JP2010256327A - ミリ波撮像装置およびレーダーのためのデュアルバンドアンテナアレイおよびrfフロントエンド - Google Patents
ミリ波撮像装置およびレーダーのためのデュアルバンドアンテナアレイおよびrfフロントエンド Download PDFInfo
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- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
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- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
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- G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
- G01S2013/9327—Sensor installation details
- G01S2013/93275—Sensor installation details in the bumper area
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Abstract
【解決手段】自動車用レーダーは、上面と底面を有する印刷回路基板、印刷回路基板の底面に取付けられ且つ第1の周波数信号と第2の周波数信号を生成するプロセッサ、印刷回路基板の上面上に形成された第2の液晶ポリマー層、第2の液晶ポリマー層上に印刷され且つパッチを有する第2のマイクロストリップアレイ、第2の液晶ポリマー層上に形成された第1の液晶ポリマー層、第1の液晶ポリマー層上に印刷され且つ有孔パッチを有する第1のマイクロストリップアレイ、パッチの下方に配置され且つ第2のマイクロストリップアレイに接続されたアンテナ、さらに第2の液晶ポリマー層の底面に接続され且つプロセッサに接続され、さらに第1のマイクロストリップアレイに第1の周波数の信号を送信し、第2の周波数の信号を第2のマイクロストリップアレイに送信する送信/受信モジュール、を備える。
【選択図】図1
Description
103 第3の層
105 デュアルバンドアレイ
106 第1の層
107 第2の層
110 第1のマイクロストリップパッチアレイ
111 有孔パッチ
112 開口
113 220GHzパッチ
115 第2のマイクロストリップパッチアレイ
109 印刷回路基板(PCB)
120 接地面
Claims (20)
- 上面と底面を有する印刷回路基板と、
前記印刷回路基板の底面に取付けられたプロセッサであって、前記プロセッサは第1の周波数信号と第2の周波数信号を生成するように構成されたプロセッサと、
前記印刷回路基板の前記上面上に形成された第2の液晶ポリマー層と、
前記第2の液晶ポリマー層上に印刷され且つパッチを有する第2のマイクロストリップアレイと、
前記第2の液晶ポリマー層上に形成された第1の液晶ポリマー層と、
前記第1の液晶ポリマー層上に印刷され且つ有孔パッチを有する第1のマイクロストリップアレイと、
前記パッチの下方に配置され且つ前記第2のマイクロストリップアレイに接続されたアンテナと、さらに
前記第2の液晶ポリマー層の底面に接続された送信/受信モジュールであって、前記プロセッサに接続され、さらに前記第1のマイクロストリップアレイに前記第1の周波数の信号を送信し、前記第2の周波数の信号を前記第2のマイクロストリップアレイに送信するように構成された送信/受信モジュールと、を備える、自動車用レーダー。 - 請求項1に記載の自動車用レーダーにおいて、前記パッチは前記有孔パッチの直下に配置される、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記送信/受信モジュールは、前記第2の液晶ポリマー層の底面にフリップチップマウントされている、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、さらに、前記送信/受信モジュールから熱を取り除くために前記送信/受信モジュールに直接接続された複数の排熱ビアを供える、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記パッチは前記有孔パッチの外側境界内に位置している、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記第1の液晶ポリマー層は前記第2の液晶ポリマー層に結合されている、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記第2の周波数の信号は前記有孔パッチを介して前記パッチから送信される、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記送信/受信モジュールは、前記第1の周波数の信号を送信するための第1の送信/受信モジュールと、前記第2の周波数の信号を送信するための第2の送信/受信モジュールとを含む、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記第1の周波数の信号は約77GHzであり、前記第2の周波数の信号は約220GHzである、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記アンテナは、220GHz角状アンテナ、220GHzエンドファイヤアンテナおよび220GHz傾斜スロットアンテナから成るグループから選択される、自動車用レーダー。
- 請求項1に記載の自動車用レーダーにおいて、前記送信/受信モジュールは、SiGeBiCMOSチップおよび全シリコンCMOSチップからなるグループから選択される、自動車用レーダー。
- 請求項11に記載の自動車用レーダーにおいて、さらに、前記SiGeBiCMOSチップおよび接地ビア上に集積化された電圧制御発振器と、前記電圧制御発振器によって生成されたノイズを分離するための分割接地面とを備える、自動車用レーダー。
- 上面と底面を有する印刷回路基板と、
空洞を有し且つ前記印刷回路基板の上面に配置されたパッケージング層と、
複数のパッチを有し且つ前記パッケージング層上に配置された下部層と、
前記複数のパッチに接続され且つ前記下部層上に配置された下部マイクロストリップフィードと、
前記下部層上に位置し且つ前記複数のパッチを露出するための複数の孔を備えたパッチを有する上部層と、
前記上部層に位置し且つ前記パッチに接続された上部マイクロストリップフィードと、さらに
前記パッケージング層の前記空洞内に配置され、さらに、第1の周波数を有する第1の信号を前記上部マイクロストリップフィードに送信し且つ第2の周波数を有する第2の信号を前記下部マイクロストリップフィードに送信するように構成された、送信モジュールと、を備える自動車用レーダー。 - 請求項13に記載の自動車用レーダーであって、前記パッケージング層、前記下部層および前記上部層はそれぞれ、液晶ポリマー、低温同時焼結セラミック、パリレンN誘電体、PTFEセラミックおよびPTFEグラスファイバ材料からなるグループから選択された材料で形成される、自動車用レーダー。
- 請求項13に記載の自動車用レーダーであって、前記送信モジュールは、SiGeBiCMOSチップおよび全シリコンCMOSチップからなるグループから選択される、自動車用レーダー。
- 請求項13に記載の自動車用レーダーであって、前記第2の信号は、前記複数の孔を介して前記複数のパッチから送信される、自動車用レーダー。
- 請求項13に記載の自動車用レーダーであって、前記送信モジュールは、第1の信号を送信するための第1の送信モジュールと、前記第2の信号を送信するための第2の送信モジュールを含む、自動車用レーダー。
- 請求項13に記載の自動車用レーダーであって、前記第1の周波数は約77GHzであり、前記第2の周波数は約220GHzである、自動車用レーダー。
- 請求項13に記載の自動車用レーダーであって、さらに、前記送信モジュールから熱を取り除くために前記送信モジュールに直接接続された複数の排熱ビアを供える、自動車用レーダー。
- 上面と底面と空洞を有する印刷回路基板と、
複数のパッチを有し且つ前記印刷回路基板の前記上面上に配置された下部層と、
前記複数のパッチに接続され且つ前記下部層上に配置された下部マイクロストリップフィードと、
前記複数のパッチを露出する複数の孔を有し且つ前記下部層上に配置された上部層と、
前記パッチに接続され且つ前記上部層上に配置される上部マイクロストリップフィードと、さらに、
前記印刷回路基板の前記空洞内に配置され、第1の周波数を有する第1の信号を前記上部マイクロストリップフィードに送信し、第2の周波数を有する第2の信号を前記下部マイクロストリップフィードに送信するように構成された、送信モジュールと、を備える自動車用レーダー。
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US12/429,470 US8022861B2 (en) | 2008-04-04 | 2009-04-24 | Dual-band antenna array and RF front-end for mm-wave imager and radar |
US12/429,470 | 2009-04-24 |
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US20110156946A1 (en) | 2011-06-30 |
US20090251357A1 (en) | 2009-10-08 |
US8305255B2 (en) | 2012-11-06 |
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US8022861B2 (en) | 2011-09-20 |
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