JP2010114408A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2010114408A JP2010114408A JP2009057388A JP2009057388A JP2010114408A JP 2010114408 A JP2010114408 A JP 2010114408A JP 2009057388 A JP2009057388 A JP 2009057388A JP 2009057388 A JP2009057388 A JP 2009057388A JP 2010114408 A JP2010114408 A JP 2010114408A
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Abstract
【解決手段】回路基板と、前記回路基板に搭載された半導体素子と、前記回路基板と前記半導体素子とを電気的に接続する銅製ワイヤと、前記半導体素子と前記銅製ワイヤを封止する封止材とを備え、前記銅製ワイヤが線径25μm以下の銅製ワイヤであり、前記銅製ワイヤがその表面にパラジウムを含む金属材料で構成された被覆層を有しており、前記封止材が(A)エポキシ樹脂、(B)硬化剤、(C)充填材、(D)硫黄原子含有化合物を含む樹脂組成物の硬化物で構成されていることを特徴とする半導体装置。
【選択図】 なし
Description
前記銅製ワイヤが線径25μm以下の銅製ワイヤであり、
前記銅製ワイヤがその表面にパラジウムを含む金属材料で構成された被覆層を有しており、
前記封止材が(A)エポキシ樹脂、(B)硬化剤、(C)充填材、(D)硫黄原子含有化合物を含むエポキシ樹脂組成物の硬化物で構成されていることを特徴とする。
であるものとすることができる。
化合物
であるものとすることができる。
下記一般式(3)で表されるエポキシ樹脂
下記一般式(4)で表されるエポキシ樹脂
下記一般式(5)で表されるエポキシ樹脂
及び下記一般式(6)で表されるエポキシ樹脂
から選ばれた少なくとも一つであるエポキシ樹脂を含むものとすることができる。
ノボラック型フェノール樹脂、
下記一般式(7)で表されるフェノール樹脂
から選ばれた少なくとも一つである硬化剤
を含むものとすることができる。
で構成された被覆層を有していることが好ましい。これにより、銅製ワイヤ先端のボール形状が安定し、接合部分の接続信頼性を向上させることができる。また、芯線である銅の酸化劣化を防止する効果も得られ、接合部分の高温保管特性を向上させることができる。
ジヒドロキシナフタレン型エポキシ樹脂、ジヒドロキシナフタレンの2量体をグリシジルエーテル化して得られるエポキシ樹脂等のナフトール型エポキシ樹脂;トリグリシジルイソシアヌレート、モノアリルジグリシジルイソシアヌレート等のトリアジン核含有エポキシ樹脂;ジシクロペンタジエン変性フェノール型エポキシ樹脂等の有橋環状炭化水素化合物変性フェノール型エポキシ樹脂が挙げられ、これらは1種類を単独で用いても2種類以上を併用してもよい。封止材としての耐湿信頼性を考慮すると、イオン性不純物であるCl−(塩素イオン)が極力少ない方が好ましく、より具体的には、(A)エポキシ樹脂全体に対するCl−(塩素イオン)等のイオン性不純物の含有割合が10ppm以下であることが好ましく、5ppm以下であることがより好ましい。また、封止材用のエポキシ樹脂組成物としての硬化性を考慮すると、エポキシ当量としては100g/eq以上500g/eq以下であるものが好ましい。これらのエポキシ樹脂のなかでも、後述する一般式(3)で表されるエポキシ樹脂、一般式(4)で表されるエポキシ樹脂、一般式(5)で表されるエポキシ樹脂及び一般式(6)で表されるエポキシ樹脂から選ばれた少なくとも一つであるエポキシ樹脂を含むことが特に好ましい。
試料単位質量あたりの塩素イオン濃度=(キャピラリー電気泳動装置で求めた塩素イオン濃度)×50÷5
尚、後述する硬化剤中に含有される塩素イオンについても、同様の方法で測定することができる。
0〜8の整数である。n5の平均値は1以上、3以下の正数である。)
装置の低反り性を向上させる効果を得ることができる。
であることがより好ましい。エポキシ樹脂組成物の硬化性を考慮すると、水酸基当量は90g/eq以上、250g/eq以下のものが好ましい。これらのなかでも、後述するノボラック型フェノール樹脂及び一般式(7)で表されるフェノール樹脂から選ばれた少なくとも一つである硬化剤を含むことが特に好ましい。尚、硬化剤全体に対するCl−(塩素イオン)の含有割合の測定は、前述のエポキシ樹脂の場合と同様にして測定することができる。
合、フェノール性水酸基の結合位置はα位であってもβ位であってもよいが、特にナフチレン基である場合は前述のナフチレン骨格を含むアラルキル基を含有する化合物と同様に、Tgの上昇や線膨張係数の低下により、成形収縮率を小さくすることができ、エリア表面実装型半導体パッケージにおける低反り性を向上させる効果が得られる。さらに芳香族炭素を多く有することから耐熱性の向上も実現することができる。
ヤの表面に被覆されているパラジウムを含む金属材料との親和性がより高くなるため、半導体装置の信頼性をより向上させることができる。
ェニルホスフィンと1,4−ベンゾキノンとの付加物がより好ましい。ホスフィン化合物とキノン化合物との付加物の製造方法としては特に制限はないが、例えば、原料として用いられるホスフィン化合物とキノン化合物とを両者が溶解する有機溶媒中で付加反応させて単離すればよい。
試料単位質量あたりの塩素イオン濃度=(キャピラリー電気泳動装置で求めた塩素イオン濃度)×50÷5
、或いは80℃〜200℃程度の温度で、10分〜10時間程度の時間をかけて完全硬化させた後、電子機器等に搭載される。
(エポキシ樹脂)
E−1:ビフェニル型エポキシ樹脂(一般式(3)において、3位、5位のR4がメチル基、2位、6位のR4が水素原子であるエポキシ樹脂。ジャパンエポキシレジン(株)製、YX−4000H、融点105℃、エポキシ当量190、塩素イオン量5.0ppm。)
E−2:ビスフェノールA型エポキシ樹脂(一般式(4)において、R5が水素原子、R6がメチル基であるエポキシ樹脂。ジャパンエポキシレジン(株)製、YL−6810、融点45℃、エポキシ当量172、塩素イオン量2.5ppm。)
E−3:ビフェニレン骨格を有するフェノールアラルキル型エポキシ樹脂(一般式(5)において、−R7−がフェニレン基、−R8−がビフェニレン基、aが0、bが0であるエポキシ樹脂。日本化薬(株)製、NC3000、軟化点58℃、エポキシ当量274、塩素イオン量9.8ppm。)
E−4:フェニレン骨格を有するナフトールアラルキル型エポキシ樹脂(一般式(5)において、−R7−がナフチレン基、−R8−がフェニレン基、aが0、bが0であるエポキシ樹脂。東都化成(株)製、ESN−175、軟化点65℃、エポキシ当量254、塩素イオン量8.5ppm。)
E−5:一般式(6)で表わされるエポキシ樹脂(一般式(6)において、R12が水素原子であり、cが0、dが0、eが0である成分50質量%、R12が水素原子であり、cが1、dが0、eが0である成分40質量%、R12が水素原子であり、cが1、dが1、eが0である成分10質量%の混合物であるエポキシ樹脂。大日本インキ工業(株)製HP4770、軟化点72℃、エポキシ当量205、塩素イオン量2.0ppm。)
E−6:オルソクレゾールノボラック型エポキシ樹脂(日本化薬(株)製、EOCN1020、軟化点55℃、エポキシ当量196、塩素イオン量5.0ppm。)
E−7:ビフェニル型エポキシ樹脂(一般式(3)において、3位、5位のR4がメチル基、2位、6位のR4が水素原子であるエポキシ樹脂。ジャパンエポキシレジン(株)製、YX−4000H、融点105℃、エポキシ当量190、塩素イオン量12.0ppm。)
E−8:ビスフェノールA型エポキシ樹脂(一般式(4)において、R5が水素原子、R6がメチル基であるエポキシ樹脂。ジャパンエポキシレジン(株)製、1001、融点45℃、エポキシ当量460、塩素イオン量25ppm。)
H−1:フェノールノボラック樹脂(住友ベークライト(株)製、PR−HF−3軟化点80℃、水酸基当量104、塩素イオン量1.0ppm。)
H−2:フェニレン骨格を有するフェノールアラルキル樹脂(一般式(7)において、−R13−がフェニレン基、−R14−がフェニレン基、fが0、gが0である化合物。
三井化学(株)製、XLC−4L、軟化点62℃、水酸基当量168、塩素イオン量2.5ppm。)
H−3:ビフェニレン骨格を有するフェノールアラルキル樹脂(一般式(7)において、−R13−がフェニレン基、−R14−がビフェニレン基、fが0、gが0である化合物。明和化成(株)製、MEH−7851SS、軟化点65℃、水酸基当量203、塩素イオン量1.0ppm。)
H−4:フェニレン骨格を有するナフトールアラルキル樹脂(一般式(7)において、−R13−がナフチレン基、−R14−がフェニレン基、fが0、gが0である化合物。東都化成(株)製、SN−485、軟化点87℃、水酸基当量210、塩素イオン量1.5ppm。)
H−5:フェニレン骨格を有するナフトールアラルキル樹脂(一般式(7)において、−R13−がナフチレン基、−R14−がフェニレン基、fが0、gが0である化合物。東都化成(株)製、SN−170L、軟化点69℃、水酸基当量182、塩素イオン量15.0ppm。)
溶融球状シリカ1:モード径30μm、比表面積3.7m2/g、55μm以上の粗大粒子の含有量0.01質量部((株)マイクロン製、HS−203。)
溶融球状シリカ2:モード径37μm、比表面積2.8m2/g、55μm以上の粗大粒子の含有量0.1質量部((株)マイクロン製、HS−105を300メッシュの篩を用いて粗大粒子を除去することにより得た。)
溶融球状シリカ3:モード径45μm、比表面積2.2m2/g、55μm以上の粗大粒子の含有量0.1質量部(電気化学工業(株)製、FB−820を300メッシュの篩を用いて粗大粒子を除去することにより得た。)
溶融球状シリカ4:モード径50μm、比表面積1.4m2/g、55μm以上の粗大粒子の含有量0.03質量部(電気化学工業(株)製、FB−950を300メッシュの篩を用いて粗大粒子を除去することにより得た。)
溶融球状シリカ5:モード径55μm、比表面積1.5m2/g、55μm以上の粗大粒子の含有量0.1質量部(電気化学工業(株)製 FB−74を300メッシュの篩を用いて粗大粒子を除去することにより得た。)
溶融球状シリカ6:モード径50μm、比表面積3.0m2/g、55μm以上の粗大粒子の含有量15.0質量部(電気化学工業(株)製、FB−820。)
溶融球状シリカ7:モード径50μm、比表面積1.5m2/g、55μm以上の粗大粒子の含有量6.0質量部(電気化学工業(株)製、FB−950。)
トリフェニルホスフィン(TPP)
エポキシシラン:γ−グリシドキシプロピルトリメトキシシラン
カーボンブラック
カルナバワックス
(実施例1)
E−3 8質量部
H−3 6質量部
溶融球状シリカ2 85質量部
硫黄原子含有化合物1 0.05質量部
トリフェニルホスフィン 0.3質量部
エポキシシラン 0.2質量部
カーボンブラック 0.25質量部
カルナバワックス 0.2質量部
を常温でミキサーを用いて混合し、次に70〜100℃でロール混練し、冷却後粉砕して封止材用のエポキシ樹脂組成物を得た。
表1〜7に記載の封止材用エポキシ樹脂組成物の配合に従い、実施例1と同様にしてエポキシ樹脂組成物を得た。
銅製ワイヤ1:表1〜7に記載の各線径である銅純度99.99質量%の芯線に表1〜7に記載の各厚さでパラジウム被覆を施したもの((株)日鉄マイクロメタル製、EX)
銅製ワイヤ2:表1、5、6に記載の各線径である銅純度99.999質量%、銀0.001質量%ドープの芯線(タツタ電線(株)製、TC−A)に表1〜6に記載の各厚さでパラジウム被覆を施したもの
銅製ワイヤ3:表1、2、4、7に記載の各線径である銅純度99.99質量%の銅製ワイヤ(タツタ電線(株)製、TC−E)
スパイラルフロー:低圧トランスファー成形機(コータキ精機(株)製、KTS−15)を用いて、EMMI−1−66に準じたスパイラルフロー測定用の金型に、金型温度175℃、注入圧力6.9MPa、硬化時間120秒の条件でエポキシ樹脂組成物を注入し
、流動長を測定した。単位はcm。80cm以下であるとパッケージ未充填などの成形不良が生じる場合がある。
成物を注入、成形して、直径50mm、厚さ3mmの円盤状試験片を作製したのち、後硬化として175℃で8時間加熱処理した。試験片の吸湿処理前の重量と、85℃、相対湿度60%の環境下で168時間加湿処理した後の重量を測定し、試験片の吸湿率を百分率で示した。単位は質量%。
収縮率(%)={(175℃での金型キャビティの内径寸法)−(後硬化後の25℃での試験片の外径寸法)}/(175℃での金型キャビティの内径寸法)×100(%)
試料単位質量あたりの塩素イオン濃度=(キャピラリー電気泳動装置で求めた塩素イオン濃度)×50÷5
尚、封止材中の塩素イオン濃度の測定は、封止材を構成する複数の類似樹脂組成物を代表して、実施例1、4、10、22〜30のみで行った。
傷機(日立建機ファインテック株式会社製、mi−scope hyper II)で観察し、剥離又はクラックのいずれか一方でも発生したものを不良とした。単位は不良パッケージの個数。
GROUP)チップ(3.5mm×3.5mm)を352ピンBGA(基板は厚さ0.56mm、ビスマレイミド・トリアジン樹脂/ガラスクロス基板、パッケージサイズは30×30mm、厚さ1.17mm)のダイパッド部に接着し、TEGチップのアルミニウム電極パッドと基板側端子とをデージーチェーンになるように、表1〜6に記載の銅製ワイヤを用いてワイヤピッチ80μmでワイヤボンディングした。これを、低圧トランスファー成形機(TOWA製、Yシリーズ)を用いて、金型温度175℃、注入圧力6.9MPa、硬化時間2分の条件でエポキシ樹脂組成物により封止成形して、352ピンBGAパッケージを作製した。作製したパッケージを、175℃、8時間で後硬化した後、高温保管試験(200℃)を行った。24時間毎に配線間の電気抵抗値の測定を行い、その値が初期値に対し20%増加したパッケージを不良と判定し、不良になるまでの時間を測定した。不良時間はn=5ヶの測定で、1ケでも不良が発生した時間で示した。単位は時間。全てのパッケージで192Hrまで不良発生のなかったものは192<とした。
GROUP)チップ(3.5mm×3.5mm)を352ピンBGA(基板は厚さ0.56mm、ビスマレイミド・トリアジン樹脂/ガラスクロス基板、パッケージサイズは30×30mm、厚さ1.17mm)のダイパッド部に接着し、TEGチップのアルミニウム電極パッドと基板側端子とをデージーチェーンになるように、表1〜6に記載の銅製ワイヤを用いてワイヤピッチ80μmでワイヤボンディングした。これを、低圧トランスファー成形機(TOWA製、Yシリーズ)を用いて、金型温度175℃、注入圧力6.9MPa、硬化時間2分の条件でエポキシ樹脂組成物により封止成形して、352ピンBGAパッケージを作製した。作製したパッケージを175℃、8時間で後硬化した後、デージーチェーンにつないだ両端に0.5Aの直流電流を流す。この状態で185℃での高温保管を行い、12時間毎に配線間の電気抵抗値が初期値に対し20%増加したパッケージを不良と判定し、不良になるまでの時間を測定した。不良時間はn=4ヶの測定で、1ケでも不良が発生した時間で示した。単位は時間。
mm、厚さ1.17mm)のダイパッド部に接着し、アルミニウムパッドと基板側端子を、表1〜6に記載の銅製ワイヤを用いてワイヤピッチ80μmでワイヤボンディングした。これを、低圧トランスファー成形機(TOWA製、Yシリーズ)を用いて、金型温度175℃、注入圧力6.9MPa、硬化時間2分の条件でエポキシ樹脂組成物により封止成形して、352ピンBGAパッケージを作製した。作製したパッケージを、175℃、8時間で後硬化した後、IEC68−2−66に準拠しHAST(Highly Accelerated temperature and humidity Stress Test)試験を行った。試験条件は130℃、85%RH、20V印加、168時間処理をして回路のオープン不良有無を測定した。1パッケージあたり4端子を持ち5パッケージで計20回路を評価で用いた。単位は不良回路の個数。
2 ダイボンド材硬化体
3 銅製ワイヤ
4 封止材
5 ソルダーレジスト
6 回路基板
7 半田ボール
Claims (14)
- 回路基板と、前記回路基板に搭載された半導体素子と、前記回路基板と前記半導体素子とを電気的に接続する銅製ワイヤと、前記半導体素子と前記銅製ワイヤを封止する封止材とを備え、
前記銅製ワイヤが線径25μm以下の銅製ワイヤであり、
前記銅製ワイヤがその表面にパラジウムを含む金属材料で構成された被覆層を有しており、
前記封止材が(A)エポキシ樹脂、(B)硬化剤、(C)充填材、(D)硫黄原子含有化合物を含むエポキシ樹脂組成物の硬化物で構成されていることを特徴とする半導体装置。 - 前記封止材を構成するエポキシ樹脂組成物の硬化物を125℃、相対湿度100%RH、20時間の条件で抽出した抽出水中の塩素イオン濃度が10ppm以下であることを特徴とする請求項1に記載の半導体装置。
- 前記銅製ワイヤの芯線における銅純度が99.99質量%以上であることを特徴とする請求項1又は請求項2に記載の半導体装置。
- 前記パラジウムを含む金属材料から構成された被覆層の厚みが0.001〜0.02μmであることを特徴とする請求項1ないし請求項3のいずれか1項に記載の半導体装置。
- 前記(D)硫黄原子含有化合物が、メルカプト基、スルフィド結合から選ばれた少なくとも一つの原子団を有する硫黄原子含有化合物であることを特徴とする請求項1ないし請求項4のいずれか1項に記載の半導体装置。
- 前記(D)硫黄原子含有化合物が、アミノ基、水酸基、カルボキシル基、メルカプト基、含窒素複素環、から選ばれた、エポキシ樹脂マトリックスとの親和性に優れた少なくとも一つの原子団と、メルカプト基、スルフィド結合から選ばれた、パラジウムを含む金属材料との親和性に優れた少なくとも一つの原子団と、を有する硫黄原子含有化合物であることを特徴とする請求項1ないし請求項5のいずれか1項に記載の半導体装置。
- 前記(D)硫黄原子含有化合物が、トリアゾール系化合物、チアゾリン系化合物、ジチアン系化合物から選ばれた少なくとも1つの硫黄原子含有化合物であることを特徴とする請求項1ないし請求項6のいずれか1項に記載の半導体装置。
- 前記(D)硫黄原子含有化合物が1,2,4−トリアゾール環を有する化合物であることを特徴とする請求項1ないし請求項7のいずれか1項に記載の半導体装置。
- 前記(A)エポキシ樹脂が、
下記一般式(3)で表されるエポキシ樹脂
下記一般式(4)で表されるエポキシ樹脂
下記一般式(5)で表されるエポキシ樹脂
及び下記一般式(6)で表されるエポキシ樹脂
から選ばれた少なくとも一つであるエポキシ樹脂を含むことを特徴とする請求項1ないし請求項10のいずれか1項に記載の半導体装置。 - 前記(B)硬化剤が、
ノボラック型フェノール樹脂、
下記一般式(7)で表されるフェノール樹脂
から選ばれた少なくとも一つである硬化剤
を含むこと特徴とする請求項1ないし請求項11のいずれか1項に記載の半導体装置。 - 前記(C)充填材が、モード径が30μm以上、50μm以下であり、かつ55μm以上の粗大粒子の含有割合が0.2質量%以下である溶融球状シリカを含むこと特徴とする請求項1ないし請求項12のいずれか1項に記載の半導体装置。
- 自動車のエンジンルーム内で用いられる電子部品、パソコン用電源ユニット周辺の電子部品、家電用電源ユニット周辺の電子部品、及びLAN装置内の電子部品などの、60℃、相対湿度60%以上の高温高湿環境下での動作保証が要求される電子部品に使用されるものである請求項1ないし請求項13のいずれかに記載の半導体装置。
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011070739A1 (ja) * | 2009-12-07 | 2011-06-16 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置 |
WO2012070529A1 (ja) * | 2010-11-24 | 2012-05-31 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
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JP2014145017A (ja) * | 2013-01-29 | 2014-08-14 | Toray Ind Inc | エポキシ樹脂組成物、成形材料および繊維強化複合材料 |
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WO2015182371A1 (ja) * | 2014-05-28 | 2015-12-03 | 住友ベークライト株式会社 | 封止用樹脂組成物、および半導体装置 |
WO2016009730A1 (ja) * | 2014-07-16 | 2016-01-21 | 住友ベークライト株式会社 | 封止用樹脂組成物及び半導体装置 |
JP2017179185A (ja) * | 2016-03-31 | 2017-10-05 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003253092A (ja) * | 2002-03-01 | 2003-09-10 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及びそれを用いた電子部品装置 |
JP2005281584A (ja) * | 2004-03-30 | 2005-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2006100777A (ja) * | 2004-09-02 | 2006-04-13 | Furukawa Electric Co Ltd:The | ボンディングワイヤー及びその製造方法 |
JP2006131655A (ja) * | 2004-11-02 | 2006-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2006199758A (ja) * | 2005-01-18 | 2006-08-03 | Sumitomo Bakelite Co Ltd | 半導体用液状封止樹脂組成物及びそれを用いて封止される半導体装置 |
JP2007012776A (ja) * | 2005-06-29 | 2007-01-18 | Nippon Steel Materials Co Ltd | 半導体装置用ボンディングワイヤ |
JP2008166314A (ja) * | 2006-12-26 | 2008-07-17 | Sumitomo Bakelite Co Ltd | 半導体装置及び封止用エポキシ樹脂組成物 |
-
2009
- 2009-03-11 JP JP2009057388A patent/JP5393207B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003253092A (ja) * | 2002-03-01 | 2003-09-10 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及びそれを用いた電子部品装置 |
JP2005281584A (ja) * | 2004-03-30 | 2005-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2006100777A (ja) * | 2004-09-02 | 2006-04-13 | Furukawa Electric Co Ltd:The | ボンディングワイヤー及びその製造方法 |
JP2006131655A (ja) * | 2004-11-02 | 2006-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2006199758A (ja) * | 2005-01-18 | 2006-08-03 | Sumitomo Bakelite Co Ltd | 半導体用液状封止樹脂組成物及びそれを用いて封止される半導体装置 |
JP2007012776A (ja) * | 2005-06-29 | 2007-01-18 | Nippon Steel Materials Co Ltd | 半導体装置用ボンディングワイヤ |
JP2008166314A (ja) * | 2006-12-26 | 2008-07-17 | Sumitomo Bakelite Co Ltd | 半導体装置及び封止用エポキシ樹脂組成物 |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8963344B2 (en) | 2009-12-07 | 2015-02-24 | Sumitomo Bakelite Co., Ltd. | Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device |
JPWO2011070739A1 (ja) * | 2009-12-07 | 2013-04-22 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置 |
WO2011070739A1 (ja) * | 2009-12-07 | 2011-06-16 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置 |
WO2012070529A1 (ja) * | 2010-11-24 | 2012-05-31 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
CN103221480A (zh) * | 2010-11-24 | 2013-07-24 | 住友电木株式会社 | 半导体密封用环氧树脂组合物和半导体装置 |
JPWO2012070529A1 (ja) * | 2010-11-24 | 2014-05-19 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP2013067694A (ja) * | 2011-09-21 | 2013-04-18 | Panasonic Corp | 半導体封止用エポキシ樹脂組成物および半導体装置 |
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WO2014203777A1 (ja) * | 2013-06-20 | 2014-12-24 | 住友ベークライト株式会社 | 半導体装置 |
KR20160022864A (ko) * | 2013-06-20 | 2016-03-02 | 스미또모 베이크라이트 가부시키가이샤 | 반도체 장치 |
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