JP2011066223A5 - - Google Patents

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Publication number
JP2011066223A5
JP2011066223A5 JP2009215861A JP2009215861A JP2011066223A5 JP 2011066223 A5 JP2011066223 A5 JP 2011066223A5 JP 2009215861 A JP2009215861 A JP 2009215861A JP 2009215861 A JP2009215861 A JP 2009215861A JP 2011066223 A5 JP2011066223 A5 JP 2011066223A5
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JP
Japan
Prior art keywords
circuit board
conductor layer
conductor
layers
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009215861A
Other languages
English (en)
Japanese (ja)
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JP2011066223A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009215861A priority Critical patent/JP2011066223A/ja
Priority claimed from JP2009215861A external-priority patent/JP2011066223A/ja
Publication of JP2011066223A publication Critical patent/JP2011066223A/ja
Publication of JP2011066223A5 publication Critical patent/JP2011066223A5/ja
Pending legal-status Critical Current

Links

JP2009215861A 2009-09-17 2009-09-17 回路基板 Pending JP2011066223A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009215861A JP2011066223A (ja) 2009-09-17 2009-09-17 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009215861A JP2011066223A (ja) 2009-09-17 2009-09-17 回路基板

Publications (2)

Publication Number Publication Date
JP2011066223A JP2011066223A (ja) 2011-03-31
JP2011066223A5 true JP2011066223A5 (enExample) 2012-11-01

Family

ID=43952161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009215861A Pending JP2011066223A (ja) 2009-09-17 2009-09-17 回路基板

Country Status (1)

Country Link
JP (1) JP2011066223A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8541693B2 (en) 2010-03-31 2013-09-24 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP6218481B2 (ja) 2012-09-27 2017-10-25 三菱電機株式会社 フレキシブル基板、基板接続構造及び光モジュール
WO2016075730A1 (ja) * 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造
JP7652031B2 (ja) * 2021-09-17 2025-03-27 株式会社デンソー 多層プリント基板及び層間線路のインピーダンス調整方法
JP7770421B2 (ja) * 2021-11-30 2025-11-14 京セラ株式会社 配線基板、電子装置及び電子モジュール
WO2025062903A1 (ja) * 2023-09-22 2025-03-27 シャープ株式会社 高周波多層基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100901A (ja) * 2000-09-25 2002-04-05 Mitsubishi Electric Corp 多層平面型導波路
JP3990301B2 (ja) * 2003-02-28 2007-10-10 日本特殊陶業株式会社 配線基板
JP4508540B2 (ja) * 2003-03-04 2010-07-21 京セラ株式会社 配線基板および電子装置
JP2005019483A (ja) * 2003-06-24 2005-01-20 Hitachi Ltd スルーホール構造、配線基板及び電子装置
JP5155582B2 (ja) * 2007-03-30 2013-03-06 京セラ株式会社 配線基板および電子装置

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