JP2010047740A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010047740A5 JP2010047740A5 JP2008320018A JP2008320018A JP2010047740A5 JP 2010047740 A5 JP2010047740 A5 JP 2010047740A5 JP 2008320018 A JP2008320018 A JP 2008320018A JP 2008320018 A JP2008320018 A JP 2008320018A JP 2010047740 A5 JP2010047740 A5 JP 2010047740A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- thermosetting resin
- resin composition
- optical semiconductor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001187 thermosetting polymer Polymers 0.000 claims 18
- 239000011342 resin composition Substances 0.000 claims 17
- -1 phosphonium ion Chemical class 0.000 claims 15
- 230000003287 optical effect Effects 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 12
- 125000001424 substituent group Chemical group 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000003054 catalyst Substances 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 4
- 125000003545 alkoxy group Chemical group 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 150000002736 metal compounds Chemical class 0.000 claims 3
- 150000003839 salts Chemical class 0.000 claims 3
- 239000012463 white pigment Substances 0.000 claims 3
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical group CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 claims 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 239000013522 chelant Chemical group 0.000 claims 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 150000004010 onium ions Chemical class 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 150000001242 acetic acid derivatives Chemical class 0.000 claims 1
- 125000004018 acid anhydride group Chemical group 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 150000004703 alkoxides Chemical class 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 150000001450 anions Chemical class 0.000 claims 1
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- 229910052788 barium Inorganic materials 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 150000001768 cations Chemical class 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 238000004898 kneading Methods 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 229910052752 metalloid Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000001579 optical reflectometry Methods 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 150000004714 phosphonium salts Chemical group 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008320018A JP5550230B2 (ja) | 2008-07-22 | 2008-12-16 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008188405 | 2008-07-22 | ||
| JP2008188405 | 2008-07-22 | ||
| JP2008320018A JP5550230B2 (ja) | 2008-07-22 | 2008-12-16 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013198253A Division JP6096090B2 (ja) | 2008-07-22 | 2013-09-25 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010047740A JP2010047740A (ja) | 2010-03-04 |
| JP2010047740A5 true JP2010047740A5 (enExample) | 2011-12-01 |
| JP5550230B2 JP5550230B2 (ja) | 2014-07-16 |
Family
ID=42065083
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008320018A Expired - Fee Related JP5550230B2 (ja) | 2008-07-22 | 2008-12-16 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
| JP2013198253A Active JP6096090B2 (ja) | 2008-07-22 | 2013-09-25 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013198253A Active JP6096090B2 (ja) | 2008-07-22 | 2013-09-25 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP5550230B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201144345A (en) * | 2010-03-10 | 2011-12-16 | Ajinomoto Kk | Resin composition |
| WO2012053377A1 (ja) * | 2010-10-18 | 2012-04-26 | 株式会社ダイセル | 高屈折率樹脂組成物および樹脂硬化物 |
| CN103168057B (zh) | 2010-10-25 | 2015-06-24 | 出光兴产株式会社 | (甲基)丙烯酸酯系组合物 |
| JP5825650B2 (ja) * | 2013-06-13 | 2015-12-02 | 日東電工株式会社 | 光半導体リフレクタ用エポキシ樹脂組成物、光半導体装置用熱硬化性樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、封止型光半導体素子ならびに光半導体装置 |
| JP6399650B2 (ja) * | 2013-10-15 | 2018-10-03 | 日本化薬株式会社 | 脂環式多官能酸無水物及び熱硬化性樹脂組成物 |
| CN111406085B (zh) * | 2017-11-30 | 2023-04-14 | 昭和电工材料株式会社 | 复合粉 |
| JP2020029524A (ja) * | 2018-08-23 | 2020-02-27 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物 |
| JP7567317B2 (ja) * | 2020-09-24 | 2024-10-16 | 株式会社レゾナック | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4475771B2 (ja) * | 2000-08-08 | 2010-06-09 | 日本化学工業株式会社 | 光半導体封止用エポキシ樹脂組成物 |
| JP4288940B2 (ja) * | 2002-12-06 | 2009-07-01 | 日亜化学工業株式会社 | エポキシ樹脂組成物 |
| JP2005037792A (ja) * | 2003-07-18 | 2005-02-10 | Shin Etsu Chem Co Ltd | 液晶表示素子用シール剤組成物 |
| JP2005054060A (ja) * | 2003-08-04 | 2005-03-03 | Hokko Chem Ind Co Ltd | 熱硬化性エポキシ樹脂用硬化促進剤および高温熱硬化用潜在型エポキシ樹脂組成物 |
| JP5060707B2 (ja) * | 2004-11-10 | 2012-10-31 | 日立化成工業株式会社 | 光反射用熱硬化性樹脂組成物 |
| JP5303097B2 (ja) * | 2005-10-07 | 2013-10-02 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
| JP4802667B2 (ja) * | 2005-11-08 | 2011-10-26 | 住友金属鉱山株式会社 | エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤 |
| JP5233186B2 (ja) * | 2006-07-25 | 2013-07-10 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置 |
| JP5298468B2 (ja) * | 2006-09-26 | 2013-09-25 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置 |
| JP5769353B2 (ja) * | 2007-07-13 | 2015-08-26 | チェイル インダストリーズ インコーポレイテッド | 粘着剤組成物及び光学部材 |
-
2008
- 2008-12-16 JP JP2008320018A patent/JP5550230B2/ja not_active Expired - Fee Related
-
2013
- 2013-09-25 JP JP2013198253A patent/JP6096090B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010047741A5 (enExample) | ||
| JP2010047740A5 (enExample) | ||
| TWI530532B (zh) | A silicon-containing hardened composition and a hardened product thereof | |
| ES2256936T3 (es) | Composicion para formar un revestimiento resistente a la abrasion sobre un sustrato. | |
| JP5739418B2 (ja) | ケイ素含有硬化性組成物、該ケイ素含有硬化性組成物の硬化物及び該ケイ素含有硬化性組成物より形成されるリードフレーム基板 | |
| CN105324407B (zh) | 活性能量线固化性组合物 | |
| JP2006328315A5 (enExample) | ||
| TWI616487B (zh) | 含梯狀矽倍半氧烷(silsesquioxane)高分子之光學薄膜用樹脂組成物 | |
| CN1138345A (zh) | 制备基于含环氧基硅烷组合物的方法 | |
| CN102786803B (zh) | 高折射率可固化液态发光二极管密封剂制剂 | |
| TWI684617B (zh) | 聚矽氧烷共聚物及含有其之抗靜電劑 | |
| JP6801680B2 (ja) | 封止用の熱硬化性樹脂組成物および封止用シート | |
| CN105683283A (zh) | 含水滑石的密封用树脂组合物和密封用片材 | |
| JP2016505691A5 (enExample) | ||
| JP2008185672A5 (enExample) | ||
| JP4246269B2 (ja) | シロキサン系のためのｕｖ−安定化剤 | |
| JP2012211235A (ja) | オルガノポリシロキサン及びそれを用いた熱硬化性樹脂組成物、光半導体用封止材、光半導体用ダイボンド材 | |
| TWI713519B (zh) | 封裝用樹脂組成物及封裝用薄片 | |
| KR20030081133A (ko) | 무기 ｕｖ 흡수제를 포함하는 조성물 | |
| JP5070107B2 (ja) | エポキシ樹脂組成物 | |
| CN202772736U (zh) | 马达防护结构 | |
| JP2015229743A (ja) | 赤外線吸収樹脂組成物およびレンズ | |
| JP2012251100A (ja) | シリコーン樹脂組成物および熱伝導シート | |
| TW201807072A (zh) | 含有矽之硬化性組合物及其硬化物 | |
| JP2009298975A (ja) | 一液型エポキシ樹脂組成物 |