CN101528447B - 光学元件和树脂密封发光元件的制造方法及所制得的产品 - Google Patents

光学元件和树脂密封发光元件的制造方法及所制得的产品 Download PDF

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Publication number
CN101528447B
CN101528447B CN2007800344500A CN200780034450A CN101528447B CN 101528447 B CN101528447 B CN 101528447B CN 2007800344500 A CN2007800344500 A CN 2007800344500A CN 200780034450 A CN200780034450 A CN 200780034450A CN 101528447 B CN101528447 B CN 101528447B
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CN
China
Prior art keywords
aforementioned
resin
component
light
optical
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Expired - Fee Related
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CN2007800344500A
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English (en)
Chinese (zh)
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CN101528447A (zh
Inventor
四条雅之
渡边俊二
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Nikon Corp
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Nikon Corp
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Publication of CN101528447A publication Critical patent/CN101528447A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN2007800344500A 2006-09-20 2007-09-13 光学元件和树脂密封发光元件的制造方法及所制得的产品 Expired - Fee Related CN101528447B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP254286/2006 2006-09-20
JP2006254286 2006-09-20
JP000627/2007 2007-01-05
JP2007000627 2007-01-05
PCT/JP2007/068315 WO2008035749A1 (en) 2006-09-20 2007-09-13 Method of manufacturing an optical element and a resin-sealed light emitting element and article so obtained

Publications (2)

Publication Number Publication Date
CN101528447A CN101528447A (zh) 2009-09-09
CN101528447B true CN101528447B (zh) 2013-07-03

Family

ID=38917646

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800344500A Expired - Fee Related CN101528447B (zh) 2006-09-20 2007-09-13 光学元件和树脂密封发光元件的制造方法及所制得的产品

Country Status (6)

Country Link
US (1) US7915801B2 (enExample)
JP (1) JP2010504626A (enExample)
KR (1) KR101308774B1 (enExample)
CN (1) CN101528447B (enExample)
TW (1) TW200816859A (enExample)
WO (1) WO2008035749A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100986005B1 (ko) 2008-11-27 2010-10-06 삼성전기주식회사 웨이퍼 렌즈 제작 방법
JP5541413B2 (ja) * 2011-04-25 2014-07-09 日立金属株式会社 シンチレータアレイの製造方法
JP6114987B2 (ja) * 2012-12-26 2017-04-19 唐沢 伸 蓄光表示部材の製造方法
JP6374723B2 (ja) * 2014-07-25 2018-08-15 スタンレー電気株式会社 半導体発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A2 (en) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module
US20060091788A1 (en) * 2004-10-29 2006-05-04 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
US20060105483A1 (en) * 2004-11-18 2006-05-18 Leatherdale Catherine A Encapsulated light emitting diodes and methods of making

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Publication number Priority date Publication date Assignee Title
US4154506A (en) * 1976-08-12 1979-05-15 Izon Corporation Projection lens plate for microfiche
JPS5794706A (en) * 1980-12-04 1982-06-12 Ricoh Co Ltd Plate-like lens
JPS5945401A (ja) * 1982-09-08 1984-03-14 Oki Electric Ind Co Ltd 多連レンズ
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
JPH0555636A (ja) * 1991-08-22 1993-03-05 Sanken Electric Co Ltd 半導体発光装置の製造方法
JP2739279B2 (ja) * 1993-06-30 1998-04-15 三菱電線工業株式会社 基板に実装された電子部品のモールド方法
JP3432113B2 (ja) * 1997-07-07 2003-08-04 シャープ株式会社 光半導体装置
JP2001223285A (ja) * 2000-02-09 2001-08-17 Rohm Co Ltd チップ型半導体装置及びその製造方法
JP3614776B2 (ja) 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
JP2002252375A (ja) * 2001-02-23 2002-09-06 Kanegafuchi Chem Ind Co Ltd 発光ダイオード及びその製造方法
US6639356B2 (en) * 2002-03-28 2003-10-28 Unity Opto Technology Co., Ltd. Heat dissipating light emitting diode
US6753661B2 (en) 2002-06-17 2004-06-22 Koninklijke Philips Electronics N.V. LED-based white-light backlighting for electronic displays
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
JP4307090B2 (ja) * 2003-01-27 2009-08-05 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP4073341B2 (ja) 2003-03-14 2008-04-09 三洋電機株式会社 多室形空気調和装置およびその制御方法
JP2005123238A (ja) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd 半導体発光装置の製造方法および半導体発光装置
JP3875247B2 (ja) 2004-09-27 2007-01-31 株式会社エンプラス 発光装置、面光源装置、表示装置及び光束制御部材
JP4929595B2 (ja) * 2005-01-18 2012-05-09 三菱瓦斯化学株式会社 封止樹脂用組成物
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A2 (en) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module
US20060091788A1 (en) * 2004-10-29 2006-05-04 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
US20060105483A1 (en) * 2004-11-18 2006-05-18 Leatherdale Catherine A Encapsulated light emitting diodes and methods of making

Also Published As

Publication number Publication date
KR20090056988A (ko) 2009-06-03
US7915801B2 (en) 2011-03-29
US20080067911A1 (en) 2008-03-20
CN101528447A (zh) 2009-09-09
KR101308774B1 (ko) 2013-09-17
TW200816859A (en) 2008-04-01
WO2008035749A1 (en) 2008-03-27
JP2010504626A (ja) 2010-02-12

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