JP5550230B2 - 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 - Google Patents

熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 Download PDF

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Publication number
JP5550230B2
JP5550230B2 JP2008320018A JP2008320018A JP5550230B2 JP 5550230 B2 JP5550230 B2 JP 5550230B2 JP 2008320018 A JP2008320018 A JP 2008320018A JP 2008320018 A JP2008320018 A JP 2008320018A JP 5550230 B2 JP5550230 B2 JP 5550230B2
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Prior art keywords
group
optical semiconductor
thermosetting resin
resin composition
semiconductor element
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Expired - Fee Related
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JP2008320018A
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English (en)
Japanese (ja)
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JP2010047740A (ja
JP2010047740A5 (enExample
Inventor
勇人 小谷
直之 浦崎
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008320018A priority Critical patent/JP5550230B2/ja
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Publication of JP2010047740A5 publication Critical patent/JP2010047740A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2008320018A 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 Expired - Fee Related JP5550230B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008320018A JP5550230B2 (ja) 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008188405 2008-07-22
JP2008188405 2008-07-22
JP2008320018A JP5550230B2 (ja) 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

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JP2013198253A Division JP6096090B2 (ja) 2008-07-22 2013-09-25 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

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JP2010047740A JP2010047740A (ja) 2010-03-04
JP2010047740A5 JP2010047740A5 (enExample) 2011-12-01
JP5550230B2 true JP5550230B2 (ja) 2014-07-16

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JP2013198253A Active JP6096090B2 (ja) 2008-07-22 2013-09-25 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

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Publication number Priority date Publication date Assignee Title
TW201144345A (en) * 2010-03-10 2011-12-16 Ajinomoto Kk Resin composition
WO2012053377A1 (ja) * 2010-10-18 2012-04-26 株式会社ダイセル 高屈折率樹脂組成物および樹脂硬化物
CN103168057B (zh) 2010-10-25 2015-06-24 出光兴产株式会社 (甲基)丙烯酸酯系组合物
JP5825650B2 (ja) * 2013-06-13 2015-12-02 日東電工株式会社 光半導体リフレクタ用エポキシ樹脂組成物、光半導体装置用熱硬化性樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、封止型光半導体素子ならびに光半導体装置
JP6399650B2 (ja) * 2013-10-15 2018-10-03 日本化薬株式会社 脂環式多官能酸無水物及び熱硬化性樹脂組成物
CN111406085B (zh) * 2017-11-30 2023-04-14 昭和电工材料株式会社 复合粉
JP2020029524A (ja) * 2018-08-23 2020-02-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物
JP7567317B2 (ja) * 2020-09-24 2024-10-16 株式会社レゾナック 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

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JP4475771B2 (ja) * 2000-08-08 2010-06-09 日本化学工業株式会社 光半導体封止用エポキシ樹脂組成物
JP4288940B2 (ja) * 2002-12-06 2009-07-01 日亜化学工業株式会社 エポキシ樹脂組成物
JP2005037792A (ja) * 2003-07-18 2005-02-10 Shin Etsu Chem Co Ltd 液晶表示素子用シール剤組成物
JP2005054060A (ja) * 2003-08-04 2005-03-03 Hokko Chem Ind Co Ltd 熱硬化性エポキシ樹脂用硬化促進剤および高温熱硬化用潜在型エポキシ樹脂組成物
JP5060707B2 (ja) * 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物
JP5303097B2 (ja) * 2005-10-07 2013-10-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
JP4802667B2 (ja) * 2005-11-08 2011-10-26 住友金属鉱山株式会社 エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤
JP5233186B2 (ja) * 2006-07-25 2013-07-10 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP5298468B2 (ja) * 2006-09-26 2013-09-25 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP5769353B2 (ja) * 2007-07-13 2015-08-26 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物及び光学部材

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