JP2010524237A - 不揮発性メモリの第1層間誘電体スタック - Google Patents
不揮発性メモリの第1層間誘電体スタック Download PDFInfo
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- JP2010524237A JP2010524237A JP2010502176A JP2010502176A JP2010524237A JP 2010524237 A JP2010524237 A JP 2010524237A JP 2010502176 A JP2010502176 A JP 2010502176A JP 2010502176 A JP2010502176 A JP 2010502176A JP 2010524237 A JP2010524237 A JP 2010524237A
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- 239000011229 interlayer Substances 0.000 title claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 331
- 238000000034 method Methods 0.000 claims abstract description 81
- 238000005247 gettering Methods 0.000 claims abstract description 69
- 238000000151 deposition Methods 0.000 claims description 47
- 239000004065 semiconductor Substances 0.000 claims description 41
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 38
- 238000005530 etching Methods 0.000 claims description 28
- 238000005498 polishing Methods 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 230000008021 deposition Effects 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 15
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- 230000008569 process Effects 0.000 description 47
- 150000002500 ions Chemical class 0.000 description 19
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- 239000000463 material Substances 0.000 description 15
- 230000006870 function Effects 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000000137 annealing Methods 0.000 description 6
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- 238000005240 physical vapour deposition Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 239000012535 impurity Substances 0.000 description 4
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- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 229910003811 SiGeC Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
図示を簡略および明瞭にするため、図面に示す要素は必ずしも縮尺で描かれる必要はない。たとえば、明瞭さおよび理解を促し高めるために、幾つかの要素は他の要素に対して大きく描かれている。さらに、対応する要素または類似した要素を表すために、適宜図面間で参照番号を繰り返し用いる。
Claims (20)
- 半導体構造上に第1層間誘電体を形成するための方法において、
前記半導体構造上に複数のデバイス部品を形成するデバイス部品形成工程と、
前記複数のデバイス部品の上方にエッチング停止層を形成するエッチング停止層形成工程と、
前記複数のデバイス部品の間の領域を充填するために、前記エッチング停止層の上方に誘電体間隙充填層を形成する誘電体間隙充填層形成工程と、
前記誘電体間隙充填層を略平坦面になるまで平坦化する平坦化工程と、
前記誘電体間隙充填層の略平坦面の上方に誘電体ゲッタリング層を形成する誘電体ゲッタリング層形成工程と、
一つまたは複数のデバイス部品内の一つまたは複数のコンタクト領域の上方で前記エッチング停止層を露出させるために、前記誘電体ゲッタリング層と前記誘電体間隙充填層とを選択的にエッチングするエッチング工程と
を備える方法。 - 前記エッチング停止層形成工程は、前記複数のデバイス部品の上方にプラズマ窒化物の層を堆積する工程を備える、請求項1に記載の方法。
- 前記誘電体間隙充填層形成工程は、前記複数のデバイス部品の間の領域を充填するために、SATEOS層またはHDP PTEOS層を堆積する工程を備える、請求項1に記載の方法。
- 前記誘電体間隙充填層形成工程は、前記誘電体間隙充填層を略平坦な面に平坦化するために、化学的機械的研磨工程を使用する工程を備える、請求項1に記載の方法。
- 前記誘電体ゲッタリング層形成工程は、可動イオンバリア層を設けるために、誘電体間隙充填層の略平坦面の上方にBPTEOS層、PTEOS層、BTEOS層、またはそれらを組み合わせたものを堆積する工程を含む、請求項1に記載の方法。
- 前記誘電体ゲッタリング層を選択的にエッチングする前に、前記誘電体ゲッタリング層の上方に誘電体キャッピング層を形成する誘電体キャッピング層形成工程をさらに備える、請求項1に記載の方法。
- 前記誘電体キャッピング層形成工程は、前記誘電体ゲッタリング層の上方にプラズマテトラエチルオルトシリケート(PETEOS)層を堆積する工程を備える、請求項6に記載の方法。
- 一つまたは複数のデバイス部品内の一つまたは複数のコンタクト領域を露出させるために、露出した前記エッチング停止層を選択的にエッチングする工程をさらに備える、請求項1に記載の方法。
- 前記誘電体間隙充填層を平坦化するときに安定研磨キャップ層と誘電体間隙充填層とが平坦化されるように、前記誘電体間隙充填層の上方に安定研磨キャップ層を形成する安定研磨キャップ層形成工程をさらに備える、請求項1に記載の方法。
- 半導体デバイスの製造方法であって、
半導体構造上に複数のデバイス部品を形成するデバイス部品形成工程と、
前記複数のデバイス部品の間の領域を充填するために、前記複数のデバイス部品の上方に誘電体層を堆積することによって間隙充填層を形成する間隙充填層形成工程と、
前記間隙充填層を略平坦面になるまで研磨する間隙充填層研磨工程と、
前記間隙充填層の略平坦面の上方にゲッタリング層を堆積するゲッタリング層堆積工程と
を備える、製造方法。 - 前記間隙充填層形成工程は、前記誘電体層の上方に安定研磨キャップ層を形成する工程を備える、請求項10に記載の製造方法。
- 前記間隙充填層形成工程は、前記複数のデバイス部品間の領域を充填するために、前記複数のデバイス部品の上方にSATEOS層またはHDPをドープしたTEOS層を堆積する工程を備える、請求項10に記載の製造方法。
- 前記間隙充填層研磨工程は、化学的機械的研磨工程により前記間隙充填層を平坦化する工程を備える、請求項10に記載の製造方法。
- 前記ゲッタリング層堆積工程は、前記間隙充填層の前記略平坦面の上方に、BPTEOS層、PTEOS層、BTEOS層、またはそれらを組み合わせたものを堆積する工程を備える、請求項10に記載の製造方法。
- 前記ゲッタリング層形成工程は、
前記間隙充填層の前記略平坦面の上方に一つまたは複数のドープしたTEOS層を堆積する工程と、
前記一つまたは複数のドープしたTEOS層の上方に、TEOSまたはプラズマ強化TEOSのアンカー層を堆積する工程と
を備える、請求項10に記載の製造方法。 - 前記間隙充填層の形成前に、前記複数のデバイス部品の上方にエッチング停止層を形成する工程をさらに含む、請求項10に記載の製造方法。
- 一つまたは複数のデバイス部品内の一つまたは複数のコンタクト領域を露出させるために、前記ゲッタリング層と前記間隙充填層とを選択的にエッチングする工程をさらに備える、請求項10に記載の製造方法。
- 第1層間誘電体スタックを形成するための方法であって、
複数のデバイス部品を被覆するために、かつ前記複数のデバイス部品の間の領域を充填するために、前記複数のデバイス部品の上方に平坦化した間隙充填層を形成する平坦化間隙充填層形成工程と、
その後、前記平坦化した間隙充填層の上方に一つまたは複数のゲッタリング層を堆積するゲッタリング層堆積工程と、
その後、一つまたは複数のデバイス部品内の一つまたは複数のコンタクト領域を露出させるために、一つまたは複数のゲッタリング層と前記平坦化間隙充填層とに選択的に開口部をエッチングするエッチング工程と
を含む方法。 - 前記平坦化間隙充填層形成工程は、前記複数のデバイス部品間の領域を充填するために、前記複数のデバイス部品の上方にSATEOS層またはHDPをドープしたTEOS層を堆積する工程と、
前記SATEOS層またはHDPをドープしたTEOS層を略平坦面になるまで研磨する工程と
を備える、請求項18に記載の方法。 - 前記ゲッタリング層堆積工程は、前記平坦化した間隙充填層の上方に一つまたは複数のドープしたTEOS層を堆積する工程と、
前記一つまたは複数のドープしたTEOS層の上方にTEOSまたはプラズマ強化TEOSのアンカー層を堆積する工程と
を備える、請求項18に記載の方法。
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US11/697,106 US8435898B2 (en) | 2007-04-05 | 2007-04-05 | First inter-layer dielectric stack for non-volatile memory |
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