JP2010123589A - 電子部品の端子構造 - Google Patents
電子部品の端子構造 Download PDFInfo
- Publication number
- JP2010123589A JP2010123589A JP2008292960A JP2008292960A JP2010123589A JP 2010123589 A JP2010123589 A JP 2010123589A JP 2008292960 A JP2008292960 A JP 2008292960A JP 2008292960 A JP2008292960 A JP 2008292960A JP 2010123589 A JP2010123589 A JP 2010123589A
- Authority
- JP
- Japan
- Prior art keywords
- pin header
- electronic component
- terminal structure
- pin
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003825 pressing Methods 0.000 claims abstract description 33
- 239000004020 conductor Substances 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 13
- 230000036544 posture Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/105—Mechanically attached to another device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
【解決手段】複数のピン端子を有するピンヘッダ2を含む電子部品が実装されるプリント基板1と、該プリント基板を収納し前記ピン端子を露出させる切欠開口部を有するケース枠体3とを備える電子部品の端子構造であって、前記ピンヘッダ2を、前記ケース枠体3に設ける押付部32と前記プリント基板の間で挟持すると共に、前記ピンヘッダ2の上面から、前記プリント基板に当接する下面まで貫通するガイド孔23を設け、前記押付部32に前記ガイド孔23に挿入可能なガイド軸33を設ける構成とした。
【選択図】図1
Description
2 ピンヘッダ(電子部品)
3 ケース枠体
21 ピン端子
22 ピン端子
23 ガイド孔
24 延設部
25 延設部
26 延在部
27 延在部
31 切欠開口部
32 押付部
33 ガイド軸
Claims (8)
- 複数のピン端子を有するピンヘッダを含む電子部品が実装されるプリント基板と、該プリント基板を収納し前記ピン端子を露出させる切欠開口部を有するケース枠体とを備える電子部品の端子構造であって、
前記ピンヘッダを、前記ケース枠体に設ける押付部と前記プリント基板の間で挟持すると共に、
前記ピンヘッダに、該ピンヘッダの上面から前記プリント基板に当接する下面まで貫通するガイド孔を設け、
前記押付部に前記ガイド孔に挿入可能なガイド軸を設けたことを特徴とする電子部品の端子構造。 - 前記プリント基板に、前記ガイド孔に対応した挿入孔を設け、前記ガイド軸の長さを、前記ガイド孔および前記挿入孔を貫通する程度の長さとしたことを特徴とする請求項1に記載の電子部品の端子構造。
- 前記ガイド軸の前記挿入孔から突出した先端部を前記プリント基板の導体部に接続したことを特徴とする請求項2に記載の電子部品の端子構造。
- 前記ピンヘッダの上面の長手方向の、前記押付部に対向する両側またはいずれか一方の側に、前記押付部に近接する延設部を設けたことを特徴とする請求項1から3のいずれかに記載の電子部品の端子構造。
- 前記ガイド孔を前記ピンヘッダの長手方向に複数設け、前記延設部の幅を前記ガイド軸に対向する程度の大きさとしたことを特徴とする請求項4に記載の電子部品の端子構造。
- 前記延設部を、前記ガイド孔が配設された位置の少なくとも一箇所に対応して設けたことを特徴とする請求項5に記載の電子部品の端子構造。
- 前記ピンヘッダの長手方向の下面側両側部またはいずれか一方の側部に前記プリント基板に当接して延在する延在部を設けたことを特徴とする請求項1から6のいずれかに記載の電子部品の端子構造。
- 前記ピンヘッダの長手方向両端部の下面側両側部またはいずれか一方の側部に前記プリント基板に当接して延在する延在部を設けたことを特徴とする請求項1から6のいずれかに記載の電子部品の端子構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008292960A JP4746082B2 (ja) | 2008-11-17 | 2008-11-17 | 電子部品の端子構造 |
US12/610,767 US8169787B2 (en) | 2008-11-17 | 2009-11-02 | Terminal structure of an electronic component |
BRPI0904826-0A BRPI0904826A2 (pt) | 2008-11-17 | 2009-11-13 | estrutura terminal de um componente eletrÈnico |
CN200910223196.XA CN101783447B (zh) | 2008-11-17 | 2009-11-16 | 电子产品的端子结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008292960A JP4746082B2 (ja) | 2008-11-17 | 2008-11-17 | 電子部品の端子構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010123589A true JP2010123589A (ja) | 2010-06-03 |
JP4746082B2 JP4746082B2 (ja) | 2011-08-10 |
Family
ID=42171900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008292960A Expired - Fee Related JP4746082B2 (ja) | 2008-11-17 | 2008-11-17 | 電子部品の端子構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8169787B2 (ja) |
JP (1) | JP4746082B2 (ja) |
CN (1) | CN101783447B (ja) |
BR (1) | BRPI0904826A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102843862A (zh) * | 2012-09-04 | 2012-12-26 | 西安永电电气有限责任公司 | 一种igbt模块的电路板结构及封装结构 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102159044B (zh) * | 2010-12-17 | 2014-02-26 | 北京航空航天大学 | 一种微纳卫星用星上电子系统结构箱 |
US9098237B2 (en) * | 2011-08-31 | 2015-08-04 | Apple Inc. | Systems and methods for coupling electrically isolated sections of an electronic device |
CN111168180A (zh) * | 2020-03-12 | 2020-05-19 | 芜湖挺优机电技术有限公司 | 一种封装金属外壳的绝缘子钎焊设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6429790A (en) * | 1987-07-24 | 1989-01-31 | Taiyo Yuden Kk | Inspecting device for parts packed on substrate |
JPH1021988A (ja) * | 1996-06-27 | 1998-01-23 | Japan Aviation Electron Ind Ltd | 電子機器 |
JPH11167967A (ja) * | 1997-12-05 | 1999-06-22 | Denso Corp | コネクタ実装構造体 |
JP2004274954A (ja) * | 2003-03-11 | 2004-09-30 | Yazaki Corp | 電子ユニット |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0822852A (ja) | 1994-07-05 | 1996-01-23 | Sumitomo Electric Ind Ltd | 回路基板用コネクタ |
JPH08293687A (ja) | 1995-04-24 | 1996-11-05 | Sony Corp | 外部接続用コネクタを備えたシールド電気製品の製造方法及びシールド電気製品 |
JPH11176524A (ja) | 1997-12-12 | 1999-07-02 | Murata Mfg Co Ltd | 取付脚およびそれを用いたコネクタ |
JP2001053470A (ja) | 1998-10-14 | 2001-02-23 | Mitsumi Electric Co Ltd | 電子機器筐体 |
JP2000299250A (ja) * | 1999-04-16 | 2000-10-24 | Seiko Epson Corp | 電子部品の取付構造 |
JP2006310610A (ja) | 2005-04-28 | 2006-11-09 | Toyo Denji Kikai Seisakusho:Kk | 電解コンデンサ及び電解コンデンサ用アルミケース |
US7765687B2 (en) * | 2005-08-11 | 2010-08-03 | Synqor, Inc. | Method for mechanical packaging of electronics |
JP2007317806A (ja) * | 2006-05-24 | 2007-12-06 | Fujitsu Ltd | プリント基板ユニット |
-
2008
- 2008-11-17 JP JP2008292960A patent/JP4746082B2/ja not_active Expired - Fee Related
-
2009
- 2009-11-02 US US12/610,767 patent/US8169787B2/en not_active Expired - Fee Related
- 2009-11-13 BR BRPI0904826-0A patent/BRPI0904826A2/pt not_active IP Right Cessation
- 2009-11-16 CN CN200910223196.XA patent/CN101783447B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6429790A (en) * | 1987-07-24 | 1989-01-31 | Taiyo Yuden Kk | Inspecting device for parts packed on substrate |
JPH1021988A (ja) * | 1996-06-27 | 1998-01-23 | Japan Aviation Electron Ind Ltd | 電子機器 |
JPH11167967A (ja) * | 1997-12-05 | 1999-06-22 | Denso Corp | コネクタ実装構造体 |
JP2004274954A (ja) * | 2003-03-11 | 2004-09-30 | Yazaki Corp | 電子ユニット |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102843862A (zh) * | 2012-09-04 | 2012-12-26 | 西安永电电气有限责任公司 | 一种igbt模块的电路板结构及封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN101783447A (zh) | 2010-07-21 |
BRPI0904826A2 (pt) | 2011-03-15 |
US20100124033A1 (en) | 2010-05-20 |
US8169787B2 (en) | 2012-05-01 |
CN101783447B (zh) | 2013-04-17 |
JP4746082B2 (ja) | 2011-08-10 |
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