JP2011086933A - 半導体素子及びその形成方法 - Google Patents
半導体素子及びその形成方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 228
- 238000000034 method Methods 0.000 title claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 103
- 239000002184 metal Substances 0.000 claims abstract description 103
- 238000005530 etching Methods 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000007789 gas Substances 0.000 claims abstract description 31
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000001301 oxygen Substances 0.000 claims abstract description 28
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 28
- 230000001681 protective effect Effects 0.000 claims description 112
- 239000002245 particle Substances 0.000 claims description 68
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 52
- 229910052757 nitrogen Inorganic materials 0.000 claims description 26
- 150000004767 nitrides Chemical class 0.000 claims description 24
- 239000002019 doping agent Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 description 225
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 229910052735 hafnium Inorganic materials 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 229910052715 tantalum Inorganic materials 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 229910052726 zirconium Inorganic materials 0.000 description 11
- 239000006227 byproduct Substances 0.000 description 10
- 150000002736 metal compounds Chemical class 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 229910052688 Gadolinium Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000994 depressogenic effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052727 yttrium Inorganic materials 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- -1 lanthanum group metal oxide Chemical class 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical group [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
【解決手段】半導体素子の形成方法は、半導体基板上に高誘電膜を形成する段階(S1)と、高誘電膜上に金属含有膜を形成する段階(S2)と、金属含有膜上に多結晶半導体を含む半導体膜を形成する段階(S3)と、半導体膜を異方性エッチングする段階(S4)と、半導体膜及び半導体膜に隣接した領域に反応性窒素及び/または酸素含有ガスを提供する段階(S5)と、金属含有膜及び高誘電膜を異方性エッチングする段階(S6)とを含む。
【選択図】図7
Description
本発明の他の課題は、信頼性が向上した半導体素子及びその形成方法を提供することにある。
本発明の半導体素子の形成方法は、半導体基板上に高誘電膜を形成する段階と、前記高誘電膜上に金属含有膜を形成する段階と、前記金属含有膜上に多結晶半導体を含む半導体膜を形成する段階と、前記半導体膜を異方性エッチングする段階と、前記半導体膜及び前記半導体膜に隣接した領域に反応性窒素及び/または酸素含有ガスを提供する段階と、前記金属含有膜及び前記高誘電膜を異方性エッチングする段階とを含むことができる。
一態様において、前記金属含有膜は前記保護膜及びエッチングされた前記半導体膜をエッチングマスクとして使ってエッチングされ得る。
一態様において、前記ゲート導電膜は複数の導電性金属化合物層を含むことができる。複数の前記導電性金属化合物層の間に他の高誘電膜がさらに形成され得る。
一態様において、前記半導体膜のエッチングと前記反応性窒素及び/または前記酸素含有ガスの提供は交互に複数回繰り返して実行することができる。
一態様において、前記多結晶半導体パーティクルは前記ゲートパターンの側壁上に不均一に配置され得る。
一態様において、前記半導体基板は第1領域及び第2領域を含み、前記高誘電パターン、金属含有パターン及びゲートパターンは前記第1領域及び第2領域の前記半導体基板上に配置される。前記半導体素子は前記第2領域の前記高誘電パターン及び前記金属含有パターンの間に選択的に介在されたゲート導電パターンをさらに含むことができる。
一態様において、前記保護膜は前記金属含有膜のエッチング副産物の窒化物、酸化物及び/または酸窒化物をさらに含むことができる。
一態様において、前記ゲートパターンの側壁は前記半導体基板に対して実質的に垂直である。
本発明によれば、半導体膜の異方性エッチングの途中または以後に反応性窒素及び/または酸素含有ガスが提供される。前記反応性窒素及び/または酸素含有ガスの提供によってエッチングされる半導体膜の側壁の所望しない損傷を防止することができる。これによって、エッチング損傷が最小化された半導体素子を形成することができる。また、前記エッチング損傷が最小化された半導体素子は高い信頼性を有することができる。
図1A及び図1Bを参照して、本発明の第1実施形態による半導体素子を説明する。図1Bは、図1Aに示したA領域を拡大した図である。半導体基板100が提供される。半導体基板100は第1導電型のドーパントがドーピングされたウェル領域(図示しない)を含むことができる。半導体基板100内にソース/ドレイン領域102が配置されている。ソース/ドレイン領域102は前記第1導電型と反対の導電型である第2導電型のドーパントがドーピングされた領域であり得る。
ゲート絶縁パターン112は酸化シリコン(SiO2)に比較して高い誘電率を有する絶縁物質を含むことができる。すなわち、ゲート絶縁パターン112は高誘電膜であり得る。ゲート絶縁パターン112は、Hf、Zr、Al、Ti、La、Y、Gd及びTaのうちの少なくとも1つの金属を含む金属酸化物、金属シリコン酸化物または金属シリコン酸窒化物を含むことができる。例えば、ゲート絶縁パターン112はHfSiONを含むことができる。
図2A及び図2Bを参照して、本発明の第2実施形態を説明する。図2Bは、図2Aに示したB領域を拡大した図である。図1Aを参照して説明した構成要素に対する説明は省略する。
図1A、図1B、図3A〜図3C及び図7を参照して、本発明の第3実施形態による半導体素子の形成方法を説明する。図1A及び図1Bを参照して説明した内容は省略することができる。
半導体膜141上にマスクパターン160が形成される。マスクパターン160は半導体膜141の一部を覆うことができる。
図4A及び図4Bを参照して本発明の第4実施形態による半導体素子を説明する。図4Bは、図4AのA領域を拡大した図である。第1領域及び第2領域を含む半導体基板200が提供される。前記第1領域及び前記第2領域は素子分離膜201によって分離する。前記第1領域の半導体基板200は第1導電型のドーパントがドーピングされた第1ウェル領域204を含み、前記第2領域の半導体基板200は第2導電型のドーパントがドーピングされた第2ウェル領域205を含むことができる。第1ウェル領域204内には第2導電型のドーパントがドーピングされた第1ソース/ドレイン領域202が配置され、第2ウェル領域205内には第1導電型のドーパントがドーピングされた第2ソース/ドレイン領域203が配置される。
第1下部ゲート絶縁パターン212及び第1上部ゲート絶縁パターン233は高誘電物質を含むことができる。第1下部ゲート絶縁パターン212はHf、Zr、Al、Ti、La、Y、Gd及びTaのうちの少なくとも1つの金属を含む金属酸化物、金属シリコン酸化物または金属シリコン酸窒化物を含むことができる。例えば、ゲート絶縁パターン212はHfSiONを含むことができる。第1上部ゲート絶縁パターン233はランタン族金属の酸化物を含むことができる。示したことと異なり、第1下部ゲート絶縁パターン212及び第1上部ゲート絶縁パターン233のうちのいずれか1つは省略可能である。
第1及び第2ゲートパターン242、243と第1及び第2保護膜251、252の形態は変形可能である。
本発明の第5実施形態を示す図5A及び図5Bを参照すれば、第1ゲートパターン244及び第2ゲートパターン247の側壁は第1及び第2陥没部245、248を含むことができる。第1及び第2陥没部245、248は前記側壁端の以外の部分、例えば、前記側壁の中間に配置され得る。第1及び第2陥没部245、248内に第1及び第2保護膜253、254が配置され得る。第1及び第2保護膜253、254は保護パーティクルを含むことができる。前記保護パーティクルは第1及び第2ゲートパターン244、247に含まれた物質のうちの少なくとも1つを含むことができる。第1及び第2保護膜253、254は上述の図4Aを参照して説明した第1及び第2保護膜251、252と実質的に同一の保護パーティクルを含むことができる。
図4A、図4B、図6A〜図6C及び図7を参照して本発明の第6実施形態による半導体素子の形成方法を説明する。
133 ・・・金属含有パターン
112 ・・・ゲート絶縁パターン
102 ・・・ソース/ドレイン領域
100 ・・・半導体基板
151 ・・・保護膜
Claims (10)
- 半導体基板上に高誘電膜を形成する段階と、
前記高誘電膜上に金属含有膜を形成する段階と、
前記金属含有膜上に多結晶半導体を含む半導体膜を形成する段階と、
前記半導体膜を異方性エッチングする段階と、
前記半導体膜及び前記半導体膜に隣接した領域に反応性窒素及び/または酸素含有ガスを提供する段階と、
前記金属含有膜及び前記高誘電膜を異方性エッチングする段階とを含むことを特徴とする半導体素子の形成方法。 - 前記多結晶半導体の一部は前記異方性エッチングによって前記半導体膜から離脱し、離脱した前記多結晶半導体は前記反応性窒素及び/または前記酸素含有ガスによって窒化及び/または酸化されて保護パーティクルが形成されることを特徴とする請求項1に記載の半導体素子の形成方法。
- 前記保護パーティクルはエッチングされた前記半導体膜の側壁に付着して保護膜を形成することを特徴とする請求項3に記載の半導体素子の形成方法。
- 前記保護パーティクルは前記半導体膜と異なるエッチング選択比を有することを特徴とする請求項3に記載の半導体素子の形成方法。
- 前記金属含有膜は前記保護膜及びエッチングされた前記半導体膜をエッチングマスクとして使ってエッチングされることを特徴とする請求項3に記載の半導体素子の形成方法。
- 前記半導体基板は互いに異なる導電型のドーパントを含む第1領域及び第2領域を含み、前記高誘電膜、前記金属含有膜及び前記半導体膜は前記第1領域及び前記第2領域の前記半導体基板上に形成され、
前記第2領域の前記高誘電膜及び前記金属含有膜の間にゲート導電膜を形成することをさらに含むことを特徴とする請求項1に記載の半導体素子の形成方法。 - 前記半導体膜をエッチングすることは、前記半導体膜の上部をエッチングすること及び前記半導体膜の下部をエッチングすることを含み、
前記反応性窒素及び/または前記酸素含有ガスを提供することは前記半導体膜の上部をエッチングする段階と前記半導体膜の下部をエッチングする段階との間に実行されることを特徴とする請求項1に記載の半導体素子の形成方法。 - 前記半導体膜のエッチングと前記反応性窒素及び/または前記酸素含有ガスの提供を交互に複数回繰り返すことを含むことを特徴とする請求項1に記載の半導体素子の形成方法。
- 半導体基板と、
前記半導体基板上に順に積層された高誘電パターン及び金属含有パターンと、
前記金属含有パターン上の多結晶半導体を含むゲートパターンと、
前記ゲートパターンの側壁上の保護膜とを含み、
前記保護膜は前記多結晶半導体の酸化物、窒化物及び/または酸窒化物を含むことを特徴とする半導体素子。 - 前記保護膜は、酸化及び/または窒化された多結晶半導体パーティクルを含むことを特徴とする請求項9に記載の半導体素子。
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R250 | Receipt of annual fees |
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R250 | Receipt of annual fees |
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R250 | Receipt of annual fees |
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