21之间将树脂层2(背面层压有第1铜箔4)和第2铜箔6连续通过。此时，使第2铜箔6对准第1铜箔4的树脂层2一侧进行加热层压(laminate)，获得双面覆铜层压板8。将双面覆铜层压板8适当卷绕成线圈。
本发明的覆铜层压板制备方法中使用的铜箔(相当于第2铜箔6)具有以下特性：当与保持在250℃的热源直接接触1秒~5秒时，在自身表面的金属组织中再结晶晶粒所占的面积率为10~80%，并且上述接触后的上述铜箔的拉伸强度为上述接触前的拉伸强度的40~90%，并且此后当与保持在350℃的热源直接接触1秒~5秒时，I/I0 (200)为60以上。
与保持在250℃的热源接触后的铜箔的特性表示通过上述预热获得的特性。另外，与保持在350℃的热源直接接触1秒~5秒时的特性表示通过利用层压加热层压时的加热获得的特性，若I/I0 (200)为60以上，则获得的CCL的挠曲性优异。
另外，对本发明的覆铜层压板制备方法中使用的铜箔的组成无限制，但优选韧铜(JIS-1100)、无氧铜(JIS-1020)以及在它们中含有合计0.05%质量以下的选自Ag和Sn的1种以上的物质。若选自Ag和Sn的1种以上的合计量超过0.05%质量，则由于妨碍铜箔的再结晶，存在无法通过预热获得规定的组织的可能性。
为促进铜箔的再结晶，铜箔的半软化温度优选为100℃~200℃。半软化温度进一步优选为100℃~140℃左右。在这里，半软化温度指使30分钟退火后的强度成为退火前的强度与完全再结晶状态下的强度的中间值的退火温度。
作为树脂层2，可使用聚酰亚胺；PET(聚对苯二甲酸乙二醇酯)；环氧树脂、酚醛树脂等热固性树脂；饱和聚酯树脂等热塑性树脂，但并不限定于此。另外，也可将在溶剂中溶解这些树脂层成分而成的清漆(例如作为聚酰亚胺前体的聚酰胺酸溶液)涂布于第1铜箔4的单面，通过加热除去溶剂而进行反应(例如酰亚胺化反应)，使之固化。可使树脂层2的厚度为例如1~15μm左右。
另外，作为树脂层2，也可使用膜状树脂层，将其加热层压于第1铜箔4和/或第2铜箔6上。
作为双面CCL用覆铜层压板的层压装置，除如上所述在铜箔4的单面通过流延法形成树脂层2后、使铜箔6对准该树脂层2表面进行加热层压的装置外，也可为在树脂膜的两面加热层压铜箔的装置。在后者的情况下，可在树脂膜的两面同时加热层压2张铜箔，也可在树脂膜的单面加热层压第1铜箔，然后加热层压第2铜箔。此时，设置对第1铜箔和第2铜箔均进行预热的预热装置为宜。
作为单面CCL用覆铜层压板的层压装置，可列举出在树脂膜的单面加热层压第1铜箔的装置，设置对铜箔进行预热的预热装置。
此外，在树脂膜上加热层压铜箔时，可采用在树脂膜上预先形成粘接层，但也可不使用粘接层而加热层压树脂膜和铜箔。另外，树脂膜与粘接层的组成不同时形成3层CCL，但当树脂膜与粘接层的组成相同时，加热层压后形成将铜箔和树脂膜层压而成的2层CCL。
实施例
<铜箔>
使用如下获得的铜箔：制备具有如表1所示组成的铸锭，通过热轧加工至10mm左右，重复冷轧和退火进行制备，在冷轧后以如表1所示条件进行预热。预热通过将铜箔(下述挠曲性评价中的CCL)用加热至规定温度的2张铜板夹持来进行。铜箔的组成如表所示。铜箔以99%的最终加工度进行轧制，使厚度为18μm。对预热后的箔的单面实施化学处理(铜类粗化镀敷)，供CCL的层压使用。
测定预热前后铜箔的再结晶率、拉伸强度比，进而测定预热后铜箔的半软化温度。就再结晶率的测定而言，使用电子显微镜观察铜箔表面，将得到的图像进行二元化处理，对得到的结果进行图像解析，算出再结晶部分的面积率。拉伸强度根据JIS。
另外，在将预热后的铜箔用加热至350℃的2张铜板夹持保持1秒后，测定200面的X射线衍射强度比I/I0。
<CCL的制备>
作为用以通过层压法制备双层柔性覆铜层压板的聚酰亚胺膜，使用两面涂布有热塑性聚酰亚胺作为粘接剂的厚25μm的膜(宇部兴产社制的Upilex (ユーピレックス) VT)。表面的热塑性聚酰亚胺粘接剂并非与核心部分的聚酰亚胺膜不同种类的树脂，在与铜箔层压后，整体成为基质树脂，形成双层柔性覆铜层压板。
在两面具有粘接剂的上述聚酰亚胺膜的两面重叠上述预热后的2张铜箔，使铜箔的化学处理面各自面向膜，以各铜箔夹持膜进行层压，使用约300℃的加热辊，以3m/分的箔通过速度进行加热层压(laminate)。
<挠曲性的评价>
在通过层压法制得的双层柔性覆铜层压板(CCL)中，用氯化铁水溶液蚀刻除去一面的铜箔。然后，采用已知的光刻技术，在剩余的铜箔上形成电路宽200μm的布线，将涂布有环氧类粘接剂的聚酰亚胺膜作为覆盖层进行热压接，制备挠曲试验用FPC。
使用IPC滑动挠曲试验机，对上述FPC片施加在1mm的弯曲半径下每分钟重复滑动100次的负荷，以布线的电阻自初期上升10%的挠曲次数作为终点。将挠曲次数超过10万次的情况判定为良好(○)，将不足10万次的判定为差(×)。
就搬运性而言，在层压后的CCL中，将每1m的板通过长度下产生5处由弯折或褶皱所引起的铜箔的孔或破裂的物品评价为×。
另外，就生产能力而言，将预热的保持时间超过5秒者评价为×。
将得到的结果示出于表1中。需说明的是，表1的TPC表示韧铜(JIS-1100)，OFC表示无氧铜(JIS-1020)。另外，例如Ag190ppm-TPC表示在TPC中添加有190质量ppm的Ag的组成。
[表1]
Figure 2011800067449100002DEST_PATH_IMAGE001
由表1可知，在各实施例的情况下，在通过层压法进行加热层压前，进行将铜箔在3秒以内升温至220~280℃的到达温度，并且在该到达温度下保持1秒~5秒的预热。因此，在模拟层压时的加热的350℃×1秒加热后铜箔的200面的取向度达到60以上，生产能力、搬运性和挠曲性均优异。
图3示出预热后实施例1的铜箔的组织显微镜照片，图4示出在预热后进一步以350℃×1秒加热后实施例1的铜箔的组织显微镜照片。可知通过预热部分产生再结晶组织，进而因层压时的加热(350℃×1秒)而使再结晶组织增加。
另一方面，在未预热的比较例6和预热时的到达温度不足220℃的比较例1、3的情况下，在350℃×1秒加热后铜箔的200面的取向度均不足60，获得的CCL的挠曲性差。
在预热时至到达温度为止的升温时间超过3秒的比较例2的情况下，尽管到达温度和保持时间合适，也未获得足够的再结晶率，获得的CCL的挠曲性差。认为其原因在于：作为再结晶驱动力的位错因铜箔被长时间暴露于低温下而被释放。需说明的是，比较例2为模拟升温速度慢的对流式加热装置(退火炉等)的实例。
另外，在预热时的到达温度超过280℃的比较例4、5的情况下，再结晶率达到100%，接近完全软化，强度降低，搬运性差。另外，在350℃×1秒加热后铜箔的200面的取向度也不足60，获得的CCL的挠曲性差。
在预热时的保持时间超过5秒的比较例7的情况下，在预热时间延长、生产能力变差的同时，再结晶率达到100%，接近完全软化，强度降低，搬运性差。
在铜箔中的Sn添加量超过0.05%质量(500ppm)的比较例8的情况下，即使预热也不发生再结晶，使得在350℃×1秒加热后铜箔的200面的取向度不足60，获得的CCL的挠曲性差。
符号说明
1　　　　　　　　　覆铜层压板的层压装置
2　　　　　　　　　树脂层
6　　　　　　　　　铜箔
20、21　　　　　　层压辊(热压机)
30、31　　　　　　加热辊(预热装置)。

Claims (7)

1. 覆铜层压板的制备方法，其特征在于：在通过层压法将铜箔和树脂层加热层压前，进行将上述铜箔在3秒以内升温至220~280℃的到达温度，并且于上述到达温度下保持1秒~5秒的预热。
2. 覆铜层压板的制备方法，其特征在于：在通过层压法将铜箔和树脂层加热层压前，对上述铜箔进行预热，使再结晶晶粒所占的面积率在上述铜箔表面的金属组织中为10%以上且80%以下，并且使上述预热后的上述铜箔的拉伸强度为上述预热前的拉伸强度的40~90%。
3. 权利要求1或2的覆铜层压板的制备方法，其中，在与上述加热层压相同的生产线上进行上述预热。
4. 权利要求1~3中任一项的覆铜层压板的制备方法，其中，通过上述铜箔与热源的直接接触或来自热源的辐射热进行上述预热。
5. 权利要求1~4中任一项的覆铜层压板的制备方法中使用的铜箔，其中，
当与保持在250℃的热源直接接触1秒~5秒时，使自身表面的金属组织中再结晶晶粒所占的面积率为10~80%，并且使上述接触后的上述铜箔的拉伸强度为上述接触前的拉伸强度的40~90%，
此后当与保持在350℃的热源直接接触1秒~5秒时，使I/I0 (200)为60以上。
6. 权利要求5的铜箔，其中，含有合计0.05%质量以下的选自Ag和Sn的1种1以上。
7. 覆铜层压板的层压装置，其为将铜箔和树脂层连续层压的覆铜层压板的层压装置，其中，具备：
预热上述铜箔的预热装置，和
配置于上述预热装置的后段，将树脂层和经上述预热的铜箔加热层压的热压机。
CN2011800067449A 2010-01-21 2011-01-06 覆铜层压板的制备方法、其所使用的铜箔及覆铜层压板的层压装置 Pending CN102712138A (zh)

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