CN102549730B - 焊接劈刀 - Google Patents

焊接劈刀 Download PDF

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Publication number
CN102549730B
CN102549730B CN201080042841.9A CN201080042841A CN102549730B CN 102549730 B CN102549730 B CN 102549730B CN 201080042841 A CN201080042841 A CN 201080042841A CN 102549730 B CN102549730 B CN 102549730B
Authority
CN
China
Prior art keywords
welding
bonding
capillary
diameter
attenuation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080042841.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN102549730A (zh
Inventor
和田匡央
櫻井卫
吉井雄一
内村健志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of CN102549730A publication Critical patent/CN102549730A/zh
Application granted granted Critical
Publication of CN102549730B publication Critical patent/CN102549730B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CN201080042841.9A 2009-09-30 2010-09-30 焊接劈刀 Expired - Fee Related CN102549730B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009228080 2009-09-30
JP2009-228080 2009-09-30
JP2010-220356 2010-09-30
PCT/JP2010/067114 WO2011040543A1 (ja) 2009-09-30 2010-09-30 ボンディングキャピラリー
JP2010220356A JP2011097042A (ja) 2009-09-30 2010-09-30 ボンディングキャピラリー

Publications (2)

Publication Number Publication Date
CN102549730A CN102549730A (zh) 2012-07-04
CN102549730B true CN102549730B (zh) 2015-02-11

Family

ID=43826355

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080042841.9A Expired - Fee Related CN102549730B (zh) 2009-09-30 2010-09-30 焊接劈刀

Country Status (5)

Country Link
JP (1) JP2011097042A (enExample)
KR (1) KR20120062813A (enExample)
CN (1) CN102549730B (enExample)
PH (1) PH12012500611A1 (enExample)
WO (1) WO2011040543A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007430A (ja) * 2009-09-30 2014-01-16 Toto Ltd ボンディングキャピラリー
JP2012039032A (ja) * 2010-08-11 2012-02-23 Fujitsu Ltd ワイヤボンディング装置用キャピラリ及び超音波トランスデューサ
JP5376413B1 (ja) * 2013-01-25 2013-12-25 Ｔｏｔｏ株式会社 ボンディングキャピラリ
JP6270256B1 (ja) 2016-11-28 2018-01-31 Toto株式会社 ボンディングキャピラリ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1098819A (zh) * 1993-04-30 1995-02-15 松下电器产业株式会社 一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法
US20040211814A1 (en) * 2003-04-23 2004-10-28 Jackson Hsieh Wire bonding capillary for an image sensor
CN1815727A (zh) * 2005-01-11 2006-08-09 株式会社海上 引线回路，具有该引线回路的半导体器件以及引线接合方法
US20070235495A1 (en) * 2006-04-10 2007-10-11 Jaime Castaneda Wire bonding capillary tool having multiple outer steps

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3022151B2 (ja) * 1993-04-30 2000-03-15 松下電器産業株式会社 ワイヤボンディング装置用のキャピラリー及びそのキャピラリーを用いた電気的接続バンプの形成方法
JP3139341B2 (ja) * 1995-10-13 2001-02-26 松下電器産業株式会社 キャピラリツールの形状選定方法
JP3333399B2 (ja) * 1996-08-21 2002-10-15 株式会社新川 ワイヤボンディング装置用キャピラリ
JP2000091372A (ja) * 1998-09-11 2000-03-31 Matsushita Electronics Industry Corp 電子部品及びそのワイヤボンディングに使用するキャピラリ
JP2001291736A (ja) * 2000-04-06 2001-10-19 Seiko Epson Corp ワイヤボンディング用キャピラリ
JP2005197417A (ja) * 2004-01-06 2005-07-21 Seiko Instruments Inc キャピラリ及びキャピラリ再生方法
KR100718889B1 (ko) * 2005-11-28 2007-05-16 이정구 투스텝 하이 보틀넥을 갖는 와이어 본딩 캐필러리
JP4941268B2 (ja) * 2007-12-17 2012-05-30 富士通株式会社 ワイヤボンディング方法およびワイヤボンディング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1098819A (zh) * 1993-04-30 1995-02-15 松下电器产业株式会社 一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法
US20040211814A1 (en) * 2003-04-23 2004-10-28 Jackson Hsieh Wire bonding capillary for an image sensor
CN1815727A (zh) * 2005-01-11 2006-08-09 株式会社海上 引线回路，具有该引线回路的半导体器件以及引线接合方法
US20070235495A1 (en) * 2006-04-10 2007-10-11 Jaime Castaneda Wire bonding capillary tool having multiple outer steps

Also Published As

Publication number Publication date
PH12012500611A1 (en) 2017-08-23
JP2011097042A (ja) 2011-05-12
KR20120062813A (ko) 2012-06-14
CN102549730A (zh) 2012-07-04
WO2011040543A1 (ja) 2011-04-07

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SE01 Entry into force of request for substantive examination
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Granted publication date: 20150211

Termination date: 20210930