JP2010021530A5 - - Google Patents

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Publication number
JP2010021530A5
JP2010021530A5 JP2009116432A JP2009116432A JP2010021530A5 JP 2010021530 A5 JP2010021530 A5 JP 2010021530A5 JP 2009116432 A JP2009116432 A JP 2009116432A JP 2009116432 A JP2009116432 A JP 2009116432A JP 2010021530 A5 JP2010021530 A5 JP 2010021530A5
Authority
JP
Japan
Prior art keywords
package
temperature sensor
stacked layers
heater layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009116432A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010021530A (ja
JP5484783B2 (ja
Filing date
Publication date
Priority claimed from US12/172,317 external-priority patent/US7965094B2/en
Application filed filed Critical
Publication of JP2010021530A publication Critical patent/JP2010021530A/ja
Publication of JP2010021530A5 publication Critical patent/JP2010021530A5/ja
Application granted granted Critical
Publication of JP5484783B2 publication Critical patent/JP5484783B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009116432A 2008-07-14 2009-05-13 パッケージ化されたダイヒータ Expired - Fee Related JP5484783B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/172,317 US7965094B2 (en) 2008-07-14 2008-07-14 Packaged die heater
US12/172,317 2008-07-14

Publications (3)

Publication Number Publication Date
JP2010021530A JP2010021530A (ja) 2010-01-28
JP2010021530A5 true JP2010021530A5 (enExample) 2012-06-28
JP5484783B2 JP5484783B2 (ja) 2014-05-07

Family

ID=41262269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009116432A Expired - Fee Related JP5484783B2 (ja) 2008-07-14 2009-05-13 パッケージ化されたダイヒータ

Country Status (5)

Country Link
US (1) US7965094B2 (enExample)
EP (1) EP2146214B1 (enExample)
JP (1) JP5484783B2 (enExample)
AT (1) ATE497173T1 (enExample)
DE (1) DE602009000664D1 (enExample)

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US20150022226A1 (en) * 2009-11-30 2015-01-22 Essai, Inc. Systems and methods for conforming test tooling to integrated circuit device profiles with coaxial socket
US9804223B2 (en) * 2009-11-30 2017-10-31 Essai, Inc. Systems and methods for conforming test tooling to integrated circuit device with heater socket
US8756549B2 (en) 2011-01-05 2014-06-17 International Business Machines Corporation Integrated circuit chip incorporating embedded thermal radiators for localized, on-demand, heating and a system and method for designing such an integrated circuit chip
US10002846B2 (en) 2011-10-27 2018-06-19 Global Circuit Innovations Incorporated Method for remapping a packaged extracted die with 3D printed bond connections
US10109606B2 (en) 2011-10-27 2018-10-23 Global Circuit Innovations, Inc. Remapped packaged extracted die
US9870968B2 (en) 2011-10-27 2018-01-16 Global Circuit Innovations Incorporated Repackaged integrated circuit and assembly method
US10147660B2 (en) 2011-10-27 2018-12-04 Global Circuits Innovations, Inc. Remapped packaged extracted die with 3D printed bond connections
US9935028B2 (en) 2013-03-05 2018-04-03 Global Circuit Innovations Incorporated Method and apparatus for printing integrated circuit bond connections
US10177054B2 (en) 2011-10-27 2019-01-08 Global Circuit Innovations, Inc. Method for remapping a packaged extracted die
US10128161B2 (en) 2011-10-27 2018-11-13 Global Circuit Innovations, Inc. 3D printed hermetic package assembly and method
US9966319B1 (en) 2011-10-27 2018-05-08 Global Circuit Innovations Incorporated Environmental hardening integrated circuit method and apparatus
US9228855B2 (en) 2012-03-07 2016-01-05 Crocus Technology Inc. Magnetic logic units configured to measure magnetic field direction
KR20140106997A (ko) * 2013-02-27 2014-09-04 삼성전자주식회사 반도체 패키지
JP5782070B2 (ja) * 2013-07-19 2015-09-24 日本電信電話株式会社 電気素子のパッケージ
JP6280519B2 (ja) * 2015-05-01 2018-02-14 株式会社ヒットデバイス 電子部品の温度特性評価装置およびそれに用いられる温度制御ユニット
US10499461B2 (en) * 2015-12-21 2019-12-03 Intel Corporation Thermal head with a thermal barrier for integrated circuit die processing
JP2018100838A (ja) * 2016-12-19 2018-06-28 ルネサスエレクトロニクス株式会社 半導体製造装置、半導体製造方法及び半導体装置
US10782316B2 (en) * 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
CN107860483A (zh) * 2017-12-26 2018-03-30 上海理好智能科技有限公司 一种带温度传感器的发热器及其制备方法
US10115645B1 (en) 2018-01-09 2018-10-30 Global Circuit Innovations, Inc. Repackaged reconditioned die method and assembly
CN108622847A (zh) * 2018-05-03 2018-10-09 河北美泰电子科技有限公司 Mems传感器的封装方法及封装结构
CN110873834A (zh) * 2018-09-03 2020-03-10 天津市菲莱科技有限公司 一种芯片加工设备及其夹持装置
WO2021107115A1 (ja) * 2019-11-27 2021-06-03 京セラ株式会社 回路基板、プローブカード用基板およびプローブカード
US11508680B2 (en) 2020-11-13 2022-11-22 Global Circuit Innovations Inc. Solder ball application for singular die
CN113097200B (zh) * 2021-03-09 2022-09-20 中国电子科技集团公司第二十九研究所 一种倒装热源芯片及其制备方法和应用方法
US11774486B2 (en) 2021-06-30 2023-10-03 Delta Design Inc. Temperature control system including contactor assembly

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