CN101681921B - 包括碳纳米管织物元件和转向元件的存储器单元及其形成方法 - Google Patents
包括碳纳米管织物元件和转向元件的存储器单元及其形成方法 Download PDFInfo
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- CN101681921B CN101681921B CN2008800165825A CN200880016582A CN101681921B CN 101681921 B CN101681921 B CN 101681921B CN 2008800165825 A CN2008800165825 A CN 2008800165825A CN 200880016582 A CN200880016582 A CN 200880016582A CN 101681921 B CN101681921 B CN 101681921B
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- conductor
- diode
- carbon nanotube
- nanotube fabric
- memory unit
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 silicide metals Chemical class 0.000 description 2
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- 229910052715 tantalum Inorganic materials 0.000 description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
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- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
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- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
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- G—PHYSICS
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- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
- G11C13/025—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
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- H—ELECTRICITY
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- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
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- H—ELECTRICITY
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- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
- H10B63/84—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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- G11C2213/72—Array wherein the access device being a diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Other compounds of groups 13-15, e.g. elemental or compound semiconductors
- H10N70/8845—Carbon or carbides
Abstract
Description
Claims (48)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/692,144 US7667999B2 (en) | 2007-03-27 | 2007-03-27 | Method to program a memory cell comprising a carbon nanotube fabric and a steering element |
US11/692,148 US7982209B2 (en) | 2007-03-27 | 2007-03-27 | Memory cell comprising a carbon nanotube fabric element and a steering element |
US11/692,144 | 2007-03-27 | ||
US11/692,148 | 2007-03-27 | ||
PCT/US2008/004018 WO2008118486A1 (en) | 2007-03-27 | 2008-03-26 | Memory cell comprising a carbon nanotube fabric element and a steering element and methods of forming the same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101681921A CN101681921A (zh) | 2010-03-24 |
CN101681921B true CN101681921B (zh) | 2013-03-27 |
Family
ID=39590778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800165825A Expired - Fee Related CN101681921B (zh) | 2007-03-27 | 2008-03-26 | 包括碳纳米管织物元件和转向元件的存储器单元及其形成方法 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2140492A1 (zh) |
JP (1) | JP2010522991A (zh) |
KR (1) | KR20100014547A (zh) |
CN (1) | CN101681921B (zh) |
TW (1) | TW200903782A (zh) |
WO (1) | WO2008118486A1 (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100655078B1 (ko) * | 2005-09-16 | 2006-12-08 | 삼성전자주식회사 | 비트 레지스터링 레이어를 갖는 반도체 메모리 장치 및그의 구동 방법 |
US8294098B2 (en) | 2007-03-30 | 2012-10-23 | Tsinghua University | Transmission electron microscope micro-grid |
US8878235B2 (en) | 2007-12-31 | 2014-11-04 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same |
US8558220B2 (en) | 2007-12-31 | 2013-10-15 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same |
US8530318B2 (en) | 2008-04-11 | 2013-09-10 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same |
US8110476B2 (en) | 2008-04-11 | 2012-02-07 | Sandisk 3D Llc | Memory cell that includes a carbon-based memory element and methods of forming the same |
US20100032639A1 (en) | 2008-08-07 | 2010-02-11 | Sandisk 3D Llc | Memory cell that includes a carbon-based memory element and methods of forming the same |
EP2340562A2 (en) * | 2008-10-23 | 2011-07-06 | Sandisk 3D LLC | Carbon-based memory elements exhibiting reduced delamination and methods of forming the same |
KR20100052080A (ko) * | 2008-11-10 | 2010-05-19 | 주식회사 하이닉스반도체 | 저항성 메모리 소자 및 그 제조 방법 |
JP2010123646A (ja) * | 2008-11-18 | 2010-06-03 | Toshiba Corp | 電気素子、スイッチング素子、メモリ素子、スイッチング方法及びメモリ方法 |
US8084347B2 (en) | 2008-12-31 | 2011-12-27 | Sandisk 3D Llc | Resist feature and removable spacer pitch doubling patterning method for pillar structures |
US8114765B2 (en) | 2008-12-31 | 2012-02-14 | Sandisk 3D Llc | Methods for increased array feature density |
US8023310B2 (en) * | 2009-01-14 | 2011-09-20 | Sandisk 3D Llc | Nonvolatile memory cell including carbon storage element formed on a silicide layer |
JP4829320B2 (ja) * | 2009-03-17 | 2011-12-07 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法 |
CN101848564B (zh) | 2009-03-27 | 2012-06-20 | 清华大学 | 加热器件 |
US7955981B2 (en) * | 2009-06-30 | 2011-06-07 | Sandisk 3D Llc | Method of making a two-terminal non-volatile memory pillar device with rounded corner |
CN101998706B (zh) | 2009-08-14 | 2015-07-01 | 清华大学 | 碳纳米管织物及应用该碳纳米管织物的发热体 |
CN101991364B (zh) | 2009-08-14 | 2013-08-28 | 清华大学 | 电烤箱 |
EA026693B1 (ru) | 2009-08-17 | 2017-05-31 | Интелликайн ЭлЭлСи | Производные бензоксазола и бензотиазола в качестве ингибиторов pi3-киназы |
CN102019039B (zh) | 2009-09-11 | 2013-08-21 | 清华大学 | 红外理疗设备 |
JP5611574B2 (ja) | 2009-11-30 | 2014-10-22 | 株式会社東芝 | 抵抗変化メモリ及びその製造方法 |
WO2011149937A1 (en) | 2010-05-24 | 2011-12-01 | Intellikine, Inc. | Heterocyclic compounds and uses thereof |
WO2012116237A2 (en) | 2011-02-23 | 2012-08-30 | Intellikine, Llc | Heterocyclic compounds and uses thereof |
CN104613545B (zh) * | 2015-02-02 | 2017-05-10 | 广东美的制冷设备有限公司 | 空调器室内机及空调器的出风控制方法 |
CN104613620B (zh) * | 2015-02-02 | 2017-05-10 | 广东美的制冷设备有限公司 | 空调器及其出风控制方法 |
US10580778B2 (en) * | 2018-07-18 | 2020-03-03 | Nanya Technology Corporation | Dynamic random access memory structure and method for preparing the same |
US11502105B2 (en) * | 2021-04-06 | 2022-11-15 | Macronix International Co., Ltd. | Semiconductor structure and a method for manufacturing the same |
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US7812404B2 (en) * | 2005-05-09 | 2010-10-12 | Sandisk 3D Llc | Nonvolatile memory cell comprising a diode and a resistance-switching material |
US7479654B2 (en) * | 2005-05-09 | 2009-01-20 | Nantero, Inc. | Memory arrays using nanotube articles with reprogrammable resistance |
US20060273298A1 (en) * | 2005-06-02 | 2006-12-07 | Matrix Semiconductor, Inc. | Rewriteable memory cell comprising a transistor and resistance-switching material in series |
JP4975289B2 (ja) * | 2005-09-06 | 2012-07-11 | 国立大学法人名古屋大学 | カーボンナノウォールを用いた電子素子 |
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