JP2010182817A - 基板搬送装置及び基板処理システム - Google Patents
基板搬送装置及び基板処理システム Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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Abstract
【解決手段】基板搬送装置の搬送トレイ50は基板を保持する底板511、521と、その周囲に設けられた側周壁512、522とから構成されると共に、底板511、521には基板の受け渡しを行う相手である昇降部材が通過するための開口部53が設けられている。さらに搬送トレイ50には、開口部53内の昇降部材を搬送トレイ50の外側に通り抜けさせる空間54が一時的に形成されると共に、基板の搬送時には搬送トレイ50内に液体が溜められ、基板の上面側が当該液体に接した状態で基板を搬送する。
【選択図】図6
Description
その上面に基板を保持する底板と、この底板における基板が保持される領域の周囲に設けられた側周壁と、を備えた搬送トレイと、
この搬送トレイの底面に形成され、前記昇降部材が通過するための開口部と、
前記搬送トレイを水平移動させる移動機構と、
前記搬送トレイを水平移動させたときに、前記昇降部材が前記開口部と搬送トレイの外側との間で通り抜けができるように一時的に空間を形成する空間形成部と、を備え、
基板搬送時には、前記底板及びこの底板に保持された基板と前記側周壁とで囲まれる液溜め空間内に前記液体を溜めることを特徴とする。
(a)前記搬送トレイは、前記開口部を挟んで2つに分割されたトレイ部材を含み、前記空間形成部は、これらトレイ部材を、互いに接合される位置と両トレイ部材の間に前記通り抜けのための空間が形成される位置との間で移動させるトレイ部材移動部を供えること。
(b)前記液溜め空間内に溜めた液体に浸漬した状態で基板を搬送すること。
(c)前記側周壁と前記基板が保持される領域との間の底板には、前記空間内の液体を排出するための、開閉弁を備えた排液ラインが設けられていること。
この液処理装置から前記処理容器内に搬入された基板を超臨界状態の処理流体により処理することにより、前記液処理装置にて当該基板の表面に付着した液体を除去する第2の処理装置である超臨界処理装置と、
前記液処理装置と、前記超臨界処理装置との間で基板を搬送する上述の各基板搬送装置と、を備えたことを特徴とする。
(d)前記液処理装置は、前記搬送トレイに保持された基板に、前記超臨界処理装置にて超臨界状態となる流体と同種の物質を液体の状態で供給し、前記基板搬送装置は、基板の上面側に液体である前記物質が接した状態で基板を搬送すること。
(e)前記液処理装置は、前記搬送トレイに保持された基板に、前記超臨界処理装置にて超臨界状態となる流体とは別種の液体を供給し、前記基板搬送装置は、基板の上面側に前記別種の液体が接した状態で基板を搬送すること。
1 液処理システム
2 ウエハ搬送装置
21 第1の搬送アーム
201 走行レール
3 液処理装置
36 リフター
331 アンダープレート
4 超臨界処理装置
5 第2の搬送アーム
50 搬送トレイ
51、52 トレイ部材
511、521
底板
512、522
側周壁
53 開口部
54 通り抜け空間
55 排液ライン
7 制御部
Claims (7)
- 基板の上面側に液体が接した状態で基板を搬送し、基板の下面を支持する昇降部材との間で基板を受け渡す基板搬送装置において、
その上面に基板を保持する底板と、この底板における基板が保持される領域の周囲に設けられた側周壁と、を備えた搬送トレイと、
この搬送トレイの底面に形成され、前記昇降部材が通過するための開口部と、
前記搬送トレイを水平移動させる移動機構と、
前記搬送トレイを水平移動させたときに、前記昇降部材が前記開口部と搬送トレイの外側との間で通り抜けができるように一時的に空間を形成する空間形成部と、を備え、
基板搬送時には、前記底板及びこの底板に保持された基板と前記側周壁とで囲まれる液溜め空間内に前記液体を溜めることを特徴とする基板搬送装置。 - 前記搬送トレイは、前記開口部を挟んで2つに分割されたトレイ部材を含み、前記空間形成部は、これらトレイ部材を、互いに接合される位置と両トレイ部材の間に前記通り抜けのための空間が形成される位置との間で移動させるトレイ部材移動部を供えたことを特徴とする請求項1に記載の基板搬送装置。
- 前記液溜め空間内に溜めた液体に浸漬した状態で基板を搬送することを特徴とする請求項1または2に記載の基板搬送装置。
- 前記側周壁と前記基板が保持される領域との間の底板には、前記空間内の液体を排出するための、開閉弁を備えた排液ラインが設けられていることを特徴とする請求項1ないし3のいずれか一つに記載の基板搬送装置。
- 基板の表面に液体を供給して当該表面を洗浄する第1の処理装置である液処理装置と、
この液処理装置にて液体の付着した基板を密閉可能な処理容器内の載置台に載置し、前記液体が付着した基板に対して、超臨界状態の処理流体によって液体を除去する処理を行う第2の処理装置である超臨界処理装置と、
前記液処理装置と、前記超臨界処理装置との間で基板を搬送する請求項1ないし4のいずれか一つに記載の基板搬送装置と、を備えたことを特徴とする基板処理システム。 - 前記液処理装置は、前記搬送トレイに保持された基板に、前記超臨界処理装置にて超臨界状態となる流体と同種の物質を液体の状態で供給し、前記基板搬送装置は、基板の上面側に液体である前記物質が接した状態で基板を搬送することを特徴とする請求項5に記載の基板処理システム。
- 前記液処理装置は、前記搬送トレイに保持された基板に、前記超臨界処理装置にて超臨界状態となる流体とは別種の液体を供給し、前記基板搬送装置は、基板の上面側に前記別種の液体が接した状態で基板を搬送することを特徴とする請求項5に記載の基板処理システム。
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JP2009024025A JP5088335B2 (ja) | 2009-02-04 | 2009-02-04 | 基板搬送装置及び基板処理システム |
KR1020100006070A KR101466421B1 (ko) | 2009-02-04 | 2010-01-22 | 기판 반송 장치 및 기판 처리 시스템 |
US12/698,455 US8434423B2 (en) | 2009-02-04 | 2010-02-02 | Substrate carrying apparatus having circumferential sidewall and substrate processing system |
TW099103191A TWI429012B (zh) | 2009-02-04 | 2010-02-03 | 基板運送裝置及基板處理系統 |
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Also Published As
Publication number | Publication date |
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TWI429012B (zh) | 2014-03-01 |
US8434423B2 (en) | 2013-05-07 |
KR20100089752A (ko) | 2010-08-12 |
KR101466421B1 (ko) | 2014-12-11 |
TW201030889A (en) | 2010-08-16 |
JP5088335B2 (ja) | 2012-12-05 |
US20100192992A1 (en) | 2010-08-05 |
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