JP2011066223A - 回路基板 - Google Patents

回路基板 Download PDF

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Publication number
JP2011066223A
JP2011066223A JP2009215861A JP2009215861A JP2011066223A JP 2011066223 A JP2011066223 A JP 2011066223A JP 2009215861 A JP2009215861 A JP 2009215861A JP 2009215861 A JP2009215861 A JP 2009215861A JP 2011066223 A JP2011066223 A JP 2011066223A
Authority
JP
Japan
Prior art keywords
circuit board
conductor layer
external connection
connection pad
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009215861A
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English (en)
Japanese (ja)
Other versions
JP2011066223A5 (enExample
Inventor
Koji Kawahara
孝司 川原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Microelectronics Inc
Original Assignee
Kawasaki Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Microelectronics Inc filed Critical Kawasaki Microelectronics Inc
Priority to JP2009215861A priority Critical patent/JP2011066223A/ja
Publication of JP2011066223A publication Critical patent/JP2011066223A/ja
Publication of JP2011066223A5 publication Critical patent/JP2011066223A5/ja
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2009215861A 2009-09-17 2009-09-17 回路基板 Pending JP2011066223A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009215861A JP2011066223A (ja) 2009-09-17 2009-09-17 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009215861A JP2011066223A (ja) 2009-09-17 2009-09-17 回路基板

Publications (2)

Publication Number Publication Date
JP2011066223A true JP2011066223A (ja) 2011-03-31
JP2011066223A5 JP2011066223A5 (enExample) 2012-11-01

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ID=43952161

Family Applications (1)

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JP2009215861A Pending JP2011066223A (ja) 2009-09-17 2009-09-17 回路基板

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JP (1) JP2011066223A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011122245A1 (ja) * 2010-03-31 2013-07-08 イビデン株式会社 配線板及びその製造方法
JP2014082455A (ja) * 2012-09-27 2014-05-08 Mitsubishi Electric Corp フレキシブル基板及び基板接続構造
WO2016075730A1 (ja) * 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造
JP2023044487A (ja) * 2021-09-17 2023-03-30 株式会社デンソー 多層プリント基板及び層間線路のインピーダンス調整方法
JPWO2023100853A1 (enExample) * 2021-11-30 2023-06-08
WO2025062903A1 (ja) * 2023-09-22 2025-03-27 シャープ株式会社 高周波多層基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100901A (ja) * 2000-09-25 2002-04-05 Mitsubishi Electric Corp 多層平面型導波路
JP2004266180A (ja) * 2003-03-04 2004-09-24 Kyocera Corp 配線基板
JP2004265969A (ja) * 2003-02-28 2004-09-24 Ngk Spark Plug Co Ltd 配線基板
JP2005019483A (ja) * 2003-06-24 2005-01-20 Hitachi Ltd スルーホール構造、配線基板及び電子装置
JP2008251783A (ja) * 2007-03-30 2008-10-16 Kyocera Corp 配線基板および電子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100901A (ja) * 2000-09-25 2002-04-05 Mitsubishi Electric Corp 多層平面型導波路
JP2004265969A (ja) * 2003-02-28 2004-09-24 Ngk Spark Plug Co Ltd 配線基板
JP2004266180A (ja) * 2003-03-04 2004-09-24 Kyocera Corp 配線基板
JP2005019483A (ja) * 2003-06-24 2005-01-20 Hitachi Ltd スルーホール構造、配線基板及び電子装置
JP2008251783A (ja) * 2007-03-30 2008-10-16 Kyocera Corp 配線基板および電子装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011122245A1 (ja) * 2010-03-31 2013-07-08 イビデン株式会社 配線板及びその製造方法
US8541693B2 (en) 2010-03-31 2013-09-24 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP2014082455A (ja) * 2012-09-27 2014-05-08 Mitsubishi Electric Corp フレキシブル基板及び基板接続構造
US9668346B2 (en) 2012-09-27 2017-05-30 Mitsubishi Electric Corporation Flexible printed circuit board and circuit-board connection structure
WO2016075730A1 (ja) * 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造
JP2023044487A (ja) * 2021-09-17 2023-03-30 株式会社デンソー 多層プリント基板及び層間線路のインピーダンス調整方法
JP7652031B2 (ja) 2021-09-17 2025-03-27 株式会社デンソー 多層プリント基板及び層間線路のインピーダンス調整方法
JPWO2023100853A1 (enExample) * 2021-11-30 2023-06-08
WO2023100853A1 (ja) * 2021-11-30 2023-06-08 京セラ株式会社 配線基板、電子装置及び電子モジュール
JP7770421B2 (ja) 2021-11-30 2025-11-14 京セラ株式会社 配線基板、電子装置及び電子モジュール
WO2025062903A1 (ja) * 2023-09-22 2025-03-27 シャープ株式会社 高周波多層基板

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