JP2010508377A - 光学部品およびシリコーン組成物および光学部品の成型方法 - Google Patents

光学部品およびシリコーン組成物および光学部品の成型方法 Download PDF

Info

Publication number
JP2010508377A
JP2010508377A JP2009526648A JP2009526648A JP2010508377A JP 2010508377 A JP2010508377 A JP 2010508377A JP 2009526648 A JP2009526648 A JP 2009526648A JP 2009526648 A JP2009526648 A JP 2009526648A JP 2010508377 A JP2010508377 A JP 2010508377A
Authority
JP
Japan
Prior art keywords
light guide
group
sio
composition
average
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009526648A
Other languages
English (en)
Japanese (ja)
Inventor
マネーシュ・バハドゥー
ブライアン・ロバート・ハークネス
アフルーズ・ザリスフィ
アン・ワルストロム・ノリス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Dow Silicones Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp, Dow Silicones Corp filed Critical Dow Corning Corp
Publication of JP2010508377A publication Critical patent/JP2010508377A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00663—Production of light guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/045—Light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ophthalmology & Optometry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Optical Integrated Circuits (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2009526648A 2006-08-28 2007-08-23 光学部品およびシリコーン組成物および光学部品の成型方法 Pending JP2010508377A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46783206A 2006-08-28 2006-08-28
PCT/US2007/018648 WO2008027280A2 (en) 2006-08-28 2007-08-23 Optical devices and silicone compositions and processes fabricating the optical devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011209200A Division JP2012017470A (ja) 2006-08-28 2011-09-26 光学デバイスおよびシリコーン組成物および光学デバイスの成型方法

Publications (1)

Publication Number Publication Date
JP2010508377A true JP2010508377A (ja) 2010-03-18

Family

ID=38800900

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009526648A Pending JP2010508377A (ja) 2006-08-28 2007-08-23 光学部品およびシリコーン組成物および光学部品の成型方法
JP2011209200A Pending JP2012017470A (ja) 2006-08-28 2011-09-26 光学デバイスおよびシリコーン組成物および光学デバイスの成型方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011209200A Pending JP2012017470A (ja) 2006-08-28 2011-09-26 光学デバイスおよびシリコーン組成物および光学デバイスの成型方法

Country Status (8)

Country Link
EP (3) EP2069829B1 (enExample)
JP (2) JP2010508377A (enExample)
KR (1) KR101397616B1 (enExample)
CN (1) CN101529277B (enExample)
AT (1) ATE536558T1 (enExample)
MY (1) MY147460A (enExample)
TW (1) TWI346670B (enExample)
WO (1) WO2008027280A2 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235265A (ja) * 2008-03-27 2009-10-15 Shin Etsu Chem Co Ltd 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置
JP2010013503A (ja) * 2008-07-01 2010-01-21 Showa Highpolymer Co Ltd 硬化性樹脂組成物およびオプトデバイス
WO2011125463A1 (ja) * 2010-03-31 2011-10-13 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
JP2012007136A (ja) * 2010-05-21 2012-01-12 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
WO2013051600A1 (ja) * 2011-10-04 2013-04-11 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
WO2015005221A1 (ja) * 2013-07-08 2015-01-15 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーン組成物及び光半導体装置
WO2015019705A1 (ja) * 2013-08-09 2015-02-12 横浜ゴム株式会社 硬化性樹脂組成物
JP2015110752A (ja) * 2013-11-05 2015-06-18 信越化学工業株式会社 紫外線硬化性接着性オルガノポリシロキサン組成物
WO2016035285A1 (ja) * 2014-09-01 2016-03-10 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、硬化性ホットメルトシリコーン、および光デバイス
JP2016076724A (ja) * 2009-12-22 2016-05-12 三菱化学株式会社 樹脂成形体用材料、及び樹脂成形体の製造方法
KR101913869B1 (ko) 2012-07-19 2018-10-31 신에쓰 가가꾸 고교 가부시끼가이샤 경화성 실리콘 수지 조성물

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200947057A (en) 2008-05-06 2009-11-16 Advanced Optoelectronic Tech Light module for LCD backlight module
RU2011139574A (ru) * 2009-05-29 2013-07-10 Доу Корнинг Корпорейшн Кремниевая композиция для получения прозрачных кремниевых материалов и оптические устройства
KR101601271B1 (ko) * 2009-07-20 2016-03-08 주식회사 엘지화학 발광소자 봉지용 조성물, 발광 다이오드 및 액정표시장치
JP6309898B2 (ja) * 2012-01-16 2018-04-11 ダウ シリコーンズ コーポレーション 光学物品及び形成方法
CN102863623B (zh) * 2012-10-18 2014-05-14 广东科立盈光电技术有限公司 树枝状聚合物改性高折射率有机硅树脂的制备方法
US8800222B2 (en) 2012-12-27 2014-08-12 Agc Automotive Americas R&D, Inc. Encapsulants for window assemblies
US8753443B1 (en) 2013-01-02 2014-06-17 Jones-Blair Company Universal tint paste having high solids
CN103408945B (zh) * 2013-02-18 2016-01-20 永信新材料有限公司 可应用于发光二极管元件的聚硅氧烷组合物、基座配方及其发光二极管元件
WO2014152248A1 (en) * 2013-03-15 2014-09-25 Idd Aerospace Corporation Side emitting optical apparatus and method for possible use in an aircraft
US9487677B2 (en) * 2014-05-27 2016-11-08 Momentive Performance Materials, Inc. Release modifier composition
CN108025494B (zh) * 2015-11-26 2020-03-10 瓦克化学股份公司 用于通过弹道生成方法生产弹性体模制部件的高粘性硅酮组合物
DE102016202103A1 (de) * 2016-02-11 2017-08-17 Osram Gmbh Verfahren zum Herstellen eines Leuchtmoduls, Leuchtmodul sowie Verwendung eines Optikelements in einem Leuchtmodul
DE102016223516A1 (de) * 2016-11-28 2018-05-30 Osram Gmbh Herstellen eines Lichtdurchtrittkörpers für eine Leuchte
EP3673307B1 (en) 2017-08-24 2021-08-25 Dow Global Technologies LLC Method for optical waveguide fabrication
US10852480B2 (en) 2017-08-24 2020-12-01 Dow Global Technologies Llc Method for optical waveguide fabrication using polysiloxane, epoxy, photo acid generator, and hydrosilation catalyst
KR102620913B1 (ko) * 2017-08-24 2024-01-05 다우 글로벌 테크놀로지스 엘엘씨 광학 도파관 제작 방법

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10120906A (ja) * 1996-09-25 1998-05-12 Dow Corning Corp 光学的に透明なシリコーンゴム
JP2000235103A (ja) * 1999-02-16 2000-08-29 Konica Corp 高屈折率を有する光学素子、光学用レンズ及び光学用硬化性樹脂組成物
JP2004066556A (ja) * 2002-08-02 2004-03-04 Shin Etsu Polymer Co Ltd 透明接合部材、透明積層体およびその製造方法
JP2004143361A (ja) * 2002-10-28 2004-05-20 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2005076003A (ja) * 2003-09-03 2005-03-24 Ge Toshiba Silicones Co Ltd 付加硬化型シリコーン組成物
JP2005105217A (ja) * 2003-10-01 2005-04-21 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2006519896A (ja) * 2003-02-19 2006-08-31 ニューシル・テクノロジー・リミテッド・ライアビリティ・カンパニー 光学的透明性及び高温耐性を有する高屈折率のポリシロキサン
JP2009523856A (ja) * 2006-01-17 2009-06-25 ダウ・コーニング・コーポレイション 熱安定性の透明なシリコーン樹脂組成物、並びにその調製方法及び使用

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3296291A (en) 1962-07-02 1967-01-03 Gen Electric Reaction of silanes with unsaturated olefinic compounds
NL131800C (enExample) 1965-05-17
US3516946A (en) 1967-09-29 1970-06-23 Gen Electric Platinum catalyst composition for hydrosilation reactions
US3814730A (en) 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US3989668A (en) 1975-07-14 1976-11-02 Dow Corning Corporation Method of making a silicone elastomer and the elastomer prepared thereby
US4766176A (en) 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
US4784879A (en) 1987-07-20 1988-11-15 Dow Corning Corporation Method for preparing a microencapsulated compound of a platinum group metal
JP2630993B2 (ja) 1988-06-23 1997-07-16 東レ・ダウコーニング・シリコーン株式会社 ヒドロシリル化反応用白金系触媒含有粒状物およびその製造方法
JPH0214244A (ja) 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
US5036117A (en) 1989-11-03 1991-07-30 Dow Corning Corporation Heat-curable silicone compositions having improved bath life
GB9103191D0 (en) 1991-02-14 1991-04-03 Dow Corning Platinum complexes and use thereof
FR2680860B1 (fr) 1991-09-02 1997-07-04 Valeo Vision Element de support, notamment pour feu de signalisation de vehicule automobile et son procede de fabrication.
FR2680859B1 (fr) 1991-09-02 1993-10-29 Valeo Vision Element optique de collimation et son element de support associe, notamment pour feu de signalisation de vehicule automobile.
US5449802A (en) 1994-12-27 1995-09-12 Dow Corning Corporation Acetylenic alcohols and ethers as accelerators for hydrosilation
JP3098946B2 (ja) 1995-09-21 2000-10-16 東レ・ダウコーニング・シリコーン株式会社 剥離性硬化皮膜形成性オルガノポリシロキサン組成物
FR2766257B1 (fr) 1997-07-21 1999-10-08 Valeo Vision Module d'eclairage a conduit de lumiere pour vehicule automobile
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
US6568822B2 (en) 2001-04-06 2003-05-27 3M Innovative Properties Company Linear illumination source
US6509423B1 (en) 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
US6907176B2 (en) * 2002-06-24 2005-06-14 Dow Corning Corporation Planar optical waveguide assembly and method of preparing same
JP2004361692A (ja) * 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
US8017449B2 (en) 2003-08-08 2011-09-13 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
JP4651935B2 (ja) * 2003-12-10 2011-03-16 東レ・ダウコーニング株式会社 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材および光伝送部材の製造方法
JP2005227701A (ja) * 2004-02-16 2005-08-25 Dow Corning Corp 光伝送部材用硬化性オルガノポリシロキサン組成物、オルガノポリシロキサン硬化物からなる可撓性光伝送部材、および可撓性光伝送部材の製造方法
US7086765B2 (en) 2004-03-25 2006-08-08 Guide Corporation LED lamp with light pipe for automotive vehicles
JP4676735B2 (ja) 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
JP4800383B2 (ja) * 2005-05-26 2011-10-26 ダウ・コーニング・コーポレイション 小さい形状を成形するための方法およびシリコーン封止剤組成物

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10120906A (ja) * 1996-09-25 1998-05-12 Dow Corning Corp 光学的に透明なシリコーンゴム
JP2000235103A (ja) * 1999-02-16 2000-08-29 Konica Corp 高屈折率を有する光学素子、光学用レンズ及び光学用硬化性樹脂組成物
JP2004066556A (ja) * 2002-08-02 2004-03-04 Shin Etsu Polymer Co Ltd 透明接合部材、透明積層体およびその製造方法
JP2004143361A (ja) * 2002-10-28 2004-05-20 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2006519896A (ja) * 2003-02-19 2006-08-31 ニューシル・テクノロジー・リミテッド・ライアビリティ・カンパニー 光学的透明性及び高温耐性を有する高屈折率のポリシロキサン
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2005076003A (ja) * 2003-09-03 2005-03-24 Ge Toshiba Silicones Co Ltd 付加硬化型シリコーン組成物
JP2005105217A (ja) * 2003-10-01 2005-04-21 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2009523856A (ja) * 2006-01-17 2009-06-25 ダウ・コーニング・コーポレイション 熱安定性の透明なシリコーン樹脂組成物、並びにその調製方法及び使用

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235265A (ja) * 2008-03-27 2009-10-15 Shin Etsu Chem Co Ltd 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置
JP2010013503A (ja) * 2008-07-01 2010-01-21 Showa Highpolymer Co Ltd 硬化性樹脂組成物およびオプトデバイス
JP2016076724A (ja) * 2009-12-22 2016-05-12 三菱化学株式会社 樹脂成形体用材料、及び樹脂成形体の製造方法
WO2011125463A1 (ja) * 2010-03-31 2011-10-13 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
JP5060654B2 (ja) * 2010-03-31 2012-10-31 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
JP2012007136A (ja) * 2010-05-21 2012-01-12 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
JPWO2013051600A1 (ja) * 2011-10-04 2015-03-30 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
WO2013051600A1 (ja) * 2011-10-04 2013-04-11 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
KR101913869B1 (ko) 2012-07-19 2018-10-31 신에쓰 가가꾸 고교 가부시끼가이샤 경화성 실리콘 수지 조성물
WO2015005221A1 (ja) * 2013-07-08 2015-01-15 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーン組成物及び光半導体装置
JPWO2015005221A1 (ja) * 2013-07-08 2017-03-02 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーン組成物及び光半導体装置
WO2015019705A1 (ja) * 2013-08-09 2015-02-12 横浜ゴム株式会社 硬化性樹脂組成物
JP6015864B2 (ja) * 2013-08-09 2016-10-26 横浜ゴム株式会社 硬化性樹脂組成物
JP2015110752A (ja) * 2013-11-05 2015-06-18 信越化学工業株式会社 紫外線硬化性接着性オルガノポリシロキサン組成物
WO2016035285A1 (ja) * 2014-09-01 2016-03-10 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、硬化性ホットメルトシリコーン、および光デバイス
CN106604970A (zh) * 2014-09-01 2017-04-26 道康宁东丽株式会社 可固化硅酮组合物、可固化热熔硅酮以及光学装置
US10208164B2 (en) 2014-09-01 2019-02-19 Dow Corning Toray Co., Ltd. Curable silicone composition, curable hot-melt silicone, and optical device
CN106604970B (zh) * 2014-09-01 2023-01-20 Ddp特种电子材料美国第9有限公司 可固化硅酮组合物、可固化热熔硅酮以及光学装置

Also Published As

Publication number Publication date
TW200825125A (en) 2008-06-16
JP2012017470A (ja) 2012-01-26
MY147460A (en) 2012-12-14
EP2402795A2 (en) 2012-01-04
WO2008027280A2 (en) 2008-03-06
KR101397616B1 (ko) 2014-05-26
EP2402795B1 (en) 2014-03-19
EP2069829B1 (en) 2011-12-07
CN101529277B (zh) 2011-12-21
KR20090055016A (ko) 2009-06-01
TWI346670B (en) 2011-08-11
EP2402796A2 (en) 2012-01-04
ATE536558T1 (de) 2011-12-15
EP2402795A3 (en) 2012-07-25
EP2402796A3 (en) 2012-04-18
CN101529277A (zh) 2009-09-09
WO2008027280A3 (en) 2008-05-15
EP2069829A2 (en) 2009-06-17

Similar Documents

Publication Publication Date Title
CN101529277B (zh) 光学器件和有机硅组合物以及制造光学器件的方法
CN104262970B (zh) 用于产生透明硅氧烷材料和光学器件的硅氧烷组合物
JP4895879B2 (ja) 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法
US8071697B2 (en) Silicone encapsulant composition for molding small shapes
EP2196503B1 (en) Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof
CN101356214B (zh) 热稳定的透明有机硅树脂组合物及其制备方法和用途
EP2756027B1 (en) Curable silicone composition, cured product thereof, and optical semiconductor device
KR101873592B1 (ko) 실리콘 수지 조성물의 경화 방법
CN101027786A (zh) 光学半导体器件及其制造方法
EP3673015B1 (en) Injection moldable silicone composition
JP2007197511A (ja) シリコーン硬化物の製造方法
JP2018532864A (ja) 硬化性シリコーン組成物
KR20180135860A (ko) 경화성 실리콘 조성물

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100817

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20100817

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20101001

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101102

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110127

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110301

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110524