JP2010041045A - 半導体装置及びその作製方法 - Google Patents

半導体装置及びその作製方法 Download PDF

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Publication number
JP2010041045A
JP2010041045A JP2009160474A JP2009160474A JP2010041045A JP 2010041045 A JP2010041045 A JP 2010041045A JP 2009160474 A JP2009160474 A JP 2009160474A JP 2009160474 A JP2009160474 A JP 2009160474A JP 2010041045 A JP2010041045 A JP 2010041045A
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semiconductor
sheet
electrode
organic resin
layer
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Japanese (ja)
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JP2010041045A5 (https=
Inventor
Akihiro Senda
章裕 千田
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2009160474A priority Critical patent/JP2010041045A/ja
Publication of JP2010041045A publication Critical patent/JP2010041045A/ja
Publication of JP2010041045A5 publication Critical patent/JP2010041045A5/ja
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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    • H05K1/02—Details
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    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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JP2009160474A 2008-07-09 2009-07-07 半導体装置及びその作製方法 Withdrawn JP2010041045A (ja)

Priority Applications (1)

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JP2009160474A JP2010041045A (ja) 2008-07-09 2009-07-07 半導体装置及びその作製方法

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JP2008179286 2008-07-09
JP2009160474A JP2010041045A (ja) 2008-07-09 2009-07-07 半導体装置及びその作製方法

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JP2014079887A Division JP5663687B2 (ja) 2008-07-09 2014-04-09 半導体装置の作製方法

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JP2010041045A true JP2010041045A (ja) 2010-02-18
JP2010041045A5 JP2010041045A5 (https=) 2012-08-16

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JP2009160474A Withdrawn JP2010041045A (ja) 2008-07-09 2009-07-07 半導体装置及びその作製方法
JP2014079887A Expired - Fee Related JP5663687B2 (ja) 2008-07-09 2014-04-09 半導体装置の作製方法

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US (1) US8563397B2 (https=)
EP (1) EP2148365A3 (https=)
JP (2) JP2010041045A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR20170130286A (ko) * 2016-05-18 2017-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 표시 장치, 모듈, 및 전자 기기
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