JP2011073900A5 - - Google Patents

Download PDF

Info

Publication number
JP2011073900A5
JP2011073900A5 JP2009224554A JP2009224554A JP2011073900A5 JP 2011073900 A5 JP2011073900 A5 JP 2011073900A5 JP 2009224554 A JP2009224554 A JP 2009224554A JP 2009224554 A JP2009224554 A JP 2009224554A JP 2011073900 A5 JP2011073900 A5 JP 2011073900A5
Authority
JP
Japan
Prior art keywords
single crystal
silicon single
silicon
thin film
crystal thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009224554A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011073900A (ja
JP5152137B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009224554A priority Critical patent/JP5152137B2/ja
Priority claimed from JP2009224554A external-priority patent/JP5152137B2/ja
Publication of JP2011073900A publication Critical patent/JP2011073900A/ja
Publication of JP2011073900A5 publication Critical patent/JP2011073900A5/ja
Application granted granted Critical
Publication of JP5152137B2 publication Critical patent/JP5152137B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009224554A 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法 Active JP5152137B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009224554A JP5152137B2 (ja) 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009224554A JP5152137B2 (ja) 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法

Publications (3)

Publication Number Publication Date
JP2011073900A JP2011073900A (ja) 2011-04-14
JP2011073900A5 true JP2011073900A5 (https=) 2012-01-12
JP5152137B2 JP5152137B2 (ja) 2013-02-27

Family

ID=44018282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009224554A Active JP5152137B2 (ja) 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法

Country Status (1)

Country Link
JP (1) JP5152137B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6032186B2 (ja) * 2013-11-29 2016-11-24 信越半導体株式会社 シリコンエピタキシャルウエーハの評価方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693433B2 (ja) * 1987-04-15 1994-11-16 日本電気株式会社 半導体装置用基板
JPH09199381A (ja) * 1996-01-12 1997-07-31 Toshiba Ceramics Co Ltd エピタキシャルウエハ用シリコン基板及びその製造法
JP4708697B2 (ja) * 2002-11-11 2011-06-22 株式会社Sumco エピタキシャルシリコンウェーハ
JP2007070131A (ja) * 2005-09-05 2007-03-22 Sumco Corp エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ

Similar Documents

Publication Publication Date Title
US10883191B2 (en) Method for producing III-N templates and the reprocessing thereof and III-N template
TWI398909B (zh) 具有異質磊晶層(heteroepitaxial layer)之半導體晶圓及製造該晶圓之方法
JP5278174B2 (ja) シリコンエピタキシャルウェーハおよびその製造方法
JP2010215506A5 (ja) 単結晶iii−v族窒化物材料とその製造方法、物品およびウエハ
TW201041029A (en) A method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front side
WO2010033744A3 (en) Methods of making an emitter having a desired dopant profile
FR2977260B1 (fr) Procede de fabrication d'une couche epitaxiale epaisse de nitrure de gallium sur un substrat de silicium ou analogue et couche obtenue par ledit procede
JP2012142629A5 (https=)
JP2011135051A5 (https=)
JP5179635B1 (ja) 窒化物半導体層を成長させるためのバッファ層構造を有する基板の製造方法
CN105762247A (zh) 一种具有复合结构的氮化物缓冲层制作方法
CN105609603A (zh) 一种具有复合结构的氮化物缓冲层
Uesugi et al. Fabrication of AlN templates on SiC substrates by sputtering-deposition and high-temperature annealing
JP2010157721A5 (https=)
TWI505504B (zh) Method for manufacturing epitaxial crystal substrate
KR101683127B1 (ko) 그래핀을 완충층으로 사용한 게르마늄 단결정 박막의 제조 방법
JP2011073900A5 (https=)
CN105826438A (zh) 一种具有金属缓冲层的发光二极管及其制备方法
JP5720140B2 (ja) 立方晶炭化ケイ素膜の製造方法及び立方晶炭化ケイ素膜付き基板の製造方法
KR102848164B1 (ko) 쌍정결함이 제거된 단결정 다이아몬드기판 및 이의 제조방법
US10263136B1 (en) Direct band gap group IV semiconductors and methods of preparing the same
US20140001486A1 (en) Composite semidconductor substrate, semiconductor device, and manufacturing method
Dong et al. Separation of thick HVPE-GaN films from GaN templates using nanoporous GaN layers
JP6274492B2 (ja) 単結晶ダイヤモンドの製造方法
JP6773635B2 (ja) 結晶成長方法および結晶積層構造