JP2010016149A - ナノインプリント用硬化性組成物、硬化物およびその製造方法、ならびに液晶表示装置用部材 - Google Patents
ナノインプリント用硬化性組成物、硬化物およびその製造方法、ならびに液晶表示装置用部材 Download PDFInfo
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- JP2010016149A JP2010016149A JP2008174216A JP2008174216A JP2010016149A JP 2010016149 A JP2010016149 A JP 2010016149A JP 2008174216 A JP2008174216 A JP 2008174216A JP 2008174216 A JP2008174216 A JP 2008174216A JP 2010016149 A JP2010016149 A JP 2010016149A
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- acrylate
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
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- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- QPQANCNBWQXGTQ-UHFFFAOYSA-N trihydroxy(trimethylsilylperoxy)silane Chemical compound C[Si](C)(C)OO[Si](O)(O)O QPQANCNBWQXGTQ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- UUJLHYCIMQOUKC-UHFFFAOYSA-N trimethyl-[oxo(trimethylsilylperoxy)silyl]peroxysilane Chemical compound C[Si](C)(C)OO[Si](=O)OO[Si](C)(C)C UUJLHYCIMQOUKC-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- LZTRCELOJRDYMQ-UHFFFAOYSA-N triphenylmethanol Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C1=CC=CC=C1 LZTRCELOJRDYMQ-UHFFFAOYSA-N 0.000 description 1
- JODJRDDQVZMRIY-UHFFFAOYSA-N trityloxyboronic acid Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(OB(O)O)C1=CC=CC=C1 JODJRDDQVZMRIY-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- 229960001763 zinc sulfate Drugs 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
- C07C69/67—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/10—Homopolymers or copolymers of methacrylic acid esters
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
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Priority Applications (4)
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JP2008174216A JP2010016149A (ja) | 2008-07-03 | 2008-07-03 | ナノインプリント用硬化性組成物、硬化物およびその製造方法、ならびに液晶表示装置用部材 |
KR1020090059538A KR20100004871A (ko) | 2008-07-03 | 2009-07-01 | 나노 임프린트용 경화성 조성물, 경화물 및 그 제조 방법, 그리고 액정 표시 장치용 부재 |
TW098122357A TW201005431A (en) | 2008-07-03 | 2009-07-02 | Curable composition for nanoimprint, curing object, manufacturing method thereof and member for liquid crystal display device |
CN200910151360A CN101620377A (zh) | 2008-07-03 | 2009-07-02 | 纳米压印用固化性组合物、固化物及其制造方法、以及液晶显示装置用部件 |
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JP2008174216A JP2010016149A (ja) | 2008-07-03 | 2008-07-03 | ナノインプリント用硬化性組成物、硬化物およびその製造方法、ならびに液晶表示装置用部材 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011171471A (ja) * | 2010-02-18 | 2011-09-01 | Dainippon Printing Co Ltd | ナノインプリント方法およびそれに用いるモールド |
DE112011102260T5 (de) | 2010-07-02 | 2013-08-08 | Tokuyama Corp. | Photohärtbare Zusammensetzung zum Prägedruck und Verfahren zum Bilden eines Musters mittels der Zusammensetzung |
WO2013183467A1 (en) * | 2012-06-06 | 2013-12-12 | Canon Kabushiki Kaisha | Curable composition and patterning method using the same |
JP2014031510A (ja) * | 2012-07-13 | 2014-02-20 | Nippon Shokubai Co Ltd | 安定化剤組成物 |
CN104345552A (zh) * | 2013-07-31 | 2015-02-11 | 东友精细化工有限公司 | 着色感光树脂组合物、滤色片和具有该滤色片的液晶显示装置 |
JP2016171182A (ja) * | 2015-03-12 | 2016-09-23 | ニッタ株式会社 | インプリント用モールドおよびその製造方法、並びに微細構造の製造方法 |
WO2019065567A1 (ja) * | 2017-09-27 | 2019-04-04 | 富士フイルム株式会社 | インプリント用硬化性組成物、硬化物パターンの製造方法、回路基板の製造方法および硬化物 |
JP2019143057A (ja) * | 2018-02-22 | 2019-08-29 | 東洋インキScホールディングス株式会社 | 光硬化性組成物およびディスプレイ |
CN111925727A (zh) * | 2020-08-11 | 2020-11-13 | 浙江洁美电子科技股份有限公司 | 一种偏光片用离型剂、离型膜及其制备方法 |
WO2021261196A1 (ja) * | 2020-06-25 | 2021-12-30 | Dic株式会社 | ラジカル硬化性樹脂組成物、繊維強化成形材料、及びそれを用いた成形品 |
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WO2013161630A1 (ja) * | 2012-04-27 | 2013-10-31 | 日産化学工業株式会社 | 低離型力性を有するインプリント材料 |
JP7118580B2 (ja) * | 2014-08-26 | 2022-08-16 | キヤノン株式会社 | 光硬化性組成物、これを用いた硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、およびインプリント用モールドの製造方法 |
JP6522739B2 (ja) * | 2015-03-31 | 2019-05-29 | 富士フイルム株式会社 | 上層膜形成用組成物、パターン形成方法、レジストパターン、及び、電子デバイスの製造方法 |
JP2018517924A (ja) | 2015-07-24 | 2018-07-05 | 華為技術有限公司Huawei Technologies Co.,Ltd. | カメラモジュールおよび端末 |
KR20170046585A (ko) * | 2015-10-21 | 2017-05-02 | 제이엔씨 주식회사 | 감광성 조성물 |
CN108873426B (zh) * | 2018-06-27 | 2021-06-29 | 武汉华星光电技术有限公司 | 显示面板及其制造方法、液晶显示装置 |
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- 2009-07-01 KR KR1020090059538A patent/KR20100004871A/ko not_active Application Discontinuation
- 2009-07-02 CN CN200910151360A patent/CN101620377A/zh active Pending
- 2009-07-02 TW TW098122357A patent/TW201005431A/zh unknown
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011171471A (ja) * | 2010-02-18 | 2011-09-01 | Dainippon Printing Co Ltd | ナノインプリント方法およびそれに用いるモールド |
DE112011102260T5 (de) | 2010-07-02 | 2013-08-08 | Tokuyama Corp. | Photohärtbare Zusammensetzung zum Prägedruck und Verfahren zum Bilden eines Musters mittels der Zusammensetzung |
US10233274B2 (en) | 2012-06-06 | 2019-03-19 | Canon Kabushiki Kaisha | Curable composition and patterning method using the same |
WO2013183467A1 (en) * | 2012-06-06 | 2013-12-12 | Canon Kabushiki Kaisha | Curable composition and patterning method using the same |
JP2013253150A (ja) * | 2012-06-06 | 2013-12-19 | Canon Inc | 硬化性組成物、及びこれを用いるパターン形成方法 |
JP2014031510A (ja) * | 2012-07-13 | 2014-02-20 | Nippon Shokubai Co Ltd | 安定化剤組成物 |
CN104345552A (zh) * | 2013-07-31 | 2015-02-11 | 东友精细化工有限公司 | 着色感光树脂组合物、滤色片和具有该滤色片的液晶显示装置 |
CN104345552B (zh) * | 2013-07-31 | 2018-10-19 | 东友精细化工有限公司 | 着色感光树脂组合物、滤色片和具有该滤色片的液晶显示装置 |
JP2016171182A (ja) * | 2015-03-12 | 2016-09-23 | ニッタ株式会社 | インプリント用モールドおよびその製造方法、並びに微細構造の製造方法 |
WO2019065567A1 (ja) * | 2017-09-27 | 2019-04-04 | 富士フイルム株式会社 | インプリント用硬化性組成物、硬化物パターンの製造方法、回路基板の製造方法および硬化物 |
JPWO2019065567A1 (ja) * | 2017-09-27 | 2020-11-26 | 富士フイルム株式会社 | インプリント用硬化性組成物、硬化物パターンの製造方法、回路基板の製造方法および硬化物 |
US11435663B2 (en) | 2017-09-27 | 2022-09-06 | Fujifilm Corporation | Curable composition for imprinting, method of manufacturing cured product pattern, method of manufacturing circuit substrate, and cured product |
JP2019143057A (ja) * | 2018-02-22 | 2019-08-29 | 東洋インキScホールディングス株式会社 | 光硬化性組成物およびディスプレイ |
WO2021261196A1 (ja) * | 2020-06-25 | 2021-12-30 | Dic株式会社 | ラジカル硬化性樹脂組成物、繊維強化成形材料、及びそれを用いた成形品 |
CN111925727A (zh) * | 2020-08-11 | 2020-11-13 | 浙江洁美电子科技股份有限公司 | 一种偏光片用离型剂、离型膜及其制备方法 |
Also Published As
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KR20100004871A (ko) | 2010-01-13 |
CN101620377A (zh) | 2010-01-06 |
TW201005431A (en) | 2010-02-01 |
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