JP2010504626A - 光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物 - Google Patents

光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物 Download PDF

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Publication number
JP2010504626A
JP2010504626A JP2009510223A JP2009510223A JP2010504626A JP 2010504626 A JP2010504626 A JP 2010504626A JP 2009510223 A JP2009510223 A JP 2009510223A JP 2009510223 A JP2009510223 A JP 2009510223A JP 2010504626 A JP2010504626 A JP 2010504626A
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JP
Japan
Prior art keywords
resin
plate
emitting element
light emitting
optical
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JP2009510223A
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English (en)
Japanese (ja)
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JP2010504626A5 (enExample
Inventor
雅之 四條
俊二 渡辺
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Nikon Corp
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Nikon Corp
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Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JP2010504626A publication Critical patent/JP2010504626A/ja
Publication of JP2010504626A5 publication Critical patent/JP2010504626A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2009510223A 2006-09-20 2007-09-13 光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物 Pending JP2010504626A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006254286 2006-09-20
JP2007000627 2007-01-05
PCT/JP2007/068315 WO2008035749A1 (en) 2006-09-20 2007-09-13 Method of manufacturing an optical element and a resin-sealed light emitting element and article so obtained

Publications (2)

Publication Number Publication Date
JP2010504626A true JP2010504626A (ja) 2010-02-12
JP2010504626A5 JP2010504626A5 (enExample) 2010-09-24

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ID=38917646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009510223A Pending JP2010504626A (ja) 2006-09-20 2007-09-13 光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物

Country Status (6)

Country Link
US (1) US7915801B2 (enExample)
JP (1) JP2010504626A (enExample)
KR (1) KR101308774B1 (enExample)
CN (1) CN101528447B (enExample)
TW (1) TW200816859A (enExample)
WO (1) WO2008035749A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014124838A (ja) * 2012-12-26 2014-07-07 Znet Corp 蓄光表示部材の製造方法
JP2016029687A (ja) * 2014-07-25 2016-03-03 スタンレー電気株式会社 半導体発光装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100986005B1 (ko) 2008-11-27 2010-10-06 삼성전기주식회사 웨이퍼 렌즈 제작 방법
JP5541413B2 (ja) * 2011-04-25 2014-07-09 日立金属株式会社 シンチレータアレイの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
JPH0555636A (ja) * 1991-08-22 1993-03-05 Sanken Electric Co Ltd 半導体発光装置の製造方法
JPH1126647A (ja) * 1997-07-07 1999-01-29 Sharp Corp 光半導体装置
JP2001223285A (ja) * 2000-02-09 2001-08-17 Rohm Co Ltd チップ型半導体装置及びその製造方法
JP2002252375A (ja) * 2001-02-23 2002-09-06 Kanegafuchi Chem Ind Co Ltd 発光ダイオード及びその製造方法
JP2004228531A (ja) * 2003-01-27 2004-08-12 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005123238A (ja) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd 半導体発光装置の製造方法および半導体発光装置
JP2006199724A (ja) * 2005-01-18 2006-08-03 Mitsubishi Gas Chem Co Inc 封止樹脂用組成物
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154506A (en) * 1976-08-12 1979-05-15 Izon Corporation Projection lens plate for microfiche
JPS5794706A (en) * 1980-12-04 1982-06-12 Ricoh Co Ltd Plate-like lens
JPS5945401A (ja) * 1982-09-08 1984-03-14 Oki Electric Ind Co Ltd 多連レンズ
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd Light emitting diode assembly and manufacturing method.
JP2739279B2 (ja) * 1993-06-30 1998-04-15 三菱電線工業株式会社 基板に実装された電子部品のモールド方法
JP3614776B2 (ja) 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
US6639356B2 (en) * 2002-03-28 2003-10-28 Unity Opto Technology Co., Ltd. Heat dissipating light emitting diode
US6753661B2 (en) 2002-06-17 2004-06-22 Koninklijke Philips Electronics N.V. LED-based white-light backlighting for electronic displays
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
JP4073341B2 (ja) 2003-03-14 2008-04-09 三洋電機株式会社 多室形空気調和装置およびその制御方法
JP3875247B2 (ja) 2004-09-27 2007-01-31 株式会社エンプラス 発光装置、面光源装置、表示装置及び光束制御部材
US8134292B2 (en) 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
US20060105483A1 (en) * 2004-11-18 2006-05-18 Leatherdale Catherine A Encapsulated light emitting diodes and methods of making

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
JPH0555636A (ja) * 1991-08-22 1993-03-05 Sanken Electric Co Ltd 半導体発光装置の製造方法
JPH1126647A (ja) * 1997-07-07 1999-01-29 Sharp Corp 光半導体装置
JP2001223285A (ja) * 2000-02-09 2001-08-17 Rohm Co Ltd チップ型半導体装置及びその製造方法
JP2002252375A (ja) * 2001-02-23 2002-09-06 Kanegafuchi Chem Ind Co Ltd 発光ダイオード及びその製造方法
JP2004228531A (ja) * 2003-01-27 2004-08-12 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005123238A (ja) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd 半導体発光装置の製造方法および半導体発光装置
JP2006199724A (ja) * 2005-01-18 2006-08-03 Mitsubishi Gas Chem Co Inc 封止樹脂用組成物
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014124838A (ja) * 2012-12-26 2014-07-07 Znet Corp 蓄光表示部材の製造方法
JP2016029687A (ja) * 2014-07-25 2016-03-03 スタンレー電気株式会社 半導体発光装置

Also Published As

Publication number Publication date
KR20090056988A (ko) 2009-06-03
US7915801B2 (en) 2011-03-29
US20080067911A1 (en) 2008-03-20
CN101528447A (zh) 2009-09-09
KR101308774B1 (ko) 2013-09-17
TW200816859A (en) 2008-04-01
WO2008035749A1 (en) 2008-03-27
CN101528447B (zh) 2013-07-03

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