KR101308774B1 - 광학 소자와 수지 밀봉 발광 소자의 제조 방법, 광학 소자, 수지 밀봉 발광 소자 및 평면형 광원 장치 - Google Patents

광학 소자와 수지 밀봉 발광 소자의 제조 방법, 광학 소자, 수지 밀봉 발광 소자 및 평면형 광원 장치 Download PDF

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Publication number
KR101308774B1
KR101308774B1 KR1020097003641A KR20097003641A KR101308774B1 KR 101308774 B1 KR101308774 B1 KR 101308774B1 KR 1020097003641 A KR1020097003641 A KR 1020097003641A KR 20097003641 A KR20097003641 A KR 20097003641A KR 101308774 B1 KR101308774 B1 KR 101308774B1
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South Korea
Prior art keywords
resin
light emitting
mold
optical
manufacturing
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KR1020097003641A
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English (en)
Korean (ko)
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KR20090056988A (ko
Inventor
마사유키 시조
순지 와타나베
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가부시키가이샤 니콘
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020097003641A 2006-09-20 2007-09-13 광학 소자와 수지 밀봉 발광 소자의 제조 방법, 광학 소자, 수지 밀봉 발광 소자 및 평면형 광원 장치 Expired - Fee Related KR101308774B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2006-254286 2006-09-20
JP2006254286 2006-09-20
JP2007000627 2007-01-05
JPJP-P-2007-000627 2007-01-05
PCT/JP2007/068315 WO2008035749A1 (en) 2006-09-20 2007-09-13 Method of manufacturing an optical element and a resin-sealed light emitting element and article so obtained

Publications (2)

Publication Number Publication Date
KR20090056988A KR20090056988A (ko) 2009-06-03
KR101308774B1 true KR101308774B1 (ko) 2013-09-17

Family

ID=38917646

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097003641A Expired - Fee Related KR101308774B1 (ko) 2006-09-20 2007-09-13 광학 소자와 수지 밀봉 발광 소자의 제조 방법, 광학 소자, 수지 밀봉 발광 소자 및 평면형 광원 장치

Country Status (6)

Country Link
US (1) US7915801B2 (enExample)
JP (1) JP2010504626A (enExample)
KR (1) KR101308774B1 (enExample)
CN (1) CN101528447B (enExample)
TW (1) TW200816859A (enExample)
WO (1) WO2008035749A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100986005B1 (ko) 2008-11-27 2010-10-06 삼성전기주식회사 웨이퍼 렌즈 제작 방법
JP5541413B2 (ja) * 2011-04-25 2014-07-09 日立金属株式会社 シンチレータアレイの製造方法
JP6114987B2 (ja) * 2012-12-26 2017-04-19 唐沢 伸 蓄光表示部材の製造方法
JP6374723B2 (ja) * 2014-07-25 2018-08-15 スタンレー電気株式会社 半導体発光装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722653A (ja) * 1993-06-30 1995-01-24 Mitsubishi Cable Ind Ltd 基板に実装された電子部品のモールド方法
JP2002185046A (ja) 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2006128700A (ja) 2004-10-29 2006-05-18 Ledengin Inc 断熱及び屈折率適合材料を備えた発光装置
US20060105483A1 (en) 2004-11-18 2006-05-18 Leatherdale Catherine A Encapsulated light emitting diodes and methods of making

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Publication number Priority date Publication date Assignee Title
US4154506A (en) * 1976-08-12 1979-05-15 Izon Corporation Projection lens plate for microfiche
JPS5794706A (en) * 1980-12-04 1982-06-12 Ricoh Co Ltd Plate-like lens
JPS5945401A (ja) * 1982-09-08 1984-03-14 Oki Electric Ind Co Ltd 多連レンズ
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
JPH0555636A (ja) * 1991-08-22 1993-03-05 Sanken Electric Co Ltd 半導体発光装置の製造方法
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd Light emitting diode assembly and manufacturing method.
JP3432113B2 (ja) * 1997-07-07 2003-08-04 シャープ株式会社 光半導体装置
JP2001223285A (ja) * 2000-02-09 2001-08-17 Rohm Co Ltd チップ型半導体装置及びその製造方法
JP2002252375A (ja) * 2001-02-23 2002-09-06 Kanegafuchi Chem Ind Co Ltd 発光ダイオード及びその製造方法
US6639356B2 (en) * 2002-03-28 2003-10-28 Unity Opto Technology Co., Ltd. Heat dissipating light emitting diode
US6753661B2 (en) 2002-06-17 2004-06-22 Koninklijke Philips Electronics N.V. LED-based white-light backlighting for electronic displays
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
JP4307090B2 (ja) * 2003-01-27 2009-08-05 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP4073341B2 (ja) 2003-03-14 2008-04-09 三洋電機株式会社 多室形空気調和装置およびその制御方法
JP2005123238A (ja) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd 半導体発光装置の製造方法および半導体発光装置
JP3875247B2 (ja) 2004-09-27 2007-01-31 株式会社エンプラス 発光装置、面光源装置、表示装置及び光束制御部材
JP4929595B2 (ja) * 2005-01-18 2012-05-09 三菱瓦斯化学株式会社 封止樹脂用組成物
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722653A (ja) * 1993-06-30 1995-01-24 Mitsubishi Cable Ind Ltd 基板に実装された電子部品のモールド方法
JP2002185046A (ja) 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2006128700A (ja) 2004-10-29 2006-05-18 Ledengin Inc 断熱及び屈折率適合材料を備えた発光装置
US20060105483A1 (en) 2004-11-18 2006-05-18 Leatherdale Catherine A Encapsulated light emitting diodes and methods of making

Also Published As

Publication number Publication date
KR20090056988A (ko) 2009-06-03
US7915801B2 (en) 2011-03-29
US20080067911A1 (en) 2008-03-20
CN101528447A (zh) 2009-09-09
TW200816859A (en) 2008-04-01
WO2008035749A1 (en) 2008-03-27
CN101528447B (zh) 2013-07-03
JP2010504626A (ja) 2010-02-12

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