JP2010507098A5 - - Google Patents

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Publication number
JP2010507098A5
JP2010507098A5 JP2009533469A JP2009533469A JP2010507098A5 JP 2010507098 A5 JP2010507098 A5 JP 2010507098A5 JP 2009533469 A JP2009533469 A JP 2009533469A JP 2009533469 A JP2009533469 A JP 2009533469A JP 2010507098 A5 JP2010507098 A5 JP 2010507098A5
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JP
Japan
Prior art keywords
probe
column
spring
card assembly
contact structure
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JP2009533469A
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Japanese (ja)
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JP5466007B2 (ja
JP2010507098A (ja
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Priority claimed from US11/872,008 external-priority patent/US8130007B2/en
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Publication of JP2010507098A5 publication Critical patent/JP2010507098A5/ja
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Publication of JP5466007B2 publication Critical patent/JP5466007B2/ja
Expired - Fee Related legal-status Critical Current
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JP2009533469A 2006-10-16 2007-10-15 プローブカードアセンブリ Expired - Fee Related JP5466007B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US82967406P 2006-10-16 2006-10-16
US60/829,674 2006-10-16
US93867307P 2007-05-17 2007-05-17
US60/938,673 2007-05-17
US11/872,008 US8130007B2 (en) 2006-10-16 2007-10-13 Probe card assembly with carbon nanotube probes having a spring mechanism therein
US11/872,008 2007-10-13
PCT/US2007/081423 WO2008048938A2 (en) 2006-10-16 2007-10-15 Making and using carbon nanotube probes

Publications (3)

Publication Number Publication Date
JP2010507098A JP2010507098A (ja) 2010-03-04
JP2010507098A5 true JP2010507098A5 (cg-RX-API-DMAC7.html) 2010-12-16
JP5466007B2 JP5466007B2 (ja) 2014-04-09

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ID=39314777

Family Applications (1)

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JP2009533469A Expired - Fee Related JP5466007B2 (ja) 2006-10-16 2007-10-15 プローブカードアセンブリ

Country Status (6)

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US (1) US8130007B2 (cg-RX-API-DMAC7.html)
EP (1) EP2084424A2 (cg-RX-API-DMAC7.html)
JP (1) JP5466007B2 (cg-RX-API-DMAC7.html)
KR (1) KR101406270B1 (cg-RX-API-DMAC7.html)
TW (1) TWI433200B (cg-RX-API-DMAC7.html)
WO (1) WO2008048938A2 (cg-RX-API-DMAC7.html)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8466703B2 (en) * 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
US7439731B2 (en) 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US8337979B2 (en) 2006-05-19 2012-12-25 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
EP2024283A2 (en) 2006-05-19 2009-02-18 Massachusetts Institute of Technology Continuous process for the production of nanostructures including nanotubes
US7731503B2 (en) * 2006-08-21 2010-06-08 Formfactor, Inc. Carbon nanotube contact structures
US8354855B2 (en) * 2006-10-16 2013-01-15 Formfactor, Inc. Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
WO2010037097A1 (en) 2008-09-29 2010-04-01 Wentworth Laboratories, Inc. Probe cards including nanotube probes and methods of fabricating
US8167640B2 (en) * 2009-03-19 2012-05-01 Bioness Inc. Flexible connector for implantable electrical stimulation lead
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
FR2944805B1 (fr) * 2009-04-22 2018-04-06 Institut Bergognie Signature moleculaire pronostique des sarcomes et utilisations
JP5465516B2 (ja) * 2009-12-08 2014-04-09 日本電子材料株式会社 プローブ及びプローブの製造方法
TWI534432B (zh) * 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
TWI531527B (zh) * 2010-11-08 2016-05-01 鴻海精密工業股份有限公司 電連接器製造方法
CN103328993B (zh) 2010-12-09 2016-03-23 温特沃斯实验室公司 探针卡组件和包括碳纳米管材料体的探针针体
JP5842349B2 (ja) * 2011-03-18 2016-01-13 富士通株式会社 シート状構造体、シート状構造体の製造方法、電子機器及び電子機器の製造方法
JP2012225865A (ja) * 2011-04-22 2012-11-15 Shinshu Univ プローブ針の製造方法、プローブ針およびプローブ装置
KR101280419B1 (ko) 2011-08-17 2013-06-28 (주)기가레인 프로브카드
KR101229233B1 (ko) 2011-08-17 2013-02-04 (주)기가레인 프로브카드
WO2013046291A1 (ja) 2011-09-26 2013-04-04 富士通株式会社 放熱材料及びその製造方法並びに電子機器及びその製造方法
CN103824827B (zh) 2012-11-16 2017-02-08 台达电子企业管理(上海)有限公司 封装模块、封装终端及其制造方法
US10266402B2 (en) 2012-11-20 2019-04-23 Formfactor, Inc. Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such
US9494618B2 (en) * 2012-12-26 2016-11-15 Translarity, Inc. Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods
ES2663666T3 (es) 2013-02-28 2018-04-16 N12 Technologies, Inc. Dispensación basada en cartucho de películas de nanoestructura
US9832887B2 (en) * 2013-08-07 2017-11-28 Invensas Corporation Micro mechanical anchor for 3D architecture
JP6301680B2 (ja) * 2014-02-25 2018-03-28 エイブリック株式会社 弾性プローブ
CN104952989B (zh) * 2014-03-26 2018-02-27 清华大学 外延结构
US10732201B2 (en) * 2014-04-13 2020-08-04 Infineon Technologies Ag Test probe and method of manufacturing a test probe
EP3307678A4 (en) * 2015-06-12 2019-03-06 LINTEC Corporation CARBON NANOTUBE FOREST TYPE LAMINATED BODY AND METHOD FOR PRODUCING THE SAME
DE102015015452A1 (de) * 2015-12-02 2017-06-08 Forschungszentrum Jülich GmbH Verfahren zum Planarisieren von Nanostrukturen
ES2953299T3 (es) 2016-05-31 2023-11-10 Massachusetts Inst Technology Artículos compuestos que comprenden nanoestructuras alargadas no lineales y métodos asociados
WO2017214474A1 (en) 2016-06-10 2017-12-14 Lintec Of America, Inc. Nanofiber sheet
KR101839949B1 (ko) * 2016-10-14 2018-03-19 부경대학교 산학협력단 반도체 소자 테스트용 소켓의 제조 방법
WO2018156878A1 (en) 2017-02-24 2018-08-30 Lintec Of America, Inc. Nanofiber thermal interface material
JP2019035698A (ja) * 2017-08-18 2019-03-07 日本電産リード株式会社 プローブ構造体、及びプローブ構造体の製造方法
EP4516846A3 (en) 2017-09-15 2025-12-24 Massachusetts Institute of Technology Low-defect fabrication of composite materials
JP2019066245A (ja) * 2017-09-29 2019-04-25 日本電産リード株式会社 接触端子、接触端子を備えた検査治具、及び接触端子の製造方法
WO2019108616A1 (en) 2017-11-28 2019-06-06 Massachusetts Institute Of Technology Separators comprising elongated nanostructures and associated devices and methods for energy storage and/or use
US11243231B2 (en) * 2018-12-18 2022-02-08 Tien-Chien Cheng Vertical probe card
US11579171B1 (en) * 2019-02-15 2023-02-14 Meta Platforms Technologies, Llc Probe card for characterizing processes of submicron semiconductor device fabrication
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
WO2025029297A1 (en) * 2023-08-03 2025-02-06 Microfabrica Inc. Probes with modulating mechanical properties by using nano-fibers, corresponding probe arrays and methods of forming probe arrays

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US6714625B1 (en) * 1992-04-08 2004-03-30 Elm Technology Corporation Lithography device for semiconductor circuit pattern generation
US6184053B1 (en) * 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
US5903161A (en) * 1995-01-26 1999-05-11 Denki Kagaku Kogyo Kabushiki Kaisha Electrically conductive rod-shaped single crystal product and assembly for measuring electrical properties employing such product, as well as processes for their production
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
AU721291C (en) * 1996-05-15 2003-02-27 Hyperion Catalysis International, Inc. Graphitic nanofibers in electrochemical capacitors
AU4055297A (en) * 1996-08-08 1998-02-25 William Marsh Rice University Macroscopically manipulable nanoscale devices made from nanotube assemblies
JP3740295B2 (ja) * 1997-10-30 2006-02-01 キヤノン株式会社 カーボンナノチューブデバイス、その製造方法及び電子放出素子
US6020747A (en) * 1998-01-26 2000-02-01 Bahns; John T. Electrical contact probe
US6528785B1 (en) * 1998-12-03 2003-03-04 Daiken Chemical Co., Ltd. Fusion-welded nanotube surface signal probe and method of attaching nanotube to probe holder
US6863942B2 (en) 1998-06-19 2005-03-08 The Research Foundation Of State University Of New York Free-standing and aligned carbon nanotubes and synthesis thereof
US6346189B1 (en) 1998-08-14 2002-02-12 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotube structures made using catalyst islands
US6597090B1 (en) 1998-09-28 2003-07-22 Xidex Corporation Method for manufacturing carbon nanotubes as functional elements of MEMS devices
US6232706B1 (en) 1998-11-12 2001-05-15 The Board Of Trustees Of The Leland Stanford Junior University Self-oriented bundles of carbon nanotubes and method of making same
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
AUPQ065099A0 (en) 1999-05-28 1999-06-24 Commonwealth Scientific And Industrial Research Organisation Substrate-supported aligned carbon nanotube films
US6400173B1 (en) * 1999-11-19 2002-06-04 Hitachi, Ltd. Test system and manufacturing of semiconductor device
US6401526B1 (en) 1999-12-10 2002-06-11 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotubes and methods of fabrication thereof using a liquid phase catalyst precursor
DE10006964C2 (de) 2000-02-16 2002-01-31 Infineon Technologies Ag Elektronisches Bauelement mit einer leitenden Verbindung zwischen zwei leitenden Schichten und Verfahren zum Herstellen eines elektronischen Bauelements
CA2408172A1 (en) 2000-05-16 2001-11-22 Peter Supronowicz Electrically conducting nanocomposite materials for biomedical applications
ATE311604T1 (de) * 2000-06-20 2005-12-15 Nanonexus Inc Testsystem von integrierten schaltungen
US6709566B2 (en) * 2000-07-25 2004-03-23 The Regents Of The University Of California Method for shaping a nanotube and a nanotube shaped thereby
US6379982B1 (en) * 2000-08-17 2002-04-30 Micron Technology, Inc. Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing
US6457350B1 (en) 2000-09-08 2002-10-01 Fei Company Carbon nanotube probe tip grown on a small probe
US7258901B1 (en) 2000-09-08 2007-08-21 Fei Company Directed growth of nanotubes on a catalyst
JP2002179418A (ja) 2000-12-13 2002-06-26 Tohoku Techno Arch Co Ltd カーボン・ナノチューブ作成方法
JP3912583B2 (ja) 2001-03-14 2007-05-09 三菱瓦斯化学株式会社 配向性カーボンナノチューブ膜の製造方法
US6890506B1 (en) 2001-04-12 2005-05-10 Penn State Research Foundation Method of forming carbon fibers
US7160531B1 (en) 2001-05-08 2007-01-09 University Of Kentucky Research Foundation Process for the continuous production of aligned carbon nanotubes
DE10132787A1 (de) 2001-07-06 2003-01-30 Infineon Technologies Ag Katalysatormaterial, Kohlenstoffnanoröhren-Anordnung und Verfahren zum Herstellen einer Kohlenstoffnanoröhren-Anordnung
JP3768937B2 (ja) 2001-09-10 2006-04-19 キヤノン株式会社 電子放出素子、電子源及び画像表示装置の製造方法
WO2003049219A1 (en) 2001-11-30 2003-06-12 The Trustees Of Boston College Coated carbon nanotube array electrodes
TW200301360A (en) * 2001-12-03 2003-07-01 Advantest Corp Contact structure and production method thereof and probe contact assembly using same
EP1341184B1 (en) * 2002-02-09 2005-09-14 Samsung Electronics Co., Ltd. Memory device utilizing carbon nanotubes and method of fabricating the memory device
CA2475790A1 (en) * 2002-02-11 2003-08-21 Rensselaer Polytechnic Institute Directed assembly of highly-organized carbon nanotube architectures
US6919730B2 (en) * 2002-03-18 2005-07-19 Honeywell International, Inc. Carbon nanotube sensor
JP3860057B2 (ja) * 2002-03-20 2006-12-20 アンリツ株式会社 電気接点装置及び接触子
JP4051988B2 (ja) * 2002-04-09 2008-02-27 富士ゼロックス株式会社 光電変換素子および光電変換装置
US20040208788A1 (en) * 2003-04-15 2004-10-21 Colton Jonathan S. Polymer micro-cantilevers and their methods of manufacture
US6869671B1 (en) * 2002-06-03 2005-03-22 University Of Notre Dame Enabling nanostructured materials via multilayer thin film precursor and applications to biosensors
US6626684B1 (en) * 2002-06-24 2003-09-30 Hewlett-Packard Development Company, L.P. Nanotube socket system and method
US6963077B2 (en) * 2002-07-25 2005-11-08 California Institute Of Technology Sublithographic nanoscale memory architecture
US7226663B2 (en) 2002-08-01 2007-06-05 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Portland State University Method for synthesizing nanoscale structures in defined locations
EP1540378A4 (en) 2002-09-20 2008-09-10 Trustees Of Boston College Low NANOROUS COAGULAR SENSORS FOR MAGNETIC MICROSCOPY ON NANOMASSIC STATION
JP3933035B2 (ja) 2002-11-06 2007-06-20 富士ゼロックス株式会社 カーボンナノチューブの製造装置および製造方法
AU2003291061A1 (en) 2002-11-18 2004-06-15 Rensselaer Polytechnic Institute Nanotube polymer composite and methods of making same
TWI220162B (en) * 2002-11-29 2004-08-11 Ind Tech Res Inst Integrated compound nano probe card and method of making same
US6870361B2 (en) * 2002-12-21 2005-03-22 Agilent Technologies, Inc. System with nano-scale conductor and nano-opening
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US6933222B2 (en) * 2003-01-02 2005-08-23 Intel Corporation Microcircuit fabrication and interconnection
WO2004102582A1 (en) 2003-03-05 2004-11-25 University Of Florida Carbon nanotube-based probes, related devices and methods of forming the same
US7641863B2 (en) * 2003-03-06 2010-01-05 Ut-Battelle Llc Nanoengineered membranes for controlled transport
JP4065801B2 (ja) 2003-03-20 2008-03-26 株式会社日立製作所 ナノピラーセンサ
TWI220163B (en) * 2003-04-24 2004-08-11 Ind Tech Res Inst Manufacturing method of high-conductivity nanometer thin-film probe card
US7082683B2 (en) * 2003-04-24 2006-08-01 Korea Institute Of Machinery & Materials Method for attaching rod-shaped nano structure to probe holder
US7531267B2 (en) 2003-06-02 2009-05-12 Kh Chemicals Co., Ltd. Process for preparing carbon nanotube electrode comprising sulfur or metal nanoparticles as a binder
US20050019245A1 (en) 2003-07-21 2005-01-27 Dmitri Koulikov Continuous production of carbon nanotubes and fullerenes
US7109732B2 (en) * 2003-07-31 2006-09-19 Endicott Interconnect Technologies, Inc. Electronic component test apparatus
GB0318987D0 (en) 2003-08-13 2003-09-17 Univ Warwick Probe
JP2005083857A (ja) 2003-09-08 2005-03-31 Yoshikazu Nakayama ナノチューブプローブ及び製造方法
US20050116214A1 (en) * 2003-10-31 2005-06-02 Mammana Victor P. Back-gated field emission electron source
TW200517042A (en) * 2003-11-04 2005-05-16 Hon Hai Prec Ind Co Ltd Heat sink
US7473411B2 (en) 2003-12-12 2009-01-06 Rensselaer Polytechnic Institute Carbon nanotube foam and method of making and using thereof
EP1721173B1 (en) * 2004-03-02 2008-05-07 ETH Zürich Force sensor
US7250188B2 (en) 2004-03-31 2007-07-31 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of National Defense Of Her Majesty's Canadian Government Depositing metal particles on carbon nanotubes
US20050233263A1 (en) 2004-04-20 2005-10-20 Applied Materials, Inc. Growth of carbon nanotubes at low temperature
US7251884B2 (en) * 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces
US20050285116A1 (en) 2004-06-29 2005-12-29 Yongqian Wang Electronic assembly with carbon nanotube contact formations or interconnections
EP1831703A1 (en) * 2004-07-21 2007-09-12 SV Probe Pte Ltd. Reinforced probes for testing semiconductor devices
JP4167212B2 (ja) * 2004-10-05 2008-10-15 富士通株式会社 カーボンナノチューブ構造体、半導体装置、および半導体パッケージ
JP2006125846A (ja) * 2004-10-26 2006-05-18 Olympus Corp カンチレバー
JP2006177759A (ja) * 2004-12-22 2006-07-06 Namiki Precision Jewel Co Ltd カーボンナノチューブの先端加工
CN100501413C (zh) * 2005-01-22 2009-06-17 鸿富锦精密工业(深圳)有限公司 集成电路检测装置及其制备方法
US20060188721A1 (en) 2005-02-22 2006-08-24 Eastman Kodak Company Adhesive transfer method of carbon nanotube layer
US20060198956A1 (en) 2005-03-04 2006-09-07 Gyula Eres Chemical vapor deposition of long vertically aligned dense carbon nanotube arrays by external control of catalyst composition
US7439731B2 (en) * 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US7538040B2 (en) 2005-06-30 2009-05-26 Nantero, Inc. Techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
US7777291B2 (en) * 2005-08-26 2010-08-17 Smoltek Ab Integrated circuits having interconnects and heat dissipators based on nanostructures
DE102006039651A1 (de) * 2005-08-31 2007-03-22 Hitachi Kenki Finetech Co., Ltd. Cantilever und Prüfvorrichtung
WO2007033188A2 (en) 2005-09-12 2007-03-22 University Of Dayton Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes
CN1964028B (zh) 2005-11-11 2010-08-18 鸿富锦精密工业(深圳)有限公司 散热器
US7727624B2 (en) 2005-11-22 2010-06-01 Rensselaer Polytechnic Institute Super-compressible carbon nanotube films and micro-bundles
US7625817B2 (en) * 2005-12-30 2009-12-01 Intel Corporation Method of fabricating a carbon nanotube interconnect structures
US20070158768A1 (en) * 2006-01-06 2007-07-12 Honeywell International, Inc. Electrical contacts formed of carbon nanotubes
KR101159074B1 (ko) * 2006-01-14 2012-06-25 삼성전자주식회사 도전성 탄소나노튜브 팁, 이를 구비한 스캐닝 프로브마이크로스코프의 탐침 및 상기 도전성 탄소나노튜브 팁의제조 방법
JP4806762B2 (ja) 2006-03-03 2011-11-02 国立大学法人 名古屋工業大学 Spmカンチレバー
US20070235713A1 (en) * 2006-04-03 2007-10-11 Motorola, Inc. Semiconductor device having carbon nanotube interconnects and method of fabrication
EP1845124A1 (en) 2006-04-14 2007-10-17 Arkema France Conductive carbon nanotube-polymer composite
US7687981B2 (en) * 2006-05-05 2010-03-30 Brother International Corporation Method for controlled density growth of carbon nanotubes
US7731503B2 (en) * 2006-08-21 2010-06-08 Formfactor, Inc. Carbon nanotube contact structures
TWI360182B (en) * 2007-10-05 2012-03-11 Ind Tech Res Inst Method for making a conductive film
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components

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