JP2010045328A - 発光装置および発光装置の製造方法 - Google Patents
発光装置および発光装置の製造方法 Download PDFInfo
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- JP2010045328A JP2010045328A JP2009105999A JP2009105999A JP2010045328A JP 2010045328 A JP2010045328 A JP 2010045328A JP 2009105999 A JP2009105999 A JP 2009105999A JP 2009105999 A JP2009105999 A JP 2009105999A JP 2010045328 A JP2010045328 A JP 2010045328A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 434
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- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 5
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- 150000001674 calcium compounds Chemical class 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
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- 239000001736 Calcium glycerylphosphate Substances 0.000 claims description 3
- BCZXFFBUYPCTSJ-UHFFFAOYSA-L Calcium propionate Chemical compound [Ca+2].CCC([O-])=O.CCC([O-])=O BCZXFFBUYPCTSJ-UHFFFAOYSA-L 0.000 claims description 3
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- 229940072020 calcium borogluconate Drugs 0.000 claims description 3
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- 229960002713 calcium chloride Drugs 0.000 claims description 3
- 235000011148 calcium chloride Nutrition 0.000 claims description 3
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 claims description 3
- 239000001354 calcium citrate Substances 0.000 claims description 3
- 229960004256 calcium citrate Drugs 0.000 claims description 3
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- 235000019299 calcium glycerylphosphate Nutrition 0.000 claims description 3
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- 229960002401 calcium lactate Drugs 0.000 claims description 3
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- 239000004330 calcium propionate Substances 0.000 claims description 3
- 235000010331 calcium propionate Nutrition 0.000 claims description 3
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- 235000019700 dicalcium phosphate Nutrition 0.000 claims description 3
- 235000013337 tricalcium citrate Nutrition 0.000 claims description 3
- 229910001512 metal fluoride Inorganic materials 0.000 claims description 2
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- 150000003839 salts Chemical class 0.000 abstract description 5
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- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
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- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
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- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
- H05B33/145—Arrangements of the electroluminescent material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Led Devices (AREA)
Abstract
【解決手段】本発明によれば、高効率な白色光を発光するとともに、色再現性(NTSC比)が著しく良好な白色光を得ることができる4価のマンガン付活フッ化4価金属塩蛍光体蛍光体と樹脂等の蛍光体混練物包装容器から得た蛍光体混練物を備えた著しく良好な白色光を得ることができる発光装置を提供する。
【選択図】図2
Description
実施の形態1を図1および2を用いて説明する。
実施の形態2を図3および4を用いて説明する。
緑色蛍光体7と赤色蛍光体3とを30:70の割合(重量比)で混合したものを封止樹脂中に分散し(封止樹脂と蛍光体との比率は1.00:0.25)波長変換部を作製する。このようにして発光装置51を作製した。
緑色蛍光体7は実施の形態1と同様のものを使用することができる。
実施の形態3を図5および6を用いて説明する。
透明性樹脂2は、シリコーン樹脂、エポキシ樹脂、ウレタン樹脂、ノルボルネン系樹脂、フッ素樹脂、金属アルコキシド、ポリシラザン、アクリル樹脂、低融点ガラス等が挙げられる。
(実施の形態4)
実施の形態4を図7および8を用いて説明する。
熱可塑性樹脂は、ポリエチレンやポリプロピレン、ポリスチレンなどの汎用プラスチック、熱可塑性プラスチック、エンプラ、耐熱エンプラ、熱可塑性エラストマーとしてスチレンブタジエン系(TPS)、オレフィン系(TPO)、ポリエステル系(TPEE)、ポリウレタン系(TPU)の4大TPEと呼ばれるものや塩化ビニル系(TPVC)、ポリアミド系(TPEA)、フッ素ゴム系、シリコーン樹脂などを用いることができる。
赤色蛍光体3を覆っている被覆樹脂2aは熱可塑性樹脂の場合は、加熱すると封止樹脂2c中に溶け込み、封止樹脂2c中に分散される。このようにして発光装置53を作製する。
緑色蛍光体7は実施の形態1と同様のものを使用することができる。
実施の形態5を図9および10を用いて説明する。
緑色蛍光体7と赤色蛍光体3とを30:70の割合(重量比)で混合したものを所定の封止樹脂中に分散し(封止樹脂と蛍光体との比率は1.00:0.25)波長変換部を作製した。このようにして発光装置54を作製する。
緑色蛍光体7は実施の形態1と同様のものを使用することができる。
実施の形態6を図11および12を用いて説明する。
これらの緑色蛍光体7と赤色蛍光体3とを30:70の割合(重量比)で混合したものを所定の封止樹脂中に分散し(封止樹脂と蛍光体との比率は1.00:0.25)波長変換部を作製する。このようにして発光装置55を作製する。
緑色蛍光体7は実施の形態1と同様のものを使用することができる。
実施の形態7を図13および14を用いて説明する。
緑色蛍光体7は実施の形態1と同様のものを使用することができる。
実施の形態8を図15および16を用いて説明する。
これらの緑色蛍光体7と赤色蛍光体3とを30:70の割合(重量比)で混合したものを所定の封止樹脂中に分散し(封止樹脂と蛍光体との比率は1.00:0.25)波長変換部を作製する。このようにして発光装置18を作製する。
緑色蛍光体7は実施の形態3と同様のものを使用することができる。
Claims (16)
- 配線パターン上に発光素子が配置され、前記配線パターンと前記発光素子の上部がボンディングワイヤで接続され、
前記配線パターンと前記発光素子上に蛍光体混練物包装容器から得た蛍光体混練物が封止樹脂で封止されていることを特徴とする発光装置。 - 前記蛍光体混練物が透明性樹脂および赤色蛍光体を含み、緑色蛍光体とともに前記封止樹脂で封止されていることを特徴とする請求項1記載の発光装置。
- 前記蛍光体混練物が透明性樹脂、赤色蛍光体および緑色蛍光体を含むことを特徴とする請求項1記載の発光装置。
- 前記蛍光体混練物が透明性樹脂および被覆樹脂で覆われた赤色蛍光体を含み、緑色蛍光体とともに前記封止樹脂で封止されていることを特徴とする請求項1記載の発光装置。
- 前記蛍光体混練物がプライマーおよび赤色蛍光体を含み、緑色蛍光体とともに前記封止樹脂で封止されていることを特徴とする請求項1記載の発光装置。
- 前記蛍光体混練物が透明性樹脂およびプライマーで覆われた赤色蛍光体を含み、緑色蛍光体とともに前記封止樹脂で封止されていることを特徴とする請求項1記載の発光装置。
- 前記蛍光体混練物が透明性樹脂、プライマーで覆われた赤色蛍光体および緑色蛍光体を含むことを特徴とする請求項1記載の発光装置。
- 前記透明性樹脂が拡散剤、反射剤および散乱剤からなる群から選択された少なくとも1種を含む請求項2〜4または6〜7いずれか記載の発光装置。
- 前記蛍光体混練物を封止する封止樹脂と接する発光素子上のパッド電極、ボンディングワイヤおよび配線パターンの最上層は、白金または金層からなることを特徴とする請求項1記載の発光装置。
- 前記赤色蛍光体は4価のマンガン付活フッ化4価金属塩蛍光体であることを特徴とする請求項2〜7いずれか記載の発光装置。
- 前記蛍光体混練物には、さらにカルシウム化合物を含むことを特徴とする請求項10に記載の発光装置。
- 前記蛍光体混練物包装容器と前記蛍光体混練物は接触し、その接触する面が高分子材料からなることを特徴とする請求項1記載の発光装置。
- 前記蛍光体混練物包装容器がチューブ形状のチューブ包装容器またはチューブ状容器であることを特徴とする請求項1記載の発光装置。
- 前記蛍光体混練物包装容器内部にさらにカルシウム化合物を含むことを特徴とする請求項1または12〜13いずれか記載の発光装置。
- 前記カルシウム化合物は、グルコン酸カルシウム、ボログルコン酸カルシウム、グリセロリン酸カルシウム、塩化カルシウム、乳酸カルシウム、プロピオン酸カルシウム、パントテン酸カルシウム、クエン酸カルシウム、リン酸水素カルシウムの少なくとも一つからなることを特徴とする請求項11または14に記載の発光装置。
- 配線パターン上に発光素子が配置され、前記配線パターンと前記発光素子の上部がボンディングワイヤで接続された請求項1〜15いずれか記載の発光装置の製造方法において、前記配線パターンと前記発光素子上に蛍光体混練物包装容器から得た蛍光体混練物が封止樹脂で封止されることを特徴とする前記発光装置の製造方法。
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