IN2012DN04891A - - Google Patents
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- Publication number
- IN2012DN04891A IN2012DN04891A IN4891DEN2012A IN2012DN04891A IN 2012DN04891 A IN2012DN04891 A IN 2012DN04891A IN 4891DEN2012 A IN4891DEN2012 A IN 4891DEN2012A IN 2012DN04891 A IN2012DN04891 A IN 2012DN04891A
- Authority
- IN
- India
- Prior art keywords
- copper
- copper foil
- metal sheet
- substrate
- applying
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 10
- 239000011889 copper foil Substances 0.000 abstract 6
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 238000000992 sputter etching Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000011241 protective layer Substances 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/12—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties
- C21D8/1244—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties the heat treatment(s) being of interest
- C21D8/1255—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties the heat treatment(s) being of interest with diffusion of elements, e.g. decarburising, nitriding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/007—Ferrous alloys, e.g. steel alloys containing silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
- Y10T428/12924—Fe-base has 0.01-1.7% carbon [i.e., steel]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
- Y10T428/12972—Containing 0.01-1.7% carbon [i.e., steel]
- Y10T428/12979—Containing more than 10% nonferrous elements [e.g., high alloy, stainless]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Coating By Spraying Or Casting (AREA)
- Laminated Bodies (AREA)
Abstract
Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed bysuchbonding, copper is diffused intothemetalsheet byheating with a copper diffusion distance of l0nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009265285A JP5517196B2 (en) | 2009-11-20 | 2009-11-20 | Superconducting compound substrate and manufacturing method thereof |
PCT/JP2010/006649 WO2011061909A1 (en) | 2009-11-20 | 2010-11-12 | Substrate for superconducting compound and method for manufacturing the substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2012DN04891A true IN2012DN04891A (en) | 2015-09-25 |
Family
ID=44059396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN4891DEN2012 IN2012DN04891A (en) | 2009-11-20 | 2010-11-12 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8993064B2 (en) |
EP (1) | EP2503560A4 (en) |
JP (1) | JP5517196B2 (en) |
KR (2) | KR101834356B1 (en) |
CN (2) | CN102667968B (en) |
IN (1) | IN2012DN04891A (en) |
RU (1) | RU2012125607A (en) |
WO (1) | WO2011061909A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110290380A1 (en) * | 2008-11-12 | 2011-12-01 | Toyo Kohan Co., Ltd. | Method for manufacturing metal laminated substrate for semiconductor element formation and metal laminated substrate for semiconductor element formation |
JP2013101832A (en) * | 2011-11-08 | 2013-05-23 | Toyo Kohan Co Ltd | Substrate for epitaxial growth and method for manufacturing the same, and substrate for superconducting wire rod |
JP5650099B2 (en) * | 2011-11-22 | 2015-01-07 | Jx日鉱日石金属株式会社 | Rolled copper foil for superconducting film formation |
JP5650098B2 (en) * | 2011-11-22 | 2015-01-07 | Jx日鉱日石金属株式会社 | Rolled copper foil for superconducting film formation |
CN103718256B (en) * | 2012-04-16 | 2016-11-16 | 古河电气工业株式会社 | Superconduction film forming base material and superconducting line and the manufacture method of superconducting line |
JP6381944B2 (en) * | 2014-04-01 | 2018-08-29 | 東洋鋼鈑株式会社 | Method for producing metal laminate |
JP6543439B2 (en) * | 2014-04-01 | 2019-07-10 | 東洋鋼鈑株式会社 | Method of manufacturing metal laminate |
CN106716559B (en) * | 2014-10-27 | 2018-07-10 | 东洋钢钣株式会社 | Superconducting wire substrate and its manufacturing method and superconducting wire |
US10832843B2 (en) * | 2015-03-17 | 2020-11-10 | The University Of Houston System | Superconductor compositions |
JP6074527B2 (en) * | 2016-03-08 | 2017-02-01 | 東洋鋼鈑株式会社 | Epitaxial growth substrate, manufacturing method thereof, and substrate for superconducting wire |
KR102511594B1 (en) * | 2017-03-29 | 2023-03-17 | 도요 고한 가부시키가이샤 | rolled joints |
JP7162960B2 (en) * | 2018-08-06 | 2022-10-31 | 東洋鋼鈑株式会社 | Rolled bonded body, manufacturing method thereof, and heat dissipation reinforcing member for electronic equipment |
KR102174616B1 (en) * | 2019-09-18 | 2020-11-05 | 황교찬 | Payment system and payment method thereof |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003193211A (en) * | 2001-12-27 | 2003-07-09 | Nippon Mining & Metals Co Ltd | Rolled copper foil for copper-clad laminate |
EP1640999A4 (en) * | 2003-03-31 | 2010-01-27 | Int Superconductivity Tech | Metal base plate for oxide superconductive wire rod, oxide superconductive wire rod and process for producing the same |
JP4155124B2 (en) * | 2003-06-30 | 2008-09-24 | 住友金属工業株式会社 | Metal clad plate and manufacturing method thereof |
JP5123462B2 (en) * | 2004-10-27 | 2013-01-23 | 住友電気工業株式会社 | Film-forming alignment substrate, superconducting wire, and method for manufacturing film-forming alignment substrate |
AU2006346993B8 (en) * | 2005-07-29 | 2011-03-24 | American Superconductor Corporation | High temperature superconducting wires and coils |
JP4800740B2 (en) * | 2005-10-21 | 2011-10-26 | 財団法人国際超電導産業技術研究センター | Rare earth tape-shaped oxide superconductor and method for producing the same |
JP5074083B2 (en) * | 2007-04-17 | 2012-11-14 | 中部電力株式会社 | Clad-oriented metal substrate for epitaxial thin film formation and manufacturing method thereof |
JP5203626B2 (en) | 2007-04-17 | 2013-06-05 | 中部電力株式会社 | Clad-oriented metal substrate for epitaxial thin film formation and manufacturing method thereof |
JP5324763B2 (en) * | 2007-08-21 | 2013-10-23 | 中部電力株式会社 | Alignment substrate for epitaxial film formation and surface modification method for alignment substrate for epitaxial film formation |
JP5382911B2 (en) * | 2008-11-12 | 2014-01-08 | 東洋鋼鈑株式会社 | Method for producing metal laminated substrate for oxide superconducting wire and oxide superconducting wire using the substrate |
-
2009
- 2009-11-20 JP JP2009265285A patent/JP5517196B2/en active Active
-
2010
- 2010-11-12 CN CN201080051041.3A patent/CN102667968B/en active Active
- 2010-11-12 RU RU2012125607/07A patent/RU2012125607A/en not_active Application Discontinuation
- 2010-11-12 CN CN201410324551.3A patent/CN104091647B/en active Active
- 2010-11-12 KR KR1020177005588A patent/KR101834356B1/en active IP Right Grant
- 2010-11-12 US US13/510,406 patent/US8993064B2/en active Active
- 2010-11-12 KR KR1020127012288A patent/KR101763850B1/en active IP Right Grant
- 2010-11-12 EP EP10831308.1A patent/EP2503560A4/en not_active Withdrawn
- 2010-11-12 IN IN4891DEN2012 patent/IN2012DN04891A/en unknown
- 2010-11-12 WO PCT/JP2010/006649 patent/WO2011061909A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR101834356B1 (en) | 2018-03-05 |
US20130040821A1 (en) | 2013-02-14 |
RU2012125607A (en) | 2013-12-27 |
EP2503560A4 (en) | 2017-12-20 |
JP5517196B2 (en) | 2014-06-11 |
WO2011061909A1 (en) | 2011-05-26 |
KR20170026650A (en) | 2017-03-08 |
CN102667968B (en) | 2014-07-09 |
KR20120091206A (en) | 2012-08-17 |
EP2503560A1 (en) | 2012-09-26 |
CN102667968A (en) | 2012-09-12 |
KR101763850B1 (en) | 2017-08-01 |
JP2011108592A (en) | 2011-06-02 |
CN104091647A (en) | 2014-10-08 |
US8993064B2 (en) | 2015-03-31 |
CN104091647B (en) | 2017-10-24 |
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