JP2010504626A5 - - Google Patents

Download PDF

Info

Publication number
JP2010504626A5
JP2010504626A5 JP2009510223A JP2009510223A JP2010504626A5 JP 2010504626 A5 JP2010504626 A5 JP 2010504626A5 JP 2009510223 A JP2009510223 A JP 2009510223A JP 2009510223 A JP2009510223 A JP 2009510223A JP 2010504626 A5 JP2010504626 A5 JP 2010504626A5
Authority
JP
Japan
Prior art keywords
resin
plate
emitting element
light emitting
element according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009510223A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010504626A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2007/068315 external-priority patent/WO2008035749A1/en
Publication of JP2010504626A publication Critical patent/JP2010504626A/ja
Publication of JP2010504626A5 publication Critical patent/JP2010504626A5/ja
Pending legal-status Critical Current

Links

JP2009510223A 2006-09-20 2007-09-13 光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物 Pending JP2010504626A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006254286 2006-09-20
JP2007000627 2007-01-05
PCT/JP2007/068315 WO2008035749A1 (en) 2006-09-20 2007-09-13 Method of manufacturing an optical element and a resin-sealed light emitting element and article so obtained

Publications (2)

Publication Number Publication Date
JP2010504626A JP2010504626A (ja) 2010-02-12
JP2010504626A5 true JP2010504626A5 (enExample) 2010-09-24

Family

ID=38917646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009510223A Pending JP2010504626A (ja) 2006-09-20 2007-09-13 光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物

Country Status (6)

Country Link
US (1) US7915801B2 (enExample)
JP (1) JP2010504626A (enExample)
KR (1) KR101308774B1 (enExample)
CN (1) CN101528447B (enExample)
TW (1) TW200816859A (enExample)
WO (1) WO2008035749A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100986005B1 (ko) 2008-11-27 2010-10-06 삼성전기주식회사 웨이퍼 렌즈 제작 방법
JP5541413B2 (ja) * 2011-04-25 2014-07-09 日立金属株式会社 シンチレータアレイの製造方法
JP6114987B2 (ja) * 2012-12-26 2017-04-19 唐沢 伸 蓄光表示部材の製造方法
JP6374723B2 (ja) * 2014-07-25 2018-08-15 スタンレー電気株式会社 半導体発光装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154506A (en) * 1976-08-12 1979-05-15 Izon Corporation Projection lens plate for microfiche
JPS5794706A (en) * 1980-12-04 1982-06-12 Ricoh Co Ltd Plate-like lens
JPS5945401A (ja) * 1982-09-08 1984-03-14 Oki Electric Ind Co Ltd 多連レンズ
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
JPH0555636A (ja) * 1991-08-22 1993-03-05 Sanken Electric Co Ltd 半導体発光装置の製造方法
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd Light emitting diode assembly and manufacturing method.
JP2739279B2 (ja) * 1993-06-30 1998-04-15 三菱電線工業株式会社 基板に実装された電子部品のモールド方法
JP3432113B2 (ja) * 1997-07-07 2003-08-04 シャープ株式会社 光半導体装置
JP2001223285A (ja) * 2000-02-09 2001-08-17 Rohm Co Ltd チップ型半導体装置及びその製造方法
JP3614776B2 (ja) 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
JP2002252375A (ja) * 2001-02-23 2002-09-06 Kanegafuchi Chem Ind Co Ltd 発光ダイオード及びその製造方法
US6639356B2 (en) * 2002-03-28 2003-10-28 Unity Opto Technology Co., Ltd. Heat dissipating light emitting diode
US6753661B2 (en) 2002-06-17 2004-06-22 Koninklijke Philips Electronics N.V. LED-based white-light backlighting for electronic displays
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
JP4307090B2 (ja) * 2003-01-27 2009-08-05 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP4073341B2 (ja) 2003-03-14 2008-04-09 三洋電機株式会社 多室形空気調和装置およびその制御方法
JP2005123238A (ja) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd 半導体発光装置の製造方法および半導体発光装置
JP3875247B2 (ja) 2004-09-27 2007-01-31 株式会社エンプラス 発光装置、面光源装置、表示装置及び光束制御部材
US8134292B2 (en) 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
US20060105483A1 (en) * 2004-11-18 2006-05-18 Leatherdale Catherine A Encapsulated light emitting diodes and methods of making
JP4929595B2 (ja) * 2005-01-18 2012-05-09 三菱瓦斯化学株式会社 封止樹脂用組成物
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置

Similar Documents

Publication Publication Date Title
TWI715758B (zh) 半導體器件封裝件及製造其之方法
EP2973760B1 (en) Unitary optic member and manufacturing method thereof
JP2007086787A5 (enExample)
KR200455066Y1 (ko) 적층 렌즈 모듈을 위한 렌즈 홀더
CN103386763A (zh) 制作压印的多层聚合物透镜的方法
JP2010504626A5 (enExample)
CN105682907A (zh) 光学透镜、光学透镜制造装置以及制造方法
CN102820234A (zh) 光元件的树脂密封成形方法
WO2012055046A1 (en) Lens array assembly for solid state light sources and method
JP2008170534A5 (enExample)
JP2012084724A5 (enExample)
JP2008310213A5 (enExample)
CN101528447B (zh) 光学元件和树脂密封发光元件的制造方法及所制得的产品
EP1560270A3 (en) Optical device
US12185474B2 (en) Electronic device with multilayer laminate
KR20090037570A (ko) 플라스틱 몰딩을 이용한 카메라 모듈 제작방법
CN111703015A (zh) 导光板制作方法及导光板、侧入式背光模组
KR101425588B1 (ko) 빛 효율을 높일 수 있는 ｌｅｄ 제조 방법
JP2009018559A (ja) Ｌｅｄ装置におけるレンズの製造方法およびその装置
JP2009226631A5 (enExample)
KR101852345B1 (ko) 유리 코팅 제작 방법
US9004734B2 (en) Light guide plate including optical fibers and method of manufacturing same
TW201238099A (en) LED with primary optical lens packing method and LED assembly thereof
JP2007214098A5 (enExample)
KR101407333B1 (ko) 마이크로 렌즈 형성 방법