JP2011066278A - ワイヤボンディング装置及び方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004140 cleaning Methods 0.000 claims abstract description 41
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000005452 bending Methods 0.000 claims description 19
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 9
- 238000001514 detection method Methods 0.000 description 8
- 238000005491 wire drawing Methods 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 3
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- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】キャピラリと、第1クランパと、第2クランパと、クリーニングシートと、制御部と、を備え、制御部は、第2クランパを閉とし、第1クランパを開としてキャピラリを下降させ、キャピラリ先端から所定の長さだけワイヤの先端をキャピラリのワイヤ挿通孔の中に引っ込めるワイヤ引き込み手段と、キャピラリ先端をクリーニングシートに押し付けてキャピラリ先端の汚れを除去するクリーニング手段と、第2クランパを閉とし、第1クランパを開とした状態で、キャピラリを超音波加振してワイヤ先端の曲りを矯正するワイヤ曲り矯正手段と、キャピラリの上下方向の動作と協働して第1クランパと第2クランパとを開閉動作させ、キャピラリ先端にワイヤを繰り出すワイヤ繰り出し手段と、を備える。
【選択図】図2
Description
Claims (2)
- ワイヤが挿通され、先端から延出させたワイヤをボンディング対象にボンディングするキャピラリと、
上下方向の移動が固定された第2クランパと、
第2クランパとキャピラリとの間に配置され、キャピラリと連動して移動する第1クランパと、
キャピラリ先端の汚れを除去するために、キャピラリ先端が擦りつけられるクリーニングシートと、
キャピラリの移動と、各クランパの開閉とを制御する制御部と、
を備えるワイヤボンディング装置であって、
制御部は、
第2クランパを閉とし、第1クランパを開としてキャピラリを下降させ、キャピラリ先端から所定の長さだけワイヤの先端をキャピラリのワイヤ挿通孔の中に引っ込めるワイヤ引き込み手段と、
ワイヤをキャピラリの中に引き込んだ後、キャピラリを超音波加振しながらキャピラリ先端をクリーニングシートに押し付けてキャピラリ先端の汚れを除去するクリーニング手段と、
キャピラリをクリーニングシートから上昇させた後、第2クランパを閉とし、第1クランパを開とした状態で、キャピラリを超音波加振してワイヤ先端の曲りを矯正するワイヤ曲り矯正手段と、
ワイヤ先端の曲りを矯正した後、キャピラリの上下方向の動作と協働して第1クランパと第2クランパとを開閉動作させ、キャピラリ先端にワイヤを繰り出すワイヤ繰り出し手段と、を備えること、
を特徴とするワイヤボンディング装置。 - ワイヤボンディング方法であって、
ワイヤが挿通され、先端から延出させたワイヤをボンディング対象にボンディングするキャピラリと、上下方向の移動が固定された第2クランパと、第2クランパとキャピラリとの間に配置され、キャピラリと連動して移動可能な第1クランパと、キャピラリ先端の汚れを除去するために、キャピラリ先端が擦りつけられるクリーニングシートと、を含むボンディング装置を準備する工程と、
第2クランパを閉としてキャピラリを下降させ、キャピラリ先端から所定の長さだけワイヤの先端をキャピラリのワイヤ挿通孔の中に引っ込めるワイヤ引き込み工程と、
ワイヤをキャピラリの中に引き込んだ後、キャピラリを超音波加振しながらキャピラリ先端をクリーニングシートに押し付けてキャピラリ先端の汚れを除去するクリーニング工程と、
キャピラリをクリーニングシートから上昇させた後、第2クランパを閉とし、第1クランパを開とした状態で、キャピラリを超音波加振してワイヤ先端の曲りを矯正するワイヤ曲り矯正工程と、
ワイヤ先端の曲りを矯正した後、キャピラリの上下方向の動作と協働して第1クランパと第2クランパとを開閉動作させ、キャピラリ先端にワイヤを繰り出すワイヤ繰り出し工程と、を備えること、
を特徴とするワイヤボンディング方法。
Priority Applications (3)
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JP2009216806A JP5117462B2 (ja) | 2009-09-18 | 2009-09-18 | ワイヤボンディング装置及び方法 |
KR20100018914A KR101086667B1 (ko) | 2009-09-18 | 2010-03-03 | 와이어 본딩 장치 및 방법 |
CN2010102899165A CN102024722B (zh) | 2009-09-18 | 2010-09-15 | 引线焊接方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012023080A (ja) * | 2010-07-12 | 2012-02-02 | Denso Corp | ワイヤボンディング方法 |
WO2012137381A1 (ja) * | 2011-04-05 | 2012-10-11 | 株式会社新川 | ボンディング装置及びボンディングツールの洗浄方法 |
JP2013179255A (ja) * | 2011-10-25 | 2013-09-09 | Asm Technology Singapore Pte Ltd | ワイヤーボンダのためのワイヤーテール自動調節システム |
JP6067951B1 (ja) * | 2015-12-25 | 2017-01-25 | 株式会社カイジョー | ワイヤボンディング装置 |
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CN103157925A (zh) * | 2011-12-14 | 2013-06-19 | 苏州工业园区高登威科技有限公司 | 焊接机 |
KR101312148B1 (ko) * | 2012-01-04 | 2013-09-26 | 앰코 테크놀로지 코리아 주식회사 | 와이어 본더의 캐필러리 클리닝 방법 |
CN107615465B (zh) * | 2015-03-31 | 2020-05-12 | 株式会社新川 | 引线接合装置以及引线接合方法 |
US9825000B1 (en) * | 2017-04-24 | 2017-11-21 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
JP2022061631A (ja) * | 2020-10-07 | 2022-04-19 | 株式会社東芝 | 超音波接合装置、制御装置及び制御方法 |
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JPS6298629A (ja) * | 1985-10-25 | 1987-05-08 | Hitachi Ltd | ワイヤボンデイング方法 |
JP2008021943A (ja) * | 2006-07-14 | 2008-01-31 | Shinkawa Ltd | ボンディング装置並びにボンディングツール先端部の洗浄方法及びプログラム |
JP2008270270A (ja) * | 2007-04-16 | 2008-11-06 | Renesas Technology Corp | 半導体装置の製造方法 |
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JP3463043B2 (ja) * | 2001-01-24 | 2003-11-05 | Necセミコンダクターズ九州株式会社 | ワイヤボンディング装置のキャピラリを洗浄する洗浄方法及び洗浄装置 |
JP4530984B2 (ja) * | 2005-12-28 | 2010-08-25 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
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TWI451507B (zh) * | 2011-04-05 | 2014-09-01 | Shinkawa Kk | Engagement means and the cleaning tool of the joining method |
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JP6067951B1 (ja) * | 2015-12-25 | 2017-01-25 | 株式会社カイジョー | ワイヤボンディング装置 |
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CN107124904A (zh) * | 2015-12-25 | 2017-09-01 | 华祥股份有限公司 | 打线接合装置 |
CN107124904B (zh) * | 2015-12-25 | 2020-04-21 | 华祥股份有限公司 | 打线接合装置 |
US11302667B2 (en) | 2015-12-25 | 2022-04-12 | Kaijo Corporation | Method of vertically vibrating a bonding arm |
Also Published As
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CN102024722B (zh) | 2013-05-15 |
CN102024722A (zh) | 2011-04-20 |
KR101086667B1 (ko) | 2011-11-24 |
KR20110031067A (ko) | 2011-03-24 |
JP5117462B2 (ja) | 2013-01-16 |
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