JP2010138433A5 - - Google Patents

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Publication number
JP2010138433A5
JP2010138433A5 JP2008314219A JP2008314219A JP2010138433A5 JP 2010138433 A5 JP2010138433 A5 JP 2010138433A5 JP 2008314219 A JP2008314219 A JP 2008314219A JP 2008314219 A JP2008314219 A JP 2008314219A JP 2010138433 A5 JP2010138433 A5 JP 2010138433A5
Authority
JP
Japan
Prior art keywords
cathode
dielectrics
semiconductor device
device manufacturing
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008314219A
Other languages
English (en)
Japanese (ja)
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JP2010138433A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008314219A priority Critical patent/JP2010138433A/ja
Priority claimed from JP2008314219A external-priority patent/JP2010138433A/ja
Publication of JP2010138433A publication Critical patent/JP2010138433A/ja
Publication of JP2010138433A5 publication Critical patent/JP2010138433A5/ja
Pending legal-status Critical Current

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JP2008314219A 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法 Pending JP2010138433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008314219A JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008314219A JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

Publications (2)

Publication Number Publication Date
JP2010138433A JP2010138433A (ja) 2010-06-24
JP2010138433A5 true JP2010138433A5 (enExample) 2012-01-19

Family

ID=42348807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008314219A Pending JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

Country Status (1)

Country Link
JP (1) JP2010138433A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101472637B1 (ko) * 2012-12-27 2014-12-15 삼성전기주식회사 전해도금 차폐판 및 이를 갖는 전해도금 장치
US11542624B2 (en) * 2020-10-01 2023-01-03 Ebara Corporation Plating apparatus
JP7555308B2 (ja) * 2020-10-01 2024-09-24 株式会社荏原製作所 めっき装置
US12359338B2 (en) * 2020-11-16 2025-07-15 Ebara Corporation Plate, apparatus for plating, and method of manufacturing plate
JP7630758B1 (ja) * 2024-06-27 2025-02-17 株式会社荏原製作所 めっき装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633500A (en) * 1979-08-28 1981-04-03 Fujitsu Ltd Averaging apparatus of distribution of plating electric current
JPS63176500A (ja) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd 電気めつき用遮蔽板
JPH02145791A (ja) * 1988-11-28 1990-06-05 Eagle Ind Co Ltd めっき装置とめっき方法およびめっき用遮蔽板
JPH10140392A (ja) * 1996-11-08 1998-05-26 Hitachi Cable Ltd 電気めっき装置
JP4027491B2 (ja) * 1998-03-03 2007-12-26 株式会社荏原製作所 ウエハのメッキ方法及び装置
JP4024991B2 (ja) * 2000-04-21 2007-12-19 株式会社荏原製作所 電解処理装置及びその電場状態制御方法
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置

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