JP2010138433A - 半導体装置製造装置及び半導体装置製造方法 - Google Patents

半導体装置製造装置及び半導体装置製造方法 Download PDF

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Publication number
JP2010138433A
JP2010138433A JP2008314219A JP2008314219A JP2010138433A JP 2010138433 A JP2010138433 A JP 2010138433A JP 2008314219 A JP2008314219 A JP 2008314219A JP 2008314219 A JP2008314219 A JP 2008314219A JP 2010138433 A JP2010138433 A JP 2010138433A
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Japan
Prior art keywords
dielectrics
semiconductor device
cathode
anode
device manufacturing
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Pending
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JP2008314219A
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English (en)
Japanese (ja)
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JP2010138433A5 (enExample
Inventor
Akira Furuya
晃 古谷
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Renesas Electronics Corp
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Renesas Electronics Corp
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Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2008314219A priority Critical patent/JP2010138433A/ja
Publication of JP2010138433A publication Critical patent/JP2010138433A/ja
Publication of JP2010138433A5 publication Critical patent/JP2010138433A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2008314219A 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法 Pending JP2010138433A (ja)

Priority Applications (1)

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JP2008314219A JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

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JP2008314219A JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

Publications (2)

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JP2010138433A true JP2010138433A (ja) 2010-06-24
JP2010138433A5 JP2010138433A5 (enExample) 2012-01-19

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014129592A (ja) * 2012-12-27 2014-07-10 Samsung Electro-Mechanics Co Ltd 電解メッキ遮蔽板及びこれを有する電解メッキ装置
JP2022059561A (ja) * 2020-10-01 2022-04-13 株式会社荏原製作所 めっき装置
CN114829681A (zh) * 2020-11-16 2022-07-29 株式会社荏原制作所 板、镀敷装置和板的制造方法
US11542624B2 (en) * 2020-10-01 2023-01-03 Ebara Corporation Plating apparatus
JP7630758B1 (ja) * 2024-06-27 2025-02-17 株式会社荏原製作所 めっき装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633500A (en) * 1979-08-28 1981-04-03 Fujitsu Ltd Averaging apparatus of distribution of plating electric current
JPS63176500A (ja) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd 電気めつき用遮蔽板
JPH02145791A (ja) * 1988-11-28 1990-06-05 Eagle Ind Co Ltd めっき装置とめっき方法およびめっき用遮蔽板
JPH10140392A (ja) * 1996-11-08 1998-05-26 Hitachi Cable Ltd 電気めっき装置
JPH11246999A (ja) * 1998-03-03 1999-09-14 Ebara Corp ウエハのメッキ方法及び装置
JP2002004091A (ja) * 2000-04-21 2002-01-09 Ebara Corp 電解処理装置及びその電場状態制御方法
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633500A (en) * 1979-08-28 1981-04-03 Fujitsu Ltd Averaging apparatus of distribution of plating electric current
JPS63176500A (ja) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd 電気めつき用遮蔽板
JPH02145791A (ja) * 1988-11-28 1990-06-05 Eagle Ind Co Ltd めっき装置とめっき方法およびめっき用遮蔽板
JPH10140392A (ja) * 1996-11-08 1998-05-26 Hitachi Cable Ltd 電気めっき装置
JPH11246999A (ja) * 1998-03-03 1999-09-14 Ebara Corp ウエハのメッキ方法及び装置
JP2002004091A (ja) * 2000-04-21 2002-01-09 Ebara Corp 電解処理装置及びその電場状態制御方法
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014129592A (ja) * 2012-12-27 2014-07-10 Samsung Electro-Mechanics Co Ltd 電解メッキ遮蔽板及びこれを有する電解メッキ装置
JP2022059561A (ja) * 2020-10-01 2022-04-13 株式会社荏原製作所 めっき装置
US11542624B2 (en) * 2020-10-01 2023-01-03 Ebara Corporation Plating apparatus
JP7555308B2 (ja) 2020-10-01 2024-09-24 株式会社荏原製作所 めっき装置
TWI898052B (zh) * 2020-10-01 2025-09-21 日商荏原製作所股份有限公司 鍍覆裝置
CN114829681A (zh) * 2020-11-16 2022-07-29 株式会社荏原制作所 板、镀敷装置和板的制造方法
JP7630758B1 (ja) * 2024-06-27 2025-02-17 株式会社荏原製作所 めっき装置
CN120418483A (zh) * 2024-06-27 2025-08-01 株式会社荏原制作所 镀覆装置

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