JP2012104579A5 - - Google Patents

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Publication number
JP2012104579A5
JP2012104579A5 JP2010250461A JP2010250461A JP2012104579A5 JP 2012104579 A5 JP2012104579 A5 JP 2012104579A5 JP 2010250461 A JP2010250461 A JP 2010250461A JP 2010250461 A JP2010250461 A JP 2010250461A JP 2012104579 A5 JP2012104579 A5 JP 2012104579A5
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JP
Japan
Prior art keywords
plasma
mounting table
processing apparatus
electrostatic chuck
processing chamber
Prior art date
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Application number
JP2010250461A
Other languages
English (en)
Japanese (ja)
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JP2012104579A (ja
JP5503503B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010250461A external-priority patent/JP5503503B2/ja
Priority to JP2010250461A priority Critical patent/JP5503503B2/ja
Priority to TW100140364A priority patent/TWI533396B/zh
Priority to US13/290,440 priority patent/US8545672B2/en
Priority to KR1020110115722A priority patent/KR101898079B1/ko
Priority to CN201110353550.8A priority patent/CN102468106B/zh
Publication of JP2012104579A publication Critical patent/JP2012104579A/ja
Publication of JP2012104579A5 publication Critical patent/JP2012104579A5/ja
Publication of JP5503503B2 publication Critical patent/JP5503503B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010250461A 2010-11-09 2010-11-09 プラズマ処理装置 Expired - Fee Related JP5503503B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010250461A JP5503503B2 (ja) 2010-11-09 2010-11-09 プラズマ処理装置
TW100140364A TWI533396B (zh) 2010-11-09 2011-11-04 電漿處理裝置
US13/290,440 US8545672B2 (en) 2010-11-09 2011-11-07 Plasma processing apparatus
KR1020110115722A KR101898079B1 (ko) 2010-11-09 2011-11-08 플라즈마 처리 장치
CN201110353550.8A CN102468106B (zh) 2010-11-09 2011-11-09 等离子体处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010250461A JP5503503B2 (ja) 2010-11-09 2010-11-09 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2012104579A JP2012104579A (ja) 2012-05-31
JP2012104579A5 true JP2012104579A5 (enExample) 2013-12-26
JP5503503B2 JP5503503B2 (ja) 2014-05-28

Family

ID=46018493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010250461A Expired - Fee Related JP5503503B2 (ja) 2010-11-09 2010-11-09 プラズマ処理装置

Country Status (5)

Country Link
US (1) US8545672B2 (enExample)
JP (1) JP5503503B2 (enExample)
KR (1) KR101898079B1 (enExample)
CN (1) CN102468106B (enExample)
TW (1) TWI533396B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6496579B2 (ja) * 2015-03-17 2019-04-03 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US20180053666A1 (en) * 2016-08-19 2018-02-22 Applied Materials, Inc. Substrate carrier with array of independently controllable heater elements
JP6400771B1 (ja) * 2017-04-11 2018-10-03 株式会社石井表記 ヒータ付き減圧ユニット及び電池製造用装置
CN110800096B (zh) * 2017-10-16 2023-07-18 日本碍子株式会社 静电卡盘
JP7101055B2 (ja) 2018-06-12 2022-07-14 東京エレクトロン株式会社 静電チャック、フォーカスリング、支持台、プラズマ処理装置、及びプラズマ処理方法
JP7134863B2 (ja) * 2018-12-27 2022-09-12 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
US11450545B2 (en) * 2019-04-17 2022-09-20 Samsung Electronics Co., Ltd. Capacitively-coupled plasma substrate processing apparatus including a focus ring and a substrate processing method using the same
JP7361002B2 (ja) * 2019-10-02 2023-10-13 東京エレクトロン株式会社 プラズマ処理装置
KR102077976B1 (ko) * 2019-10-15 2020-02-14 주식회사 기가레인 어댑터 및 이를 포함하는 플라즈마 처리 장치
US11972957B2 (en) 2020-07-31 2024-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. Gas flow accelerator to prevent buildup of processing byproduct in a main pumping line of a semiconductor processing tool

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900702292A (ko) * 1988-05-05 1990-12-06 베흐 에르빈 압축 밀폐된 플러그 커플링
JPH10303288A (ja) 1997-04-26 1998-11-13 Anelva Corp プラズマ処理装置用基板ホルダー
JP4559595B2 (ja) * 2000-07-17 2010-10-06 東京エレクトロン株式会社 被処理体の載置装置及びプラズマ処理装置
US6475336B1 (en) * 2000-10-06 2002-11-05 Lam Research Corporation Electrostatically clamped edge ring for plasma processing
JP2005520337A (ja) * 2002-03-12 2005-07-07 東京エレクトロン株式会社 プラズマ処理のための改良された基板ホルダ
JP4421305B2 (ja) 2003-01-07 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP4547182B2 (ja) * 2003-04-24 2010-09-22 東京エレクトロン株式会社 プラズマ処理装置
US20040261946A1 (en) * 2003-04-24 2004-12-30 Tokyo Electron Limited Plasma processing apparatus, focus ring, and susceptor
KR100512745B1 (ko) * 2003-07-24 2005-09-07 삼성전자주식회사 정전기 척
JP4504061B2 (ja) * 2004-03-29 2010-07-14 東京エレクトロン株式会社 プラズマ処理方法
KR20060079335A (ko) * 2004-12-30 2006-07-06 동부일렉트로닉스 주식회사 반도체 웨이퍼의 정전척 장치
US20070283891A1 (en) * 2006-03-29 2007-12-13 Nobuyuki Okayama Table for supporting substrate, and vacuum-processing equipment
JP5317424B2 (ja) * 2007-03-28 2013-10-16 東京エレクトロン株式会社 プラズマ処理装置
US8317969B2 (en) * 2008-03-25 2012-11-27 Tokyo Electron Limited Plasma processing apparatus
JP5642531B2 (ja) * 2010-12-22 2014-12-17 東京エレクトロン株式会社 基板処理装置及び基板処理方法

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