JP2011086700A5 - - Google Patents
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- Publication number
- JP2011086700A5 JP2011086700A5 JP2009236989A JP2009236989A JP2011086700A5 JP 2011086700 A5 JP2011086700 A5 JP 2011086700A5 JP 2009236989 A JP2009236989 A JP 2009236989A JP 2009236989 A JP2009236989 A JP 2009236989A JP 2011086700 A5 JP2011086700 A5 JP 2011086700A5
- Authority
- JP
- Japan
- Prior art keywords
- radiating plate
- heat
- heat sink
- heat radiating
- square
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009236989A JP5276565B2 (ja) | 2009-10-14 | 2009-10-14 | 放熱用部品 |
| US12/856,700 US20110083836A1 (en) | 2009-10-14 | 2010-08-16 | Heat radiating component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009236989A JP5276565B2 (ja) | 2009-10-14 | 2009-10-14 | 放熱用部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011086700A JP2011086700A (ja) | 2011-04-28 |
| JP2011086700A5 true JP2011086700A5 (enrdf_load_stackoverflow) | 2012-08-16 |
| JP5276565B2 JP5276565B2 (ja) | 2013-08-28 |
Family
ID=43853901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009236989A Active JP5276565B2 (ja) | 2009-10-14 | 2009-10-14 | 放熱用部品 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20110083836A1 (enrdf_load_stackoverflow) |
| JP (1) | JP5276565B2 (enrdf_load_stackoverflow) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2546871B1 (en) * | 2010-03-12 | 2018-12-05 | Fujitsu Limited | Method for producing a heat dissipating structure |
| KR101275792B1 (ko) * | 2010-07-28 | 2013-06-18 | 삼성디스플레이 주식회사 | 표시 장치 및 유기 발광 표시 장치 |
| JP5790023B2 (ja) * | 2011-02-25 | 2015-10-07 | 富士通株式会社 | 電子部品の製造方法 |
| JP6015009B2 (ja) * | 2012-01-25 | 2016-10-26 | 富士通株式会社 | 電子装置及びその製造方法 |
| JP6217084B2 (ja) * | 2013-01-17 | 2017-10-25 | 富士通株式会社 | 放熱構造体及びその製造方法 |
| JP6244651B2 (ja) * | 2013-05-01 | 2017-12-13 | 富士通株式会社 | シート状構造体及びその製造方法、並びに電子装置及びその製造方法 |
| US10510707B2 (en) * | 2013-11-11 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thermally conductive molding compound structure for heat dissipation in semiconductor packages |
| JP6261352B2 (ja) * | 2014-01-23 | 2018-01-17 | 新光電気工業株式会社 | カーボンナノチューブシート及び半導体装置とカーボンナノチューブシートの製造方法及び半導体装置の製造方法 |
| JP2015216199A (ja) * | 2014-05-09 | 2015-12-03 | 新光電気工業株式会社 | 半導体装置、熱伝導部材及び半導体装置の製造方法 |
| US9296056B2 (en) * | 2014-07-08 | 2016-03-29 | International Business Machines Corporation | Device for thermal management of surface mount devices during reflow soldering |
| CN107210612A (zh) * | 2015-04-27 | 2017-09-26 | 惠普发展公司，有限责任合伙企业 | 充电装置 |
| JP6927490B2 (ja) * | 2017-05-31 | 2021-09-01 | 株式会社応用ナノ粒子研究所 | 放熱構造体 |
| CN107623084B (zh) | 2017-10-13 | 2020-12-29 | 京东方科技集团股份有限公司 | 封装盖板及其制作方法 |
| JP6835244B2 (ja) * | 2017-10-27 | 2021-02-24 | 日産自動車株式会社 | 半導体装置 |
| DE102021107824A1 (de) * | 2021-03-29 | 2022-09-29 | Nanowired Gmbh | Verbindung zweier Bauteile mit einem Verbindungselement |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2709239C3 (de) * | 1977-03-03 | 1980-07-24 | Eltreva Ag, Aesch (Schweiz) | Verfahren zur Herstellung eines selektiv Sonnenwärmeenergie absorbierenden Überzugs auf einem Metallsubstrat |
| US5214563A (en) * | 1991-12-31 | 1993-05-25 | Compaq Computer Corporation | Thermally reactive lead assembly and method for making same |
| US6315038B1 (en) * | 1998-09-22 | 2001-11-13 | Intel Corporation | Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device |
| US7219721B2 (en) * | 2002-01-16 | 2007-05-22 | Fujitsu Limited | Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
| US20040042178A1 (en) * | 2002-09-03 | 2004-03-04 | Vadim Gektin | Heat spreader with surface cavity |
| US7273095B2 (en) * | 2003-03-11 | 2007-09-25 | United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Nanoengineered thermal materials based on carbon nanotube array composites |
| CN100377340C (zh) * | 2004-08-11 | 2008-03-26 | 鸿富锦精密工业（深圳）有限公司 | 散热模组及其制备方法 |
| JP4646642B2 (ja) * | 2005-01-27 | 2011-03-09 | 京セラ株式会社 | 半導体素子用パッケージ |
| CN100337981C (zh) * | 2005-03-24 | 2007-09-19 | 清华大学 | 热界面材料及其制造方法 |
| AU2006249601B2 (en) * | 2005-05-26 | 2011-08-11 | Nanocomp Technologies, Inc. | Systems and methods for thermal management of electronic components |
| JP2007243106A (ja) * | 2006-03-13 | 2007-09-20 | Fujitsu Ltd | 半導体パッケージ構造 |
| JP4992461B2 (ja) * | 2007-02-21 | 2012-08-08 | 富士通株式会社 | 電子回路装置及び電子回路装置モジュール |
| JP5018419B2 (ja) * | 2007-11-19 | 2012-09-05 | 富士通株式会社 | モジュール構造体、その製造方法および半導体装置 |
| JP5013116B2 (ja) * | 2007-12-11 | 2012-08-29 | 富士通株式会社 | シート状構造体及びその製造方法並びに電子機器 |
-
2009
- 2009-10-14 JP JP2009236989A patent/JP5276565B2/ja active Active
-
2010
- 2010-08-16 US US12/856,700 patent/US20110083836A1/en not_active Abandoned