JP2011086700A5 - - Google Patents

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Publication number
JP2011086700A5
JP2011086700A5 JP2009236989A JP2009236989A JP2011086700A5 JP 2011086700 A5 JP2011086700 A5 JP 2011086700A5 JP 2009236989 A JP2009236989 A JP 2009236989A JP 2009236989 A JP2009236989 A JP 2009236989A JP 2011086700 A5 JP2011086700 A5 JP 2011086700A5
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JP
Japan
Prior art keywords
radiating plate
heat
heat sink
heat radiating
square
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2009236989A
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Japanese (ja)
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JP5276565B2 (en
JP2011086700A (en
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Publication date
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Priority to JP2009236989A priority Critical patent/JP5276565B2/en
Priority claimed from JP2009236989A external-priority patent/JP5276565B2/en
Priority to US12/856,700 priority patent/US20110083836A1/en
Publication of JP2011086700A publication Critical patent/JP2011086700A/en
Publication of JP2011086700A5 publication Critical patent/JP2011086700A5/ja
Application granted granted Critical
Publication of JP5276565B2 publication Critical patent/JP5276565B2/en
Active legal-status Critical Current
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Description

放熱板４０は、例えばヒートシンク等を示している。放熱板４０は、例えば無酸素銅にニッケルめっきを施したものやアルミニウム等の熱伝導率の高い材料からなり、半導体素子２０が発する熱を外部に伝熱放散させる役割を担う。なお、放熱板４０の大きさは、平面視で１０ｍｍ角〜４０ｍｍ角程度である。放熱板４０の最厚部分の厚さは、例えば２〜３ｍｍ程度である。放熱板４０の外縁部４１は、接着剤５０等により基板１０上に固着されている。

The heat radiating plate 40 is, for example, a heat sink. The heat radiating plate 40 is made of a material having high thermal conductivity such as nickel-plated oxygen-free copper, aluminum, or the like, and plays a role of transferring heat generated by the semiconductor element 20 to the outside. In addition, the magnitude | size of the heat sink 40 is about 10 mm square-40 mm square by planar view. The thickness of the thickest part of the heat sink 40 is, for example, about 2 to 3 mm. The outer edge portion 41 of the heat radiating plate 40 is fixed on the substrate 10 with an adhesive 50 or the like.

JP2009236989A 2009-10-14 2009-10-14 Heat dissipation parts Active JP5276565B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009236989A JP5276565B2 (en) 2009-10-14 2009-10-14 Heat dissipation parts
US12/856,700 US20110083836A1 (en) 2009-10-14 2010-08-16 Heat radiating component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009236989A JP5276565B2 (en) 2009-10-14 2009-10-14 Heat dissipation parts

Publications (3)

Publication Number Publication Date
JP2011086700A JP2011086700A (en) 2011-04-28
JP2011086700A5 true JP2011086700A5 (en) 2012-08-16
JP5276565B2 JP5276565B2 (en) 2013-08-28

Family

ID=43853901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009236989A Active JP5276565B2 (en) 2009-10-14 2009-10-14 Heat dissipation parts

Country Status (2)

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US (1) US20110083836A1 (en)
JP (1) JP5276565B2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102792441B (en) * 2010-03-12 2016-07-27 富士通株式会社 Radiator structure and manufacture method thereof
KR101275792B1 (en) * 2010-07-28 2013-06-18 삼성디스플레이 주식회사 Display device and organic light emitting diode display
JP5790023B2 (en) * 2011-02-25 2015-10-07 富士通株式会社 Manufacturing method of electronic parts
JP6015009B2 (en) 2012-01-25 2016-10-26 富士通株式会社 Electronic device and manufacturing method thereof
JP6217084B2 (en) * 2013-01-17 2017-10-25 富士通株式会社 Heat dissipation structure and manufacturing method thereof
JP6244651B2 (en) * 2013-05-01 2017-12-13 富士通株式会社 Sheet-like structure and manufacturing method thereof, and electronic device and manufacturing method thereof
US10510707B2 (en) * 2013-11-11 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Thermally conductive molding compound structure for heat dissipation in semiconductor packages
JP6261352B2 (en) * 2014-01-23 2018-01-17 新光電気工業株式会社 Carbon nanotube sheet, semiconductor device, method of manufacturing carbon nanotube sheet, and method of manufacturing semiconductor device
JP2015216199A (en) * 2014-05-09 2015-12-03 新光電気工業株式会社 Semiconductor device, heat conduction member, and method for manufacturing semiconductor device
US9296056B2 (en) * 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
EP3231059A4 (en) * 2015-04-27 2018-09-05 Hewlett-Packard Development Company, L.P. Charging devices
JP6927490B2 (en) * 2017-05-31 2021-09-01 株式会社応用ナノ粒子研究所 Heat dissipation structure
CN107623084B (en) * 2017-10-13 2020-12-29 京东方科技集团股份有限公司 Packaging cover plate and manufacturing method thereof
US20210183726A1 (en) * 2017-10-27 2021-06-17 Nissan Motor Co., Ltd. Semiconductor device
DE102021107824A1 (en) * 2021-03-29 2022-09-29 Nanowired Gmbh Connection of two components with a connecting element

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
DE2709239C3 (en) * 1977-03-03 1980-07-24 Eltreva Ag, Aesch (Schweiz) Process for the production of a selectively solar thermal energy absorbing coating on a metal substrate
US5214563A (en) * 1991-12-31 1993-05-25 Compaq Computer Corporation Thermally reactive lead assembly and method for making same
US6315038B1 (en) * 1998-09-22 2001-11-13 Intel Corporation Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
JP4045241B2 (en) * 2002-01-16 2008-02-13 富士通株式会社 Heat sink with improved cooling capacity and semiconductor device including the heat sink
US20040042178A1 (en) * 2002-09-03 2004-03-04 Vadim Gektin Heat spreader with surface cavity
US7273095B2 (en) * 2003-03-11 2007-09-25 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Nanoengineered thermal materials based on carbon nanotube array composites
CN100377340C (en) * 2004-08-11 2008-03-26 鸿富锦精密工业（深圳）有限公司 Thermal module and manufacturing method thereof
JP4646642B2 (en) * 2005-01-27 2011-03-09 京セラ株式会社 Package for semiconductor devices
CN100337981C (en) * 2005-03-24 2007-09-19 清华大学 Thermal interface material and its production method
EP2112249A1 (en) * 2005-05-26 2009-10-28 Nanocomp Technologies, Inc. Systems and methods for thermal management of electronic components
JP2007243106A (en) * 2006-03-13 2007-09-20 Fujitsu Ltd Semiconductor package structure
JP4992461B2 (en) * 2007-02-21 2012-08-08 富士通株式会社 Electronic circuit device and electronic circuit device module
JP5018419B2 (en) * 2007-11-19 2012-09-05 富士通株式会社 Module structure, manufacturing method thereof, and semiconductor device
JP5013116B2 (en) * 2007-12-11 2012-08-29 富士通株式会社 Sheet-like structure, method for producing the same, and electronic device

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