JP2009539593A5 - - Google Patents
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- Publication number
- JP2009539593A5 JP2009539593A5 JP2009514770A JP2009514770A JP2009539593A5 JP 2009539593 A5 JP2009539593 A5 JP 2009539593A5 JP 2009514770 A JP2009514770 A JP 2009514770A JP 2009514770 A JP2009514770 A JP 2009514770A JP 2009539593 A5 JP2009539593 A5 JP 2009539593A5
- Authority
- JP
- Japan
- Prior art keywords
- structured
- substantially flat
- support
- base layer
- matrix material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 31
- 239000010410 layer Substances 0.000 claims 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 12
- 239000002245 particle Substances 0.000 claims 12
- 239000011159 matrix material Substances 0.000 claims 9
- 239000000126 substance Substances 0.000 claims 9
- 238000000576 coating method Methods 0.000 claims 6
- 239000006185 dispersion Substances 0.000 claims 6
- 229910052742 iron Inorganic materials 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 238000001035 drying Methods 0.000 claims 3
- 239000007800 oxidant agent Substances 0.000 claims 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- 230000002378 acidificating effect Effects 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000010297 mechanical methods and process Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 claims 1
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 claims 1
- OQVYMXCRDHDTTH-UHFFFAOYSA-N 4-(diethoxyphosphorylmethyl)-2-[4-(diethoxyphosphorylmethyl)pyridin-2-yl]pyridine Chemical compound CCOP(=O)(OCC)CC1=CC=NC(C=2N=CC=C(CP(=O)(OCC)OCC)C=2)=C1 OQVYMXCRDHDTTH-UHFFFAOYSA-N 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- BNBLBRISEAQIHU-UHFFFAOYSA-N disodium dioxido(dioxo)manganese Chemical compound [Na+].[Na+].[O-][Mn]([O-])(=O)=O BNBLBRISEAQIHU-UHFFFAOYSA-N 0.000 claims 1
- 239000000428 dust Substances 0.000 claims 1
- 230000005670 electromagnetic radiation Effects 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000000227 grinding Methods 0.000 claims 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000012811 non-conductive material Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims 1
- JRKICGRDRMAZLK-UHFFFAOYSA-N peroxydisulfuric acid Chemical compound OS(=O)(=O)OOS(O)(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-N 0.000 claims 1
- 238000000053 physical method Methods 0.000 claims 1
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000012286 potassium permanganate Substances 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06115487 | 2006-06-14 | ||
| PCT/EP2007/055701 WO2007144322A1 (de) | 2006-06-14 | 2007-06-11 | Verfahren zur herstellung von elektrisch leitfähigen oberflächen auf einem träger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009539593A JP2009539593A (ja) | 2009-11-19 |
| JP2009539593A5 true JP2009539593A5 (https=) | 2010-07-15 |
Family
ID=38461132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009514770A Pending JP2009539593A (ja) | 2006-06-14 | 2007-06-11 | 支持体上に導電性の表面を製造する方法 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20090285976A1 (https=) |
| EP (1) | EP2033501A1 (https=) |
| JP (1) | JP2009539593A (https=) |
| KR (1) | KR20090025337A (https=) |
| CN (1) | CN101491166B (https=) |
| BR (1) | BRPI0712709A2 (https=) |
| CA (1) | CA2654797A1 (https=) |
| IL (1) | IL195620A0 (https=) |
| RU (1) | RU2436266C2 (https=) |
| TW (1) | TW200806127A (https=) |
| WO (1) | WO2007144322A1 (https=) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2674702A1 (en) * | 2007-01-05 | 2008-07-10 | Basf Se | Method for producing electrically conductive surfaces |
| WO2008101884A2 (de) * | 2007-02-20 | 2008-08-28 | Basf Se | Verfahren zur kontaktierung elektrischer bauelemente |
| ATE474080T1 (de) | 2007-02-20 | 2010-07-15 | Basf Se | Verfahren zur herstellung von metallisierten textilen oberflächen mit strom erzeugenden oder strom verbrauchenden artikeln |
| WO2009112573A2 (de) * | 2008-03-13 | 2009-09-17 | Basf Se | Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse |
| WO2009144186A2 (de) | 2008-05-30 | 2009-12-03 | Basf Se | Verfahren zur herstellung von transparenten leitfähigen oxiden |
| CN102067323A (zh) * | 2008-06-18 | 2011-05-18 | 巴斯夫欧洲公司 | 制备太阳能电池用电极的方法 |
| WO2009153361A1 (es) * | 2008-06-19 | 2009-12-23 | Fundacion Cidetec | Procedimiento para recubrir un sustrato aislante por vía electroquímica |
| US8486305B2 (en) | 2009-11-30 | 2013-07-16 | Lockheed Martin Corporation | Nanoparticle composition and methods of making the same |
| DE102009009650B4 (de) * | 2009-02-19 | 2013-10-10 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung |
| US8585911B2 (en) * | 2009-03-18 | 2013-11-19 | Kuo-Ching Chiang | Thin film antenna and the method of forming the same |
| US20170038658A1 (en) | 2011-09-30 | 2017-02-09 | View, Inc. | Particle removal during fabrication of electrochromic devices |
| US9007674B2 (en) | 2011-09-30 | 2015-04-14 | View, Inc. | Defect-mitigation layers in electrochromic devices |
| KR101009442B1 (ko) * | 2009-04-15 | 2011-01-19 | 한국과학기술연구원 | 전도성 구조체를 이용한 전도성필름 제조방법 및 전도성필름 |
| WO2010126876A1 (en) * | 2009-04-27 | 2010-11-04 | Drexel University | Transparent conformal polymer antennas for rfid and other wireless communications applications |
| US9072185B2 (en) | 2009-07-30 | 2015-06-30 | Lockheed Martin Corporation | Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas |
| US9011570B2 (en) | 2009-07-30 | 2015-04-21 | Lockheed Martin Corporation | Articles containing copper nanoparticles and methods for production and use thereof |
| DE102009045061A1 (de) | 2009-09-28 | 2011-03-31 | Basf Se | Verfahren zur Herstellung von elektrisch leitfähigen, strukturierten oder vollflächigen Oberflächen auf einem Träger |
| FR2952384B1 (fr) * | 2009-11-10 | 2012-12-14 | Commissariat Energie Atomique | Depot selectif de nanoparticules |
| WO2011077764A1 (ja) * | 2009-12-22 | 2011-06-30 | Jx日鉱日石金属株式会社 | 積層体の製造方及び積層体 |
| MX2012009464A (es) * | 2010-02-17 | 2012-09-12 | Basf Se | Proceso para producir uniones conductoras de electricidad entre celdas solares. |
| US8834747B2 (en) * | 2010-03-04 | 2014-09-16 | Lockheed Martin Corporation | Compositions containing tin nanoparticles and methods for use thereof |
| US10544483B2 (en) | 2010-03-04 | 2020-01-28 | Lockheed Martin Corporation | Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same |
| KR101204539B1 (ko) * | 2010-08-27 | 2012-11-23 | 삼성전기주식회사 | 에너지 저장 장치의 전극 제조용 도핑 장치 및 이를 이용한 전극 제조 방법 |
| CN102404934B (zh) * | 2010-09-09 | 2015-01-14 | 富葵精密组件(深圳)有限公司 | 电路板基板及其制作方法 |
| TWI398198B (zh) * | 2010-09-13 | 2013-06-01 | Zhen Ding Technology Co Ltd | 具有接地屏蔽結構之電路板及其製作方法 |
| US9475946B2 (en) * | 2011-09-30 | 2016-10-25 | Ppg Industries Ohio, Inc. | Graphenic carbon particle co-dispersions and methods of making same |
| CN104080956A (zh) * | 2011-12-02 | 2014-10-01 | 阿尔塔纳股份公司 | 在非导电衬底上制造的导电结构及其制造方法 |
| CA2861728C (fr) | 2012-01-13 | 2020-04-28 | Aw Branding Limited | Procede de fabrication d'une feuille |
| WO2013120109A2 (en) | 2012-02-10 | 2013-08-15 | Lockheed Martin Corporation | Photovoltaic cells having electrical contacts formed from metal nanoparticles and methods for production thereof |
| US9005483B2 (en) | 2012-02-10 | 2015-04-14 | Lockheed Martin Corporation | Nanoparticle paste formulations and methods for production and use thereof |
| CN102580905B (zh) * | 2012-02-15 | 2013-11-20 | 德州华源生态科技有限公司 | 并条、粗纱胶辊导电涂层的处理方法 |
| TWI473118B (zh) * | 2012-03-15 | 2015-02-11 | Nat Univ Kaohsiung | Polyethylene dioxythiophene - polystyrene sulfonate conductive liquid and conductive film formed by it |
| RU2516008C2 (ru) * | 2012-06-20 | 2014-05-20 | Закрытое акционерное общество "Галилео Нанотех" | Способ изготовления электропроводящей поверхности на полимерном рулонном материале |
| US20150325717A1 (en) * | 2012-08-06 | 2015-11-12 | Dow Global Technologies Llc | High reliability photo-voltaic device |
| RU2520239C1 (ru) * | 2012-12-28 | 2014-06-20 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский технологический университет "МИСиС" | Способ получения тонкопленочных полимерных нанокомпозиций для сверхплотной магнитной записи информации |
| CN105885474B (zh) * | 2015-07-16 | 2017-09-08 | 国网浙江省电力公司湖州供电公司 | 一种碳黑静电吸附碳纳米管导电填料的制备方法 |
| JP6039854B1 (ja) * | 2016-07-13 | 2016-12-07 | 名古屋メッキ工業株式会社 | 電気めっき方法、めっき装飾品、ゴルフボール及び支承治具 |
| US20190177858A1 (en) * | 2016-10-05 | 2019-06-13 | Hewlett-Packard Development Company, Lp. | Coating an alloy substrate |
| CN106604538A (zh) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | 一种柔性线路板及其制备方法 |
| US10763165B2 (en) * | 2017-04-18 | 2020-09-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive powder formation method, device for forming conductive powder, and method of forming semiconductor device |
| CN110158132A (zh) * | 2018-02-13 | 2019-08-23 | 华瑞墨石丹阳有限公司 | 一种绝缘材料的电镀方法 |
| EP4103422A1 (en) * | 2020-02-10 | 2022-12-21 | Deiana, Roberto | Production of plastic touch controls using laser-etched conductive layers |
| AU2021329906A1 (en) | 2020-08-18 | 2023-04-27 | Enviro Metals, LLC | Metal refinement |
| CN115394469B (zh) * | 2022-09-19 | 2025-02-14 | 常州聚和新材料股份有限公司 | 一种太阳能电池正面银浆用改性玻璃粉及其制法与应用 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1095117A (en) * | 1963-12-26 | 1967-12-13 | Matsushita Electric Industrial Co Ltd | Method of making printed circuit board |
| DE2528000B2 (de) * | 1975-06-24 | 1979-12-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung einer Lötfläche relativ großer Abmessungen |
| FR2397469A1 (fr) * | 1977-02-22 | 1979-02-09 | Panoduz Anstalt | Procede pour deposer une couche de metal conducteur sur un support isolant |
| JPS53113232A (en) * | 1977-03-15 | 1978-10-03 | Shiyouzou Fukuda | Preparation of colored metal film |
| US4417296A (en) * | 1979-07-23 | 1983-11-22 | Rca Corp | Method of connecting surface mounted packages to a circuit board and the resulting connector |
| JPS5880892A (ja) * | 1981-11-09 | 1983-05-16 | セイコーインスツルメンツ株式会社 | 回路基板の導電パタ−ン形成方法 |
| JPS5895892A (ja) * | 1981-12-02 | 1983-06-07 | 住友ベークライト株式会社 | 回路板作成方法 |
| US4737446A (en) * | 1986-12-30 | 1988-04-12 | E. I. Du Pont De Nemours And Company | Method for making multilayer circuits using embedded catalyst receptors |
| US5109269A (en) * | 1991-07-08 | 1992-04-28 | Ofer Holzman | Method and means for positioning surface mounted electronic components on a printed wiring board |
| JP3528924B2 (ja) * | 1993-01-22 | 2004-05-24 | ソニー株式会社 | プリント配線板及びその製造方法 |
| JPH08127894A (ja) * | 1994-10-28 | 1996-05-21 | Toyoda Gosei Co Ltd | 樹脂製品の部分めっき方法 |
| JP3686527B2 (ja) * | 1997-04-25 | 2005-08-24 | 富士重工業株式会社 | 炭素繊維強化プラスチックの金属被覆方法 |
| GB2336161B (en) * | 1998-04-06 | 2003-03-26 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| KR20080024239A (ko) * | 1998-09-17 | 2008-03-17 | 이비덴 가부시키가이샤 | 다층빌드업배선판 |
| JP4355436B2 (ja) * | 2000-10-25 | 2009-11-04 | 森村ケミカル株式会社 | 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法 |
| JP2002356782A (ja) * | 2001-03-26 | 2002-12-13 | Nippon Paint Co Ltd | 金属パターンの形成方法 |
| DE10145749A1 (de) * | 2001-09-17 | 2003-04-24 | Infineon Technologies Ag | Verfahren zur Herstellung einer strukturierten Metallschicht auf einem Trägerkörper und Trägerkörper mit einer strukturierten Metallschicht |
| DE10254927B4 (de) * | 2002-11-25 | 2012-11-22 | Infineon Technologies Ag | Verfahren zur Herstellung von leitfähigen Strukturen auf einem Träger und Verwendung des Verfahrens |
| JP4420626B2 (ja) * | 2003-06-06 | 2010-02-24 | 株式会社秀峰 | 印刷または塗布画像作成方法 |
| JP4166686B2 (ja) * | 2003-12-26 | 2008-10-15 | 株式会社東芝 | 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 |
| TW200521171A (en) * | 2003-12-26 | 2005-07-01 | Toshiba Kk | Resin particles and resin layer containing metal micro particles, its forming method and circuit base board |
| JP2005303090A (ja) * | 2004-04-13 | 2005-10-27 | Toshiba Corp | 配線基板および配線基板の製造方法 |
| JP2006128228A (ja) * | 2004-10-26 | 2006-05-18 | Seiko Epson Corp | 導電膜の形成方法、配線基板、電子デバイスおよび電子機器 |
-
2007
- 2007-06-11 EP EP07765353A patent/EP2033501A1/de not_active Withdrawn
- 2007-06-11 JP JP2009514770A patent/JP2009539593A/ja active Pending
- 2007-06-11 CN CN2007800266427A patent/CN101491166B/zh not_active Expired - Fee Related
- 2007-06-11 CA CA002654797A patent/CA2654797A1/en not_active Abandoned
- 2007-06-11 BR BRPI0712709-0A patent/BRPI0712709A2/pt not_active IP Right Cessation
- 2007-06-11 KR KR1020097000744A patent/KR20090025337A/ko not_active Ceased
- 2007-06-11 RU RU2009100627/07A patent/RU2436266C2/ru not_active IP Right Cessation
- 2007-06-11 US US12/304,528 patent/US20090285976A1/en not_active Abandoned
- 2007-06-11 WO PCT/EP2007/055701 patent/WO2007144322A1/de not_active Ceased
- 2007-06-14 TW TW096121489A patent/TW200806127A/zh unknown
-
2008
- 2008-12-01 IL IL195620A patent/IL195620A0/en unknown
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