JP2011097042A - ボンディングキャピラリー - Google Patents

ボンディングキャピラリー Download PDF

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Publication number
JP2011097042A
JP2011097042A JP2010220356A JP2010220356A JP2011097042A JP 2011097042 A JP2011097042 A JP 2011097042A JP 2010220356 A JP2010220356 A JP 2010220356A JP 2010220356 A JP2010220356 A JP 2010220356A JP 2011097042 A JP2011097042 A JP 2011097042A
Authority
JP
Japan
Prior art keywords
bonding
bonding capillary
attenuation
bottleneck
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010220356A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011097042A5 (enExample
Inventor
Masao Wada
匡央 和田
Mamoru Sakurai
衛 櫻井
Yuichi Yoshii
雄一 吉井
Kenji Uchimura
健志 内村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to KR1020127007378A priority Critical patent/KR20120062813A/ko
Priority to PCT/JP2010/067114 priority patent/WO2011040543A1/ja
Priority to JP2010220356A priority patent/JP2011097042A/ja
Priority to CN201080042841.9A priority patent/CN102549730B/zh
Priority to PH1/2012/500611A priority patent/PH12012500611A1/en
Publication of JP2011097042A publication Critical patent/JP2011097042A/ja
Publication of JP2011097042A5 publication Critical patent/JP2011097042A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2010220356A 2009-09-30 2010-09-30 ボンディングキャピラリー Pending JP2011097042A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020127007378A KR20120062813A (ko) 2009-09-30 2010-09-30 본딩 캐피러리
PCT/JP2010/067114 WO2011040543A1 (ja) 2009-09-30 2010-09-30 ボンディングキャピラリー
JP2010220356A JP2011097042A (ja) 2009-09-30 2010-09-30 ボンディングキャピラリー
CN201080042841.9A CN102549730B (zh) 2009-09-30 2010-09-30 焊接劈刀
PH1/2012/500611A PH12012500611A1 (en) 2009-09-30 2010-09-30 Bonding capillary

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009228080 2009-09-30
JP2010220356A JP2011097042A (ja) 2009-09-30 2010-09-30 ボンディングキャピラリー

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013216806A Division JP2014007430A (ja) 2009-09-30 2013-10-17 ボンディングキャピラリー

Publications (2)

Publication Number Publication Date
JP2011097042A true JP2011097042A (ja) 2011-05-12
JP2011097042A5 JP2011097042A5 (enExample) 2012-10-18

Family

ID=43826355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010220356A Pending JP2011097042A (ja) 2009-09-30 2010-09-30 ボンディングキャピラリー

Country Status (5)

Country Link
JP (1) JP2011097042A (enExample)
KR (1) KR20120062813A (enExample)
CN (1) CN102549730B (enExample)
PH (1) PH12012500611A1 (enExample)
WO (1) WO2011040543A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039032A (ja) * 2010-08-11 2012-02-23 Fujitsu Ltd ワイヤボンディング装置用キャピラリ及び超音波トランスデューサ
JP2014007430A (ja) * 2009-09-30 2014-01-16 Toto Ltd ボンディングキャピラリー
KR20180060979A (ko) 2016-11-28 2018-06-07 토토 가부시키가이샤 본딩 캐필러리

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5376413B1 (ja) * 2013-01-25 2013-12-25 Ｔｏｔｏ株式会社 ボンディングキャピラリ

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0799202A (ja) * 1993-04-30 1995-04-11 Matsushita Electric Ind Co Ltd ワイヤボンディング装置用のキャピラリー及びそのキャピラリーを用いた電気的接続バンプの形成方法
JPH09107001A (ja) * 1995-10-13 1997-04-22 Matsushita Electric Ind Co Ltd キャピラリツールの形状選定方法
JPH1064941A (ja) * 1996-08-21 1998-03-06 Shinkawa Ltd ワイヤボンディング装置用キャピラリ
JP2000091372A (ja) * 1998-09-11 2000-03-31 Matsushita Electronics Industry Corp 電子部品及びそのワイヤボンディングに使用するキャピラリ
JP2001291736A (ja) * 2000-04-06 2001-10-19 Seiko Epson Corp ワイヤボンディング用キャピラリ
JP2005197417A (ja) * 2004-01-06 2005-07-21 Seiko Instruments Inc キャピラリ及びキャピラリ再生方法
JP2007150225A (ja) * 2005-11-28 2007-06-14 Ri Seikyu ワイヤボンディング装置用キャピラリ
JP2009147185A (ja) * 2007-12-17 2009-07-02 Fujitsu Ltd ワイヤボンディング方法およびワイヤボンディング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US20040211814A1 (en) * 2003-04-23 2004-10-28 Jackson Hsieh Wire bonding capillary for an image sensor
JP4137061B2 (ja) * 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
US7597231B2 (en) * 2006-04-10 2009-10-06 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0799202A (ja) * 1993-04-30 1995-04-11 Matsushita Electric Ind Co Ltd ワイヤボンディング装置用のキャピラリー及びそのキャピラリーを用いた電気的接続バンプの形成方法
JPH09107001A (ja) * 1995-10-13 1997-04-22 Matsushita Electric Ind Co Ltd キャピラリツールの形状選定方法
JPH1064941A (ja) * 1996-08-21 1998-03-06 Shinkawa Ltd ワイヤボンディング装置用キャピラリ
JP2000091372A (ja) * 1998-09-11 2000-03-31 Matsushita Electronics Industry Corp 電子部品及びそのワイヤボンディングに使用するキャピラリ
JP2001291736A (ja) * 2000-04-06 2001-10-19 Seiko Epson Corp ワイヤボンディング用キャピラリ
JP2005197417A (ja) * 2004-01-06 2005-07-21 Seiko Instruments Inc キャピラリ及びキャピラリ再生方法
JP2007150225A (ja) * 2005-11-28 2007-06-14 Ri Seikyu ワイヤボンディング装置用キャピラリ
JP2009147185A (ja) * 2007-12-17 2009-07-02 Fujitsu Ltd ワイヤボンディング方法およびワイヤボンディング装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007430A (ja) * 2009-09-30 2014-01-16 Toto Ltd ボンディングキャピラリー
JP2012039032A (ja) * 2010-08-11 2012-02-23 Fujitsu Ltd ワイヤボンディング装置用キャピラリ及び超音波トランスデューサ
KR20180060979A (ko) 2016-11-28 2018-06-07 토토 가부시키가이샤 본딩 캐필러리

Also Published As

Publication number Publication date
PH12012500611A1 (en) 2017-08-23
KR20120062813A (ko) 2012-06-14
CN102549730B (zh) 2015-02-11
CN102549730A (zh) 2012-07-04
WO2011040543A1 (ja) 2011-04-07

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