JP2010522991A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010522991A5 JP2010522991A5 JP2010500999A JP2010500999A JP2010522991A5 JP 2010522991 A5 JP2010522991 A5 JP 2010522991A5 JP 2010500999 A JP2010500999 A JP 2010500999A JP 2010500999 A JP2010500999 A JP 2010500999A JP 2010522991 A5 JP2010522991 A5 JP 2010522991A5
- Authority
- JP
- Japan
- Prior art keywords
- memory cell
- level
- conductor
- carbon nanotube
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/692,144 US7667999B2 (en) | 2007-03-27 | 2007-03-27 | Method to program a memory cell comprising a carbon nanotube fabric and a steering element |
| US11/692,148 US7982209B2 (en) | 2007-03-27 | 2007-03-27 | Memory cell comprising a carbon nanotube fabric element and a steering element |
| PCT/US2008/004018 WO2008118486A1 (en) | 2007-03-27 | 2008-03-26 | Memory cell comprising a carbon nanotube fabric element and a steering element and methods of forming the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010522991A JP2010522991A (ja) | 2010-07-08 |
| JP2010522991A5 true JP2010522991A5 (enExample) | 2011-04-21 |
Family
ID=39590778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010500999A Pending JP2010522991A (ja) | 2007-03-27 | 2008-03-26 | カーボンナノチューブ構造素子およびステアリング素子を含むメモリセルおよびそれを形成する方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2140492A1 (enExample) |
| JP (1) | JP2010522991A (enExample) |
| KR (1) | KR20100014547A (enExample) |
| CN (1) | CN101681921B (enExample) |
| TW (1) | TW200903782A (enExample) |
| WO (1) | WO2008118486A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100655078B1 (ko) * | 2005-09-16 | 2006-12-08 | 삼성전자주식회사 | 비트 레지스터링 레이어를 갖는 반도체 메모리 장치 및그의 구동 방법 |
| US8294098B2 (en) | 2007-03-30 | 2012-10-23 | Tsinghua University | Transmission electron microscope micro-grid |
| US8558220B2 (en) | 2007-12-31 | 2013-10-15 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same |
| US8878235B2 (en) | 2007-12-31 | 2014-11-04 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same |
| US8530318B2 (en) | 2008-04-11 | 2013-09-10 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same |
| US8110476B2 (en) | 2008-04-11 | 2012-02-07 | Sandisk 3D Llc | Memory cell that includes a carbon-based memory element and methods of forming the same |
| US8557685B2 (en) | 2008-08-07 | 2013-10-15 | Sandisk 3D Llc | Memory cell that includes a carbon-based memory element and methods of forming the same |
| EP2340562A2 (en) * | 2008-10-23 | 2011-07-06 | Sandisk 3D LLC | Carbon-based memory elements exhibiting reduced delamination and methods of forming the same |
| KR20100052080A (ko) * | 2008-11-10 | 2010-05-19 | 주식회사 하이닉스반도체 | 저항성 메모리 소자 및 그 제조 방법 |
| JP2010123646A (ja) * | 2008-11-18 | 2010-06-03 | Toshiba Corp | 電気素子、スイッチング素子、メモリ素子、スイッチング方法及びメモリ方法 |
| US8114765B2 (en) | 2008-12-31 | 2012-02-14 | Sandisk 3D Llc | Methods for increased array feature density |
| US8084347B2 (en) | 2008-12-31 | 2011-12-27 | Sandisk 3D Llc | Resist feature and removable spacer pitch doubling patterning method for pillar structures |
| US8023310B2 (en) * | 2009-01-14 | 2011-09-20 | Sandisk 3D Llc | Nonvolatile memory cell including carbon storage element formed on a silicide layer |
| JP4829320B2 (ja) * | 2009-03-17 | 2011-12-07 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法 |
| CN101848564B (zh) | 2009-03-27 | 2012-06-20 | 清华大学 | 加热器件 |
| US7955981B2 (en) * | 2009-06-30 | 2011-06-07 | Sandisk 3D Llc | Method of making a two-terminal non-volatile memory pillar device with rounded corner |
| CN101998706B (zh) | 2009-08-14 | 2015-07-01 | 清华大学 | 碳纳米管织物及应用该碳纳米管织物的发热体 |
| CN101991364B (zh) | 2009-08-14 | 2013-08-28 | 清华大学 | 电烤箱 |
| HRP20190016T1 (hr) | 2009-08-17 | 2019-03-08 | Intellikine, Llc | Heterociklički spojevi i njihova upotreba |
| CN102019039B (zh) | 2009-09-11 | 2013-08-21 | 清华大学 | 红外理疗设备 |
| JP5611574B2 (ja) | 2009-11-30 | 2014-10-22 | 株式会社東芝 | 抵抗変化メモリ及びその製造方法 |
| US9096590B2 (en) | 2010-05-24 | 2015-08-04 | Intellikine Llc | Substituted benzoxazoles as PI3 kinase inhibitors |
| JP5808826B2 (ja) | 2011-02-23 | 2015-11-10 | インテリカイン, エルエルシー | 複素環化合物およびその使用 |
| CN104613545B (zh) * | 2015-02-02 | 2017-05-10 | 广东美的制冷设备有限公司 | 空调器室内机及空调器的出风控制方法 |
| CN104613620B (zh) * | 2015-02-02 | 2017-05-10 | 广东美的制冷设备有限公司 | 空调器及其出风控制方法 |
| EP3801069A4 (en) | 2018-06-01 | 2022-03-16 | Cornell University | MULTIPLE THERAPY FOR DISEASE OR DISORDER ASSOCIATED WITH PI3K |
| US10580778B2 (en) * | 2018-07-18 | 2020-03-03 | Nanya Technology Corporation | Dynamic random access memory structure and method for preparing the same |
| US11502105B2 (en) * | 2021-04-06 | 2022-11-15 | Macronix International Co., Ltd. | Semiconductor structure and a method for manufacturing the same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7858185B2 (en) * | 2003-09-08 | 2010-12-28 | Nantero, Inc. | High purity nanotube fabrics and films |
| CN1849718A (zh) * | 2003-07-09 | 2006-10-18 | 先进微装置公司 | 存储器件和使用及制造该器件的方法 |
| JP4448356B2 (ja) * | 2004-03-26 | 2010-04-07 | 富士通株式会社 | 半導体装置およびその製造方法 |
| JP2005343744A (ja) * | 2004-06-03 | 2005-12-15 | Matsushita Electric Ind Co Ltd | カーボンナノチューブ半導体の製造方法およびカーボンナノチューブ構造体 |
| US7479654B2 (en) * | 2005-05-09 | 2009-01-20 | Nantero, Inc. | Memory arrays using nanotube articles with reprogrammable resistance |
| US7812404B2 (en) * | 2005-05-09 | 2010-10-12 | Sandisk 3D Llc | Nonvolatile memory cell comprising a diode and a resistance-switching material |
| US20060273298A1 (en) * | 2005-06-02 | 2006-12-07 | Matrix Semiconductor, Inc. | Rewriteable memory cell comprising a transistor and resistance-switching material in series |
| JP4975289B2 (ja) * | 2005-09-06 | 2012-07-11 | 国立大学法人名古屋大学 | カーボンナノウォールを用いた電子素子 |
| WO2008021912A2 (en) * | 2006-08-08 | 2008-02-21 | Nantero, Inc. | Nonvolatile resistive memories, latch circuits, and operation circuits having scalable two-terminal nanotube switches |
-
2008
- 2008-03-26 EP EP08742323A patent/EP2140492A1/en not_active Withdrawn
- 2008-03-26 KR KR1020097019877A patent/KR20100014547A/ko not_active Ceased
- 2008-03-26 JP JP2010500999A patent/JP2010522991A/ja active Pending
- 2008-03-26 WO PCT/US2008/004018 patent/WO2008118486A1/en not_active Ceased
- 2008-03-26 CN CN2008800165825A patent/CN101681921B/zh not_active Expired - Fee Related
- 2008-03-27 TW TW097111114A patent/TW200903782A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010522991A5 (enExample) | ||
| JP5549962B2 (ja) | メモリアレイ。 | |
| JP4446891B2 (ja) | 垂直積層ポア相変化メモリ | |
| CN107579087B (zh) | 一种存储器单元阵列结构和电子装置 | |
| US7894238B2 (en) | Semiconductor memory device with stacked memory cell structure | |
| US8937830B2 (en) | Semiconductor memory device | |
| US8384198B2 (en) | Resistance change memory and manufacturing method thereof | |
| JP2014229896A (ja) | 不揮発性半導体記憶装置 | |
| US9087986B2 (en) | Semiconductor memory device having dummy conductive patterns on interconnection and fabrication method thereof | |
| US20110080766A1 (en) | Resistive Memory Device and Manufacturing Method Thereof and Operating Method Thereof | |
| US8923031B2 (en) | Semiconductor memory device | |
| US8680499B2 (en) | Memory cells | |
| US8927957B2 (en) | Sidewall diode driving device and memory using same | |
| US9343674B2 (en) | Cross-point memory utilizing Ru/Si diode | |
| CN109427839B (zh) | 存储单元、器件、存储单元阵列及其操作方法 | |
| US20140061566A1 (en) | Semiconductor storage device and method of manufacturing same | |
| US20160268343A1 (en) | Variable resistance memory device and manufacturing method thereof | |
| KR102232512B1 (ko) | 저항변화 메모리 소자 및 이를 포함하는 메모리 장치 | |
| JP2011171391A (ja) | アンチヒューズ構造およびアンチヒューズ構造の製造方法 | |
| US8791552B2 (en) | Semiconductor memory device and method for manufacturing the same | |
| TW388917B (en) | High-resistance load SRAM | |
| US9520447B2 (en) | Memory cells having a common gate terminal | |
| JP2004031617A (ja) | メモリ装置およびその製造方法 | |
| KR100945509B1 (ko) | 상변화 기억 소자 | |
| US9147839B2 (en) | Memory cells with recessed electrode contacts |