JP2011030173A - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP2011030173A JP2011030173A JP2009217717A JP2009217717A JP2011030173A JP 2011030173 A JP2011030173 A JP 2011030173A JP 2009217717 A JP2009217717 A JP 2009217717A JP 2009217717 A JP2009217717 A JP 2009217717A JP 2011030173 A JP2011030173 A JP 2011030173A
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- 239000002245 particle Substances 0.000 abstract description 10
- 230000002093 peripheral effect Effects 0.000 abstract description 8
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- 239000000758 substrate Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【解決手段】固体撮像装置21は、受光面において光を受光する撮像素子22と、撮像素子22の受光面の周縁領域に装着される保護部品23とを備える。保護部品23は、撮像素子22の受光面を覆うシールガラス24と、シールガラス24を固定するモールド樹脂25とを有しており、シールガラス24の外周に、モールド樹脂25がモールド成形されることで一体に成形されている。本発明は、例えば、CCDやCMOSセンサなどの固体撮像装置に適用できる。
【選択図】図2
Description
Claims (6)
- 受光面において光を受光する撮像素子と、
前記撮像素子の受光面を覆う透光体および前記透光体の外周を固定する枠体を有し、前記撮像素子の受光面の周縁領域に装着される保護部品と
を備え、
少なくとも前記枠体が、モールド成形により成形されたものである
固体撮像装置。 - 前記保護部品は、その上端部が下端部より幅広に形成され、他の部品を装着可能な装着部を有している
請求項1に記載の固体撮像装置。 - 前記保護部品の装着部に、レンズを収納する鏡筒が装着されている
請求項2に記載の固体撮像装置。 - 前記保護部品の枠体は遮光性を有している
請求項1に記載の固体撮像装置。 - 前記保護部品は、前記透光体であるシールガラスの外周に、前記枠体であるモールド樹脂がモールド成形されることで一体に成形されたものである
請求項1に記載の固体撮像装置。 - 前記保護部品は、前記透光体として透明樹脂が採用され、前記透明樹脂と前記枠体とが二色成形により一体に成形されたものである
請求項1に記載の固体撮像装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009217717A JP5487842B2 (ja) | 2009-06-23 | 2009-09-18 | 固体撮像装置 |
US12/789,099 US20100321563A1 (en) | 2009-06-23 | 2010-05-27 | Solid-state imaging unit |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009148797 | 2009-06-23 | ||
JP2009148797 | 2009-06-23 | ||
JP2009217717A JP5487842B2 (ja) | 2009-06-23 | 2009-09-18 | 固体撮像装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011030173A true JP2011030173A (ja) | 2011-02-10 |
JP2011030173A5 JP2011030173A5 (ja) | 2012-10-18 |
JP5487842B2 JP5487842B2 (ja) | 2014-05-14 |
Family
ID=43354020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009217717A Expired - Fee Related JP5487842B2 (ja) | 2009-06-23 | 2009-09-18 | 固体撮像装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100321563A1 (ja) |
JP (1) | JP5487842B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10396112B2 (en) | 2013-08-19 | 2019-08-27 | Sony Corporation | Imaging apparatus and electronic apparatus |
KR20190113856A (ko) * | 2017-02-08 | 2019-10-08 | 닝보 써니 오포테크 코., 엘티디. | 촬영모듈 및 그 몰드감광 어셈블리와 제조방법, 및 전자장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014138119A (ja) * | 2013-01-17 | 2014-07-28 | Sony Corp | 半導体装置および半導体装置の製造方法 |
JPWO2016084394A1 (ja) * | 2014-11-27 | 2017-08-24 | パナソニックIpマネジメント株式会社 | 撮像装置 |
JP7079258B2 (ja) * | 2017-08-29 | 2022-06-01 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、および、撮像装置の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126782A (ja) * | 1997-06-30 | 1999-01-29 | Olympus Optical Co Ltd | 半導体装置 |
JP2002094035A (ja) * | 2000-09-14 | 2002-03-29 | Shinko Electric Ind Co Ltd | 光透過用キャップ及びその製造方法 |
JP2003179217A (ja) * | 2001-12-11 | 2003-06-27 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2005109092A (ja) * | 2003-09-30 | 2005-04-21 | Konica Minolta Opto Inc | 固体撮像装置及び該固体撮像装置を備えた撮像装置 |
JP2008289096A (ja) * | 2007-05-21 | 2008-11-27 | Sharp Corp | 固体撮像モジュール、撮像装置、撮像機器、および固体撮像モジュールの製造方法 |
Family Cites Families (20)
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US6795120B2 (en) * | 1996-05-17 | 2004-09-21 | Sony Corporation | Solid-state imaging apparatus and camera using the same |
DE10109787A1 (de) * | 2001-02-28 | 2002-10-02 | Infineon Technologies Ag | Digitale Kamera mit einem lichtempfindlichen Sensor |
JP4698874B2 (ja) * | 2001-04-24 | 2011-06-08 | ローム株式会社 | イメージセンサモジュール、およびイメージセンサモジュールの製造方法 |
US6876544B2 (en) * | 2003-07-16 | 2005-04-05 | Kingpak Technology Inc. | Image sensor module and method for manufacturing the same |
JP4441211B2 (ja) * | 2003-08-13 | 2010-03-31 | シチズン電子株式会社 | 小型撮像モジュール |
US20050117046A1 (en) * | 2003-12-02 | 2005-06-02 | Jichen Wu | Image sensor module and method for manufacturing the same |
US7821564B2 (en) * | 2003-12-30 | 2010-10-26 | Given Imaging Ltd. | Assembly for aligning an optical system |
US7872686B2 (en) * | 2004-02-20 | 2011-01-18 | Flextronics International Usa, Inc. | Integrated lens and chip assembly for a digital camera |
JP3801601B2 (ja) * | 2004-06-15 | 2006-07-26 | シャープ株式会社 | 蓋部を備えた半導体ウェハの製造方法及び半導体装置の製造方法 |
JPWO2007096992A1 (ja) * | 2006-02-24 | 2009-07-09 | パナソニック株式会社 | 撮像装置及び携帯端末装置 |
KR100817060B1 (ko) * | 2006-09-22 | 2008-03-27 | 삼성전자주식회사 | 카메라 모듈 및 그 제조 방법 |
JP2008197282A (ja) * | 2007-02-09 | 2008-08-28 | Sharp Corp | プラスチックレンズユニット、カメラモジュール、及びこれらの製造方法 |
WO2008132979A1 (ja) * | 2007-04-17 | 2008-11-06 | Konica Minolta Opto, Inc. | 撮像装置の製造方法及び撮像装置 |
JP2008283002A (ja) * | 2007-05-10 | 2008-11-20 | Sharp Corp | 撮像素子モジュールおよびその製造方法 |
CN101932956B (zh) * | 2007-07-03 | 2013-11-13 | 奥多麦卡有限公司 | 由不同材料构成的透镜单元和相机模块及其制造方法 |
US8411192B2 (en) * | 2007-11-15 | 2013-04-02 | Sharp Kabushiki Kaisha | Image capturing module, method for manufacturing the image capturing module, and electronic information device |
CN101630054A (zh) * | 2008-07-15 | 2010-01-20 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其制造方法 |
JP4694602B2 (ja) * | 2008-09-02 | 2011-06-08 | シャープ株式会社 | 固体撮像装置およびそれを備えた電子機器 |
KR101032212B1 (ko) * | 2009-09-14 | 2011-05-02 | 삼성전기주식회사 | 카메라 모듈, 카메라 모듈의 초점 조절 방법 및 카메라 모듈의 초점 조절 장치 |
JP2011180292A (ja) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | レンズアレイ |
-
2009
- 2009-09-18 JP JP2009217717A patent/JP5487842B2/ja not_active Expired - Fee Related
-
2010
- 2010-05-27 US US12/789,099 patent/US20100321563A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126782A (ja) * | 1997-06-30 | 1999-01-29 | Olympus Optical Co Ltd | 半導体装置 |
JP2002094035A (ja) * | 2000-09-14 | 2002-03-29 | Shinko Electric Ind Co Ltd | 光透過用キャップ及びその製造方法 |
JP2003179217A (ja) * | 2001-12-11 | 2003-06-27 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2005109092A (ja) * | 2003-09-30 | 2005-04-21 | Konica Minolta Opto Inc | 固体撮像装置及び該固体撮像装置を備えた撮像装置 |
JP2008289096A (ja) * | 2007-05-21 | 2008-11-27 | Sharp Corp | 固体撮像モジュール、撮像装置、撮像機器、および固体撮像モジュールの製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10396112B2 (en) | 2013-08-19 | 2019-08-27 | Sony Corporation | Imaging apparatus and electronic apparatus |
KR20190113856A (ko) * | 2017-02-08 | 2019-10-08 | 닝보 써니 오포테크 코., 엘티디. | 촬영모듈 및 그 몰드감광 어셈블리와 제조방법, 및 전자장치 |
US10979610B2 (en) | 2017-02-08 | 2021-04-13 | Ningbo Sunny Opotech Co., Ltd. | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device |
KR102405359B1 (ko) * | 2017-02-08 | 2022-06-07 | 닝보 써니 오포테크 코., 엘티디. | 촬영모듈 및 그 몰드감광 어셈블리와 제조방법, 및 전자장치 |
Also Published As
Publication number | Publication date |
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JP5487842B2 (ja) | 2014-05-14 |
US20100321563A1 (en) | 2010-12-23 |
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