JP2011086933A5 - - Google Patents

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Publication number
JP2011086933A5
JP2011086933A5 JP2010223671A JP2010223671A JP2011086933A5 JP 2011086933 A5 JP2011086933 A5 JP 2011086933A5 JP 2010223671 A JP2010223671 A JP 2010223671A JP 2010223671 A JP2010223671 A JP 2010223671A JP 2011086933 A5 JP2011086933 A5 JP 2011086933A5
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JP
Japan
Prior art keywords
film
semiconductor
forming
etching
metal
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JP2010223671A
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English (en)
Japanese (ja)
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JP2011086933A (ja
JP5851089B2 (ja
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Priority claimed from KR1020090099364A external-priority patent/KR20110042614A/ko
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Publication of JP2011086933A5 publication Critical patent/JP2011086933A5/ja
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JP2010223671A 2009-10-19 2010-10-01 半導体素子の形成方法 Active JP5851089B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0099364 2009-10-19
KR1020090099364A KR20110042614A (ko) 2009-10-19 2009-10-19 반도체 소자 및 그 형성방법

Publications (3)

Publication Number Publication Date
JP2011086933A JP2011086933A (ja) 2011-04-28
JP2011086933A5 true JP2011086933A5 (enExample) 2013-11-14
JP5851089B2 JP5851089B2 (ja) 2016-02-03

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JP2010223671A Active JP5851089B2 (ja) 2009-10-19 2010-10-01 半導体素子の形成方法

Country Status (4)

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US (3) US8466023B2 (enExample)
JP (1) JP5851089B2 (enExample)
KR (1) KR20110042614A (enExample)
TW (1) TWI506681B (enExample)

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JP2717214B2 (ja) 1988-09-06 1998-02-18 清水建設株式会社 トラベラーパイリングシステムにおける杭頭構造および杭頭処理方法
KR20110042614A (ko) 2009-10-19 2011-04-27 삼성전자주식회사 반도체 소자 및 그 형성방법
JP5933953B2 (ja) * 2011-10-06 2016-06-15 キヤノン株式会社 半導体装置の製造方法
US8803249B2 (en) * 2012-08-09 2014-08-12 Taiwan Semiconductor Manufacturing Co., Ltd. Profile pre-shaping for replacement poly gate interlayer dielectric
KR102167625B1 (ko) * 2013-10-24 2020-10-19 삼성전자주식회사 반도체 장치 및 그 제조 방법
KR101936486B1 (ko) 2014-02-03 2019-01-08 아르코닉 인코포레이티드 저항 용접 체결구, 장치 및 방법
MX2017004851A (es) 2014-10-13 2017-09-15 Arconic Inc Lamina de soldadura fuerte.
MX2017007878A (es) 2014-12-15 2018-02-13 Arconic Inc Sujetador de soldadura por resistencia, aparato y metodos para unir materiales similares y distintos.
KR102333699B1 (ko) 2014-12-19 2021-12-02 에스케이하이닉스 주식회사 고유전 금속 게이트스택의 에칭 방법
US10593034B2 (en) 2016-03-25 2020-03-17 Arconic Inc. Resistance welding fasteners, apparatus and methods for joining dissimilar materials and assessing joints made thereby
CN109585293B (zh) * 2017-09-29 2021-12-24 台湾积体电路制造股份有限公司 切割金属工艺中的基脚去除

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