JP2010108976A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010108976A5 JP2010108976A5 JP2008276620A JP2008276620A JP2010108976A5 JP 2010108976 A5 JP2010108976 A5 JP 2010108976A5 JP 2008276620 A JP2008276620 A JP 2008276620A JP 2008276620 A JP2008276620 A JP 2008276620A JP 2010108976 A5 JP2010108976 A5 JP 2010108976A5
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- film
- control gate
- semiconductor device
- potential barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 33
- 238000005036 potential barrier Methods 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000012535 impurity Substances 0.000 claims 7
- 230000015572 biosynthetic process Effects 0.000 claims 6
- 238000000034 method Methods 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008276620A JP2010108976A (ja) | 2008-10-28 | 2008-10-28 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008276620A JP2010108976A (ja) | 2008-10-28 | 2008-10-28 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010108976A JP2010108976A (ja) | 2010-05-13 |
| JP2010108976A5 true JP2010108976A5 (enExample) | 2011-12-01 |
Family
ID=42298154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008276620A Pending JP2010108976A (ja) | 2008-10-28 | 2008-10-28 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010108976A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7985649B1 (en) * | 2010-01-07 | 2011-07-26 | Freescale Semiconductor, Inc. | Method of making a semiconductor structure useful in making a split gate non-volatile memory cell |
| JP5734744B2 (ja) | 2011-05-27 | 2015-06-17 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP5985293B2 (ja) | 2011-10-04 | 2016-09-06 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6274826B2 (ja) * | 2013-11-14 | 2018-02-07 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP2015103698A (ja) | 2013-11-26 | 2015-06-04 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003046002A (ja) * | 2001-07-26 | 2003-02-14 | Sony Corp | 不揮発性半導体メモリ装置およびその動作方法 |
| JP4647175B2 (ja) * | 2002-04-18 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
-
2008
- 2008-10-28 JP JP2008276620A patent/JP2010108976A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI664665B (zh) | 金屬浮動閘極合成三維反及型記憶體裝置與相關聯方法 | |
| CN104241291B (zh) | 嵌入式存储器及其形成方法 | |
| CN110047844B (zh) | 三维垂直单晶体管铁电存储器及其制备方法 | |
| JP2004349680A5 (enExample) | ||
| US20160071947A1 (en) | Method including a replacement of a dummy gate structure with a gate structure including a ferroelectric material | |
| JP2014143339A5 (enExample) | ||
| JP2003309193A5 (enExample) | ||
| CN105723511B (zh) | 具有自对准浮栅和控制栅的存储器结构和关联方法 | |
| JP2010123937A5 (enExample) | ||
| JP2010123936A5 (enExample) | ||
| JP2008177606A5 (enExample) | ||
| CN103715133A (zh) | Mos晶体管及其形成方法 | |
| JP2010521817A5 (enExample) | ||
| JP2016048710A5 (enExample) | ||
| JP2010108976A5 (enExample) | ||
| CN108630751A (zh) | 半导体结构及其形成方法 | |
| TW202021045A (zh) | 半導體結構及其製備方法 | |
| JP2010258153A5 (ja) | 半導体装置の製造方法 | |
| JP2007281091A5 (enExample) | ||
| JP2001148428A5 (ja) | 不揮発性半導体記憶装置およびその製造方法 | |
| WO2010043068A1 (zh) | 电可擦写可编程存储器及其制造方法 | |
| JP2005209931A5 (enExample) | ||
| JP2009224509A5 (enExample) | ||
| CN105097954B (zh) | 一种半导体器件的制造方法和电子装置 | |
| JP2009010281A5 (enExample) |